676 Field Programmable Gate Arrays (FPGA) 1,111

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2V3000-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	750 MHz	30 s	484	225 °C (437 °F)	27 mm
XA6SLX45-2FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	358			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	3			No		e1	667 MHz	30 s	358	250 °C (482 °F)
XCE7K325T-3FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1		Grid Array			.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC3S1500L-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes		3328	CMOS		487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0			487		27 mm
XCE7K410T-1FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC7K325T-L2FF676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS		400			0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1286 MHz		400
XCE7K410T-L2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.97 V	31775	HKMG		400		.95		Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XCV400E-8FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	2400 CLBS, 129600 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	27 mm
XC7K410T-1FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775					1		Grid Array			.97 V	1 mm		0.74 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC4VLX15-11FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		320		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0	1205 MHz	30 s	320	225 °C (437 °F)	27 mm
XCE7K325T-L2FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V	25475					.9		Grid Array			.87 V	1 mm		0.91 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC2V3000-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	820 MHz	30 s	484	250 °C (482 °F)	27 mm
XC4VLX15-10FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS		320		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			1536 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC7K410T-1LFFG676E	Xilinx	FPGA		Ball	676			Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No		e1		30 s		250 °C (482 °F)
XC3S700AN-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	1472 CLBS, 700000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	27 mm
XQKU5P-2FFRB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		MIL-PRF-38535	304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.67 mm	27 mm			e0		20 s	304	225 °C (437 °F)	27 mm
XC2S50E-7FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	384				23000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 50000	e0	400 MHz				27 mm
XC3S700AN-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	770 MHz	30 s		250 °C (482 °F)	27 mm
XC7K160T-2FB676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	400	225 °C (437 °F)
XC7A75T-3FGG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS		300		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1412 MHz	30 s	300	250 °C (482 °F)	27 mm
XC3S1000-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	630 MHz	30 s	391	260 °C (500 °F)	27 mm
XC6SLX75-3NFGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	27 mm
XC6SLX45-L1FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411	CMOS		358		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s	358	250 °C (482 °F)	27 mm
XC5VLX30-3FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			400		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	400	250 °C (482 °F)	27 mm
XC5VLX50-2FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			440		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	440	250 °C (482 °F)	27 mm
XC6SLX150T-N3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		396		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	396	225 °C (437 °F)	27 mm
XC2VP30-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	3424 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1050 MHz	30 s	416	250 °C (482 °F)	27 mm
XC7K325T-2LFBG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	.93 V	25475			250		0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s	250	250 °C (482 °F)	27 mm
XC7K325T-2LFFG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	.93 V	25475			250		0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	250	250 °C (482 °F)	27 mm
XC6SLX100T-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS		376			1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s	376	250 °C (482 °F)	27 mm
XC2VP40-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1050 MHz	30 s	416	250 °C (482 °F)	27 mm
XC7K325T-3FB676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	400	225 °C (437 °F)
XQ7A200T-1RB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.35 mm	27 mm	No		e0	1098 MHz	30 s	400	225 °C (437 °F)	27 mm
XCE7K410T-3FBV676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	31775 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.54 mm	27 mm						400		27 mm
XCV800-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		444	888439	2.5	1.2/3.6,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.8 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	250 MHz	30 s	444	225 °C (437 °F)	27 mm
XC5VLX30-1FF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			400		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	2400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	400	225 °C (437 °F)	27 mm
XC7K410T-2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775					1		Grid Array			.97 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC7A200T-1FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825					1		Grid Array			.95 V	1 mm		1.27 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XCV405E-6FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS			129600	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 129600 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	357 MHz	30 s		250 °C (482 °F)	27 mm
XC2V3000-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	750 MHz	30 s	484	250 °C (482 °F)	27 mm
XC7K160T-2FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	12675					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XCV800-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		444	888439	2.5	1.2/3.6,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	294 MHz	30 s	444	225 °C (437 °F)	27 mm
XC6SLX100-N3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	480	225 °C (437 °F)	27 mm
XC4VLX25-11FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS		448		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2688 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XC7Z045-L1FBG676I	Xilinx	FPGA SOC		Ball	676	BGA	Square	Plastic/Epoxy	350000	Yes	1.05 V	27325			380	5200000	1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)		27325 CLBS, 5200000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1			380		27 mm
XC7K410T-2FB676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	400	225 °C (437 °F)
XC7K70T-L2FB676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic	65600	Yes			CMOS		185			0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1286 MHz	30 s	185	225 °C (437 °F)
XC5VLX50-2FF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	440	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.