780 Field Programmable Gate Arrays (FPGA) 1,765

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP2AGX45HF29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

42959

Yes

.93 V

1805

364

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

1805 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.7 mm

29 mm

e0

364

29 mm

EP2AGX95FF29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

89178

Yes

.93 V

3747

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

3747 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP2AGX95EF29I5

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

89178

Yes

CMOS

372

0.9,1.2/3.3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

20 s

372

220 °C (428 °F)

EP2AGX260FF29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

244188

Yes

.93 V

10260

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

10260 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP3SE50F780I4N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

29 mm

EP2AGZ350FF29C3N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3C80F780I6N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

81264

Yes

1.25 V

CMOS

429

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

2.4 mm

29 mm

No

e1

429

29 mm

EP4SE230F29M3

Altera

FPGA

Military

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

9120

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

125 °C (257 °F)

9120 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

4

3.5 mm

29 mm

717 MHz

29 mm

EP2AGX45DF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

42959

Yes

.93 V

CMOS

364

.9

0.9,1.2/3.3,1.5,2.5 V

Grid Array, Heat Sink/Slug

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.7 mm

29 mm

No

e1

500 MHz

30 s

364

250 °C (482 °F)

29 mm

EP4SGX230DF29C3N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

CMOS

372

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

4

No

e1

30 s

372

245 °C (473 °F)

EP1S20F780I6

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

18460

Yes

1.575 V

2132

CMOS

586

1.5

1.5,1.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.425 V

1 mm

2132 CLBS

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e0

20 s

586

220 °C (428 °F)

29 mm

EP2AGX125DF29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

118143

Yes

.93 V

4964

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

4964 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP3SE260F780C3

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

100 MHz

480

EP3SL50F780I2

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

10AX016E5F29I3SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

5AGZME3K2F29C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3.6 mm

33 mm

e1

670 MHz

33 mm

10AX032E5F29E3SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AS032E2F29E1SP

Altera

FPGA

Ball

780

BGA

Square

Plastic

320000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

5SGSMD4E1H29C2LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

360000

Yes

.88 V

13584

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP2AGZ300DF29C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

11920 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

5SGSMD3E3H29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

236000

Yes

.88 V

8900

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

8900 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP2AGX65CF29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

60214

Yes

.93 V

2530

364

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

2530 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.7 mm

29 mm

e0

364

29 mm

5SGSMD4E2H29C2LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

360000

Yes

.88 V

13584

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

10AX022E5F29E3SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

5AGZME1E2F29I3

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

3.6 mm

33 mm

e0

670 MHz

33 mm

10AX048E4F29E3LP

Altera

FPGA

Ball

780

BGA

Square

Plastic

480000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP2AGX190FF29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

181165

Yes

.93 V

7612

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

7612 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP1AGX90EF780C6N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.25 V

90220

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

90220 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

29 mm

No

29 mm

5SGSMD4E3H29C2N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

360000

Yes

.93 V

13584

CMOS

360

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP2SGX30DF780C3N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

33880

Yes

1.25 V

33880

CMOS

361

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

4.45 ns

33880 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e1

717 MHz

30 s

361

245 °C (473 °F)

29 mm

EP3SE80F780C2L

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

80000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

5AGZME1K3F29I3

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

3.6 mm

33 mm

e0

670 MHz

33 mm

5AGZME3H2F29I3

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

3.6 mm

33 mm

e0

670 MHz

33 mm

EP1S20F780C6ES

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

No

e0

EP3SE260H780I3N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.5 mm

33 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

33 mm

10AX032E1F29E1SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP2AGX125EF29

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

Bottom

S-PBGA-B780

2.6 mm

29 mm

29 mm

EP2AGX125FF29C6N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

10AX022E3F29E1MG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP3C40F780A7N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

39600

Yes

CMOS

535

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper

Bottom

S-PBGA-B780

No

e1

535

EP1S30F780I6N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

32470

Yes

1.575 V

3819

CMOS

726

1.5

1.5,1.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.425 V

1 mm

3819 CLBS

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e1

40 s

726

245 °C (473 °F)

29 mm

10AS016E3F29I2LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

160000

Yes

.93 V

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

288

29 mm

10AS032E4F29E3LG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

10AS016E3F29E2LP

Altera

FPGA

Ball

780

BGA

Square

Plastic

160000

Yes

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

288

EP3SL200F780C2N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

200000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

480

EP2AGX125CF29I3N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3SL110F780I2LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

107500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

EP2AGX65DF29I3N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

60214

Yes

.93 V

CMOS

364

.9

0.9,1.2/3.3,1.5,2.5 V

Grid Array, Heat Sink/Slug

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

No

e1

500 MHz

364

29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.