676 Field Programmable Gate Arrays (FPGA) 1,111

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7K410T-L2FBV676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V	31775					.9		Grid Array			.87 V	1 mm		0.91 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC6SLX150T-2FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		396		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	396	225 °C (437 °F)	27 mm
XC5VLX85-3FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480			440		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	6480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	440	250 °C (482 °F)	27 mm
XC4VFX12-11FF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS		320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4			No		e0		30 s	320	225 °C (437 °F)
XC6SLX150-3NFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	806 MHz				27 mm
XC7K325T-1FFV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		3.37 mm	27 mm			e1					27 mm
XC6SLX100-2FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	480	225 °C (437 °F)	27 mm
XCE7K325T-1FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.54 mm	27 mm								27 mm
XC4VLX60-11FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS		448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4			No		e0		30 s	448	225 °C (437 °F)
XC5VLX50-2FFV676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600			440		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	440	250 °C (482 °F)	27 mm
XC7K410T-L2FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775	CMOS		400		.9	0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No	Also Operates at 1 V supply	e1		30 s	400	250 °C (482 °F)	27 mm
XC2VP30-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1050 MHz	30 s	416	225 °C (437 °F)	27 mm
XC4VSX35-10FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	34560	Yes			CMOS		448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	448	250 °C (482 °F)
XC7A200T-3FBV676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825					1		Grid Array			.95 V	1 mm		0.94 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC7K70T-2LFBG676C	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	65600		1.03 V	5125	HKMG		100		0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	85 °C (185 °F)	0.91 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	100	250 °C (482 °F)	27 mm
XC6SLX100-N3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	480	250 °C (482 °F)	27 mm
XCKU3P-L1FFVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340			304		0.72		Grid Array	BGA676,26X26,40		.698 V	1 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XC7K70T-3FB676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic	65600	Yes			CMOS		185			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	185	225 °C (437 °F)
XC5VLX110-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	440	250 °C (482 °F)	27 mm
XC4VSX25-12FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	23040	Yes			CMOS		320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	4			No		e1		30 s	320	250 °C (482 °F)
XC6SLX100T-3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		376		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	862 MHz	30 s	376	225 °C (437 °F)	27 mm
XCE7K325T-L2FFV676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V	25475					.9		Grid Array			.87 V	1 mm		0.91 ns	25475 CLBS			Bottom	S-PBGA-B676		3.37 mm	27 mm								27 mm
XCV405E-7FGG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS			129600	1.8		Grid Array			1.71 V	1 mm	70 °C (158 °F)	0.42 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	400 MHz	30 s		250 °C (482 °F)	27 mm
XC6SLX150-L1FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS		498		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		30 s	498	225 °C (437 °F)	27 mm
XC7K410T-1LFBG676C	Xilinx	FPGA		Ball	676			Plastic/Epoxy		Yes									Grid Array									Tin Silver Copper	Bottom		4			No		e1
XC3S1500-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		487		27 mm
XA3SD3400A-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes		5968	CMOS	AEC-Q100	469	53712		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm			5968 CLBS, 53712 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	667 MHz	30 s	409	260 °C (500 °F)	27 mm
XC7K160T-1FBG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V						1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1					27 mm
XCV600-6FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS		444	661111	2.5	1.2/3.6,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.6 ns	3456 CLBS, 661111 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	333 MHz	30 s	444	225 °C (437 °F)	27 mm
XCE7K410T-2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG		400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC7Z045-L1FFG676I	Xilinx	FPGA SOC		Ball	676	BGA	Square	Plastic/Epoxy	350000	Yes	1.05 V	27325			380	5200000	1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)		27325 CLBS, 5200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	380	250 °C (482 °F)	27 mm
XC2V3000-6FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	820 MHz	30 s	484	225 °C (437 °F)	27 mm
XC6SLX45-N3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		358		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	358	225 °C (437 °F)	27 mm
XC2S200E-6FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC3SD1800A-4FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		519	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	250 MHz		409		27 mm
XC7K325T-1FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475					1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC2S400E-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		410	145000	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 145000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 400000	e0	357 MHz	30 s	410	225 °C (437 °F)	27 mm
XC7K70T-3FBV676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	5125					1		Grid Array			.97 V	1 mm		0.58 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC7K325T-2LFFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	.93 V						0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC7K410T-3FF676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS		400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1818 MHz		400
XC6SLX75T-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		320		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	320	250 °C (482 °F)	27 mm
XC2S100E-6FGG676I	Xilinx	FPGA		B	676	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	Maximum usable gates = 150000	e1	357 MHz				27 mm
XC2VP40-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1050 MHz	30 s	416	250 °C (482 °F)	27 mm
XC7K325T-L2FBG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	.93 V	25475	CMOS		400		.9	0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No	Also Operates at 1 V supply	e1		30 s	400	250 °C (482 °F)	27 mm
XCKU040-L1FBVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	.927 V	1920			520		.9	0.9 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		1920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	520	250 °C (482 °F)	27 mm
XC3S200-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s		260 °C (500 °F)	27 mm
XC6SLX75-L1FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831	CMOS		400		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		30 s	400	225 °C (437 °F)	27 mm
XCKU3P-2FFVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340			304		0.85		Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.