676 Field Programmable Gate Arrays (FPGA) 1,111

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3SD3400A-4FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	469	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	250 MHz		409		27 mm
XQ5VLX85-2EF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480	CMOS	440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676		3 mm	27 mm	No		e0	1265 MHz		440		27 mm
XC6SLX150T-4FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	396			1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s	396	250 °C (482 °F)	27 mm
XQ7K410T-L2RF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic	406720	Yes	1.05 V	31775	HKMG	400		1	1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.61 ns		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B676	4		27 mm	No		e0	1286 MHz		400		27 mm
XCE7K325T-2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.61 ns	25475 CLBS			Bottom	S-PBGA-B676		2.54 mm	27 mm								27 mm
XCV800-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS		888439	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	27 mm
XC7K325T-2FF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B676		3.37 mm	27 mm	No		e0	1818 MHz		400		27 mm
XC2V1500-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS	392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	820 MHz	30 s	392	225 °C (437 °F)	27 mm
XQ7K410T-1RF676M	Xilinx	FPGA	Military	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	400		1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	31775 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e0		30 s	400	225 °C (437 °F)	27 mm
XC6SLX100-N3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	480		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	480	250 °C (482 °F)	27 mm
XC7K410T-1FFG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
XC4VLX60-12FF676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	59904	Yes			CMOS	448				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	4			No		e0		30 s	448	225 °C (437 °F)
XQ6SLX150-2FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	498			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3			No		e0	667 MHz	30 s	498	225 °C (437 °F)
XC2V3000-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	750 MHz	30 s	484	250 °C (482 °F)	27 mm
XCV600E-7FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	400 MHz	30 s	444	225 °C (437 °F)	27 mm
XC4VFX12-11FFG676C	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	12312	Yes			CMOS	320				Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4			No		e1		30 s	320	250 °C (482 °F)
XC5VLX30-3FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		400		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC3S400AN-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	896	CMOS		400000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	896 CLBS, 400000 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	27 mm
XCV800-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS		888439	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.7 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	294 MHz	30 s		250 °C (482 °F)	27 mm
XCV400E-6FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	2400 CLBS, 129600 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	357 MHz	30 s	404	225 °C (437 °F)	27 mm
XC6SLX75-3NFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	806 MHz				27 mm
XC2V3000-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	650 MHz	30 s	484	225 °C (437 °F)	27 mm
XC2S150E-6FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e0	357 MHz				27 mm
XC6SLX75-1LFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	500 MHz				27 mm
XC2S150E-7FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 150000	e0	357 MHz				27 mm
XC6SLX75-1LFGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	500 MHz	30 s		250 °C (482 °F)	27 mm
XQ6SLX75T-2FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	348			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	3			No		e1	667 MHz	30 s	348	250 °C (482 °F)
XC6SLX75-1LFGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	500 MHz	30 s		250 °C (482 °F)	27 mm
XC2S300E-7FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	1536			93000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	Maximum usable gates = 300000	e1	400 MHz				27 mm
XC7K325T-1FF676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS	400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1818 MHz		400
XC5VLX50-1FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		440		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.9 ns	3600 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		3 mm	27 mm						440		27 mm
XC6SLX100T-N3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	376		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	376	225 °C (437 °F)	27 mm
XC3S1400A-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	502	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz		408		27 mm
XC7K325T-2FB676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e0	1818 MHz	30 s	400	225 °C (437 °F)	27 mm
XC7Z035-L1FBG676I	Xilinx	FPGA SOC		Ball	676	BGA	Square	Plastic/Epoxy	275000	Yes	1.05 V	21487		380	4100000	1		Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	21487 CLBS, 4100000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s	380	250 °C (482 °F)	27 mm
XC7K410T-2FB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS	400			1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	400	225 °C (437 °F)
XCE7K410T-1FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	31775 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	400	250 °C (482 °F)	27 mm
XC3S200AN-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS		200000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	27 mm
XC3S4000-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	489	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	725 MHz	30 s	489	260 °C (500 °F)	27 mm
XQ6SLX150T-2FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	396			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	3			No		e1	667 MHz	30 s	396	250 °C (482 °F)
XC5VLX110-3FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	8640	Yes			CMOS	800			1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B676	4			No		e1	710 MHz	30 s	800	250 °C (482 °F)
XC6SLX75T-4FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS	348			1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s	348	250 °C (482 °F)	27 mm
XC7K160T-1FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	12675				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XCE7K325T-1FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC6SLX100-L1FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911	CMOS	480		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		30 s	480	225 °C (437 °F)	27 mm
XC7K325T-1LFBG676C	Xilinx	FPGA		Ball	676			Plastic/Epoxy		Yes								Grid Array									Tin Silver Copper	Bottom		4			No		e1		30 s		250 °C (482 °F)
XC7K325T-L2FB676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS	400			0.9,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1286 MHz	30 s	400	225 °C (437 °F)
XC5VLX110-3FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		440		1		Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm			e1		30 s	440	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.