676 Field Programmable Gate Arrays (FPGA) 1,111

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV600E-7FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	400 MHz	30 s	444	225 °C (437 °F)	27 mm
XQ5VLX110-2EF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640	CMOS	440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676		3 mm	27 mm	No		e0	1265 MHz		440		27 mm
XC6SLX75-1LFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	500 MHz				27 mm
XC5VLX30-1FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.9 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC5VLX85-3FF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	6480	Yes			CMOS	560			1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	710 MHz	30 s	560	225 °C (437 °F)
XC7K325T-L2FFV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		3.37 mm	27 mm			e1					27 mm
XC3S700AN-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS		700000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	667 MHz				27 mm
XC5VLX110-1FFV676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		440		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	440	250 °C (482 °F)	27 mm
XC7K160T-L2FFV676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V	12675				.9		Grid Array			.87 V	1 mm		0.91 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		3.37 mm	27 mm			e1					27 mm
XC4VLX25-11FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VSX35-11FF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	34560	Yes			CMOS	448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4			No		e0		30 s	448	225 °C (437 °F)
XC6SLX100T-3NFGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XC4VSX25-11FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	23040	Yes			CMOS	320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0		30 s	320	225 °C (437 °F)
XC3S1000-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	1920 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	630 MHz	30 s	391	260 °C (500 °F)	27 mm
XC7S75-1FGGA676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	6000 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B676		2.44 mm	27 mm			e3	1098 MHz		400		27 mm
XC6SLX100T-4FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS	376			1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s	376	250 °C (482 °F)	27 mm
XC2S300E-6FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	1536 CLBS, 93000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 300000	e0	357 MHz				27 mm
XC3S700AN-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS		700000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	1472 CLBS, 700000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	667 MHz				27 mm
XC2VP40-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1200 MHz	30 s	416	250 °C (482 °F)	27 mm
XCE7K410T-2FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		3.37 mm	27 mm						400		27 mm
XC6SLX150-2FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	498		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	498	225 °C (437 °F)	27 mm
XCV400-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	2.625 V	2400	CMOS		468252	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	2400 CLBS, 468252 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	333 MHz	30 s		250 °C (482 °F)	27 mm
XC7K70T-2FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	5125				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XCE7K325T-2FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.54 mm	27 mm								27 mm
XCKU3P-L1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340		304		0.72		Grid Array	BGA676,26X26,40		.698 V	1 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XC3S50AN-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS		50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	770 MHz	30 s		250 °C (482 °F)	27 mm
XC2V2000-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	650 MHz	30 s	456	250 °C (482 °F)	27 mm
XC7K325T-1FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS	400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1818 MHz		400
XC6SLX100-L1FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911	CMOS	480		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s	480	250 °C (482 °F)	27 mm
XC2S400E-7FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	864	CMOS	410	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	410	225 °C (437 °F)	27 mm
XC7K160T-1FFV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	12675				1		Grid Array			.97 V	1 mm		0.74 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		3.37 mm	27 mm			e1					27 mm
XC2S50E-6FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	384			23000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	384 CLBS, 23000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 50000	e0	357 MHz				27 mm
XC3S50-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0					27 mm
XQ6SLX75-L1FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	408			1,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	3			No		e0	500 MHz	30 s	408	225 °C (437 °F)
XCE7K325T-L2FFV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS			Bottom	S-PBGA-B676		3.37 mm	27 mm								27 mm
XC7K410T-2FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		3.37 mm	27 mm			e1					27 mm
XCKU040-3FBVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm			e1		30 s	520	250 °C (482 °F)	27 mm
XCKU035-L1FBVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.927 V	1700		520		.9	0.9 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	520	250 °C (482 °F)	27 mm
XC2V2000-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	820 MHz	30 s	456	225 °C (437 °F)	27 mm
XQKU040-1RBA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	.979 V	30300				.95		Grid Array			.922 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B676	4	3.44 mm	27 mm			e0		5 s		250 °C (482 °F)	27 mm
XC2V2000-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	750 MHz	30 s	456	225 °C (437 °F)	27 mm
XC5VLX50-2FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	440	250 °C (482 °F)	27 mm
XCE7K410T-2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC3S1000-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		391		27 mm
XC7K325T-1LFFG676E	Xilinx	FPGA		Ball	676			Plastic/Epoxy		Yes								Grid Array									Tin Silver Copper	Bottom		4			No		e1		30 s		250 °C (482 °F)
XC4VLX40-10FF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	41472	Yes			CMOS	448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0		30 s	448	225 °C (437 °F)
XQ6SLX75T-2FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	348			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	3			No		e0	667 MHz	30 s	348	225 °C (437 °F)
XC2VP40-6FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.32 ns	4848 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	416	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.