780 Field Programmable Gate Arrays (FPGA) 1,765

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP4SE230F29C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

CMOS

488

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

9120 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.4 mm

29 mm

No

e1

717 MHz

30 s

488

245 °C (473 °F)

29 mm

EP2AGX125HF29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

118143

Yes

.93 V

4964

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

4964 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

10AX027E1F29I1LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP3SE260F780C4

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

100 MHz

480

5SGXEA3E2H29I3N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

360

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP1AGX35DF780C6N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.25 V

33520

341

1.2

1.2,2.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

33520 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e1

640 MHz

30 s

341

245 °C (473 °F)

29 mm

10AX016E4F29I3LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

160000

Yes

.93 V

6151

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

6151 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

288

29 mm

10AS027E1F29E1SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AS027E5F29E3SG

Altera

FPGA

Ball

780

BGA

Square

Plastic

270000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP4SGX230DF29C4ES

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

9120

.9

Grid Array

.87 V

1 mm

85 °C (185 °F)

9120 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

4

3.5 mm

29 mm

No

e0

717 MHz

29 mm

EP4SE230F29C2N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

CMOS

488

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

9120 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.4 mm

29 mm

No

e1

800 MHz

30 s

488

245 °C (473 °F)

29 mm

EP3C55F780C8

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

55856

Yes

1.25 V

55856

CMOS

377

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

55856 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

472.5 MHz

20 s

377

220 °C (428 °F)

29 mm

5SGXEA3E1H29C2

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

360

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

5SGSMD3E2H29C2LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

236000

Yes

.88 V

8900

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

8900 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP3SL110F780I2

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

107500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

10AS016E5F29E3SP

Altera

FPGA

Ball

780

BGA

Square

Plastic

160000

Yes

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

288

EP3SL200F780C4LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

200000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

480

EP2AGX45EF29I5

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

42959

Yes

.93 V

1805

364

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

1805 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.7 mm

29 mm

e0

364

29 mm

EP2AGX95HF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3SL50F780C3L

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

EP2AGX65FF29C5

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

60214

Yes

.93 V

2530

364

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

2530 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.7 mm

29 mm

e0

364

29 mm

10AX032E4F29E3LG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP2AGZ350FF29I4N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

10AS027E2F29I1SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AS048E1F29I1LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP4SGX230DF29C3ES

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

9120

.9

Grid Array

.87 V

1 mm

85 °C (185 °F)

9120 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

4

3.5 mm

29 mm

No

e0

717 MHz

29 mm

EP2AGZ350EF29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

348500

Yes

.93 V

13940

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

13940 CLBs

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

10AS027E1F29E1SP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

5SGSMD4E1H29C2L

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

360000

Yes

.88 V

13584

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

5SGSMD3E3H29C2L

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

236000

Yes

.88 V

8900

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

8900 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP2AGZ350DF29C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

348500

Yes

.93 V

13940

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

13940 CLBs

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

EP4SGX290FH29C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

291200

Yes

.93 V

11648

CMOS

289

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

11648 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

4

3.4 mm

33 mm

No

e0

717 MHz

20 s

289

220 °C (428 °F)

33 mm

EP2AGX190DF29C5N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP2AGX190HF29C5N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

10AX027E3F29I2LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP3C40F780I8

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

CMOS

535

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

2.4 mm

29 mm

No

e0

535

29 mm

10AX032E3F29I2LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP1S40F780I7ES

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

5SGXMA3E1H29C1

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

.93 V

12830

CMOS

360

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

10AS048E2F29E2LG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP1S30F780I5ES

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

10AS048E4F29I3LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

18359

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

18359 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP1S30F780I7

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

32470

Yes

1.575 V

CMOS

726

1.5

1.5,1.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.425 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

726

220 °C (428 °F)

10AX016E5F29I3SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP4CE115F29C9LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

114480

Yes

1.03 V

7155

531

1

1,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

7155 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e1

265 MHz

30 s

531

260 °C (500 °F)

29 mm

10AX027E1F29I1SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP4CE30F29C7

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

28848

Yes

1.25 V

1803

535

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

1803 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

472.5 MHz

20 s

535

220 °C (428 °F)

29 mm

10AS032E2F29E2SP

Altera

FPGA

Ball

780

BGA

Square

Plastic

320000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.