780 Field Programmable Gate Arrays (FPGA) 1,765

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AX048E2F29E2LG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP2AGX65DF29C5

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

60214

Yes

CMOS

364

0.9,1.2/3.3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

20 s

364

220 °C (428 °F)

5AGZME3H2F29C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3.6 mm

33 mm

e1

670 MHz

33 mm

EP4SGX70DF29C4

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

72600

Yes

CMOS

372

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

20 s

372

220 °C (428 °F)

EP3CLS70F780C8N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

70208

Yes

1.25 V

70208

CMOS

413

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

70208 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e1

450 MHz

30 s

413

260 °C (500 °F)

29 mm

5AGZME1K3F29I3L

Altera

FPGA

Industrial

No Lead

780

BGA

Square

Plastic/Epoxy

220000

Yes

1.18 V

8302

TSMC

342

1.15

Grid Array

BGA780,28X28,40

1.12 V

1 mm

100 °C (212 °F)

8302 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

342

33 mm

EP3SE50F780C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

29 mm

10AX027E2F29E2SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP4CE75F29C8L

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

75408

Yes

1.03 V

4713

429

1

1,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

4713 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

362 MHz

20 s

429

220 °C (428 °F)

29 mm

10AX027E3F29E2LP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP2AGX95FF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP1S40F780I6ES

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

5AGZME3E2F29I3N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

3.6 mm

33 mm

e1

670 MHz

33 mm

EP1AGX20CF780I6N

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.25 V

21580

230

1.2

1.2,2.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

21580 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e1

640 MHz

30 s

230

245 °C (473 °F)

29 mm

EP2AGX125CF29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

118143

Yes

.93 V

4964

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

4964 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP3SE260H780C4LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.5 mm

33 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

33 mm

5AGZME3E2F29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3.6 mm

33 mm

e0

670 MHz

33 mm

10AS048E2F29E1SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

10AX027E5F29E3SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

5SGXMA3E2H29C2LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP2AGZ350CF29C4N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

10AS027E2F29I1LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AX027E2F29I2LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP3CLS70F780I7

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

70208

Yes

1.25 V

70208

CMOS

413

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

70208 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

450 MHz

20 s

413

220 °C (428 °F)

29 mm

10AX032E1F29I1SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AX032E4F29E3LP

Altera

FPGA

Ball

780

BGA

Square

Plastic

320000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP2AGZ300CF29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

11920 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

5SGXMA3E3H29I3N

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

12830 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

5SGSMD3E3H29C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

236000

Yes

.88 V

8900

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

8900 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

10AX032E2F29I2LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP3SL70F780C4L

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

67500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

488

220 °C (428 °F)

29 mm

EP3CLS150F780C7N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

150848

Yes

1.25 V

150848

CMOS

413

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

150848 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e1

450 MHz

30 s

413

260 °C (500 °F)

29 mm

5SGXEA3E1H29I2N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

360

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP3C80F780I8N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

81264

Yes

1.25 V

CMOS

429

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

2.4 mm

29 mm

No

e1

429

29 mm

EP3SL110F780I4

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

107500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

488

220 °C (428 °F)

29 mm

EP3SL70F780C3N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

67500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

29 mm

EP4SGX360FH29C3N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

289

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

14144 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.4 mm

33 mm

No

e1

717 MHz

30 s

289

245 °C (473 °F)

33 mm

5SGXMA3E1H29C2L

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP3C55F780C6N

Altera

FPGA

Other

Ball

780

BGA

Rectangular

Plastic/Epoxy

55856

Yes

1.25 V

55856

CMOS

377

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

55856 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

R-PBGA-B780

3

3.5 mm

29 mm

No

e1

472.5 MHz

30 s

377

260 °C (500 °F)

29 mm

EP2AGZ350EF29C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

348500

Yes

.93 V

13940

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

13940 CLBs

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

5AGZME3H2F29I3N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

3.6 mm

33 mm

e1

670 MHz

33 mm

EP3C55F780A7N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

55856

Yes

CMOS

377

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper

Bottom

S-PBGA-B780

No

e1

377

EP1AGX35DF780C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.25 V

33520

341

1.2

1.2,2.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

33520 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e0

640 MHz

20 s

341

220 °C (428 °F)

29 mm

EP2AGX65EF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3CLS150F780C8

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

150848

Yes

1.25 V

150848

CMOS

413

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

150848 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

450 MHz

20 s

413

220 °C (428 °F)

29 mm

10AS022E3F29E1LG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP2AGX260FF29I5

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

244188

Yes

.93 V

10260

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

10260 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

5SGXEA3E2H29C1N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

360

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.