780 Field Programmable Gate Arrays (FPGA) 1,765

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP4CE30F29I7	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	28848	Yes	1.25 V	1803		535	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm			1803 CLBS		Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz	20 s	535	220 °C (428 °F)	29 mm
EP4SGX110DF29I4N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	105600	Yes	.93 V	4224	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			4224 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	3	3.3 mm	29 mm	No		e1	717 MHz	30 s	372	245 °C (473 °F)	29 mm
EP4SGX230DF29C3NES	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V	9120			.9		Grid Array			.87 V	1 mm	85 °C (185 °F)		9120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	4	3.5 mm	29 mm	No		e1	717 MHz				29 mm
10AX032E4F29E3SG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
5SGSMD4E3H29I3LN	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
EP2SGX30CF780C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	33880	CMOS	361	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	33880 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	717 MHz	20 s	361	220 °C (428 °F)	29 mm
10AS048E1F29I1SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP3C120F780A7	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	119088	Yes			CMOS	531		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					531
EP3SL150F780C4N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	29 mm
10AS022E3F29I1MG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
5SGXMA3E2H29I2L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V		CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm						Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
EP2AGX95CF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX95FF29I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP1S10F780I6ES	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B780				No		e0
10AS022E3F29E1LP	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP4CE75F29C8	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	4713		429	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		4713 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz	20 s	429	220 °C (428 °F)	29 mm
EP2SGX30CF780I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	33380	Yes	1.25 V	33880	CMOS	361	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.006 ns	33880 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e0	622.08 MHz		361		29 mm
5SGSMD4E2H29C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
EP4SGX230DF29C2XN	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		9120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	4	3.5 mm	29 mm	No		e1	800 MHz	30 s	372	245 °C (473 °F)	29 mm
EP2AGZ350FF29I4	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		13940 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
EP3SE80F780I2L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
10AS048E3F29I2LG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10AS027E3F29I2LG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP2AGX125FF29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		4964 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP3SE80F780C4L	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
EP3SL200H780C3L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	200000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
EP2AGX65HF29I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		364	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		2530 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.7 mm	29 mm			e0			364		29 mm
EP4SGX180DF29C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	175750	Yes	.93 V	7030	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		7030 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	4	3.5 mm	29 mm	No		e0	717 MHz	20 s	372	220 °C (428 °F)	29 mm
10AS032E2F29I2LG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP3CLS150F780	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	47			1.2		Grid Array			1.15 V	1 mm			47 CLBS			Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
EP2AGZ300CF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	298000	Yes	.93 V	11920		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		11920 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
EP2AGX45DF29C5	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	42959	Yes			CMOS	364		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	3			No		e0		20 s	364	220 °C (428 °F)
10AS027E5F29I3SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
5AGZME3E3F29I3LN	Altera	FPGA	Industrial	No Lead	780	BGA	Square	Plastic/Epoxy	360000	Yes	1.18 V	13584	TSMC	342	1.15		Grid Array	BGA780,28X28,40		1.12 V	1 mm	100 °C (212 °F)		13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm						342		33 mm
5AGZME1H2F29I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B780		3.6 mm	33 mm			e0	670 MHz				33 mm
10AS027E2F29E2SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	270000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
EP3SE260F780I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	255000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No			100 MHz		480
EP3SL110F780C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
EP2AGZ350FF29C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		13940 CLBs	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
5SGSMD4E2H29I2N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.93 V	13584	CMOS	360	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
EP2AGZ350EF29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		13940 CLBs	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
EP2AGX190DF29C6	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		7612 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP2AGX260FF29C5	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		10260 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
5AGZME1E2F29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		3.6 mm	33 mm			e0	670 MHz				33 mm
5SGSMD4E2H29I2L	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
EP3SE80F780I2LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
5SGSMD4E3H29C2LN	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AX048E4F29I3SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.