780 Field Programmable Gate Arrays (FPGA) 1,765

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10AS048E1F29E1MP	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP2AGX190HF29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		7612 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP2SGX60DF780I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2.99 ns	60440 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e0	622.08 MHz		364		29 mm
EP2AGX65HF29I5N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP4SE360H29I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	488	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			14144 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	4	3.4 mm	33 mm	No		e1	717 MHz	30 s	488	245 °C (473 °F)	33 mm
EP2AGX125EF29C6NES	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V	124100			.9		Grid Array			.87 V	1 mm	85 °C (185 °F)		124100 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.5 mm	29 mm	No			500 MHz				29 mm
EP3SE80F780C2	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	800 MHz	20 s	488	220 °C (428 °F)	29 mm
EP2AGX65FF29C6N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP3SL150F780C3L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
EP1S40F780C7N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		4697 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1		40 s	822	245 °C (473 °F)	29 mm
EP3SL200H780I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	200000	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B780	4	3.5 mm	33 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	33 mm
EP3SE110F780I2L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
EP4SGX110DF29I2X	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	105600	Yes	.93 V	4224		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		4224 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.3 mm	29 mm						372		29 mm
EP3SE50F780C3N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	29 mm
EP3SL200H780I2LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	200000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
5SGSMD3E3H29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	236000	Yes	.88 V	8900	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		8900 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AS027E3F29E2SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	270000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
5SGSMD4E3H29I3N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AX048E4F29I3SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP1S30F780C7ES	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780				No		e0
EP3C55F780I7	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	377	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		55856 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz	20 s	377	220 °C (428 °F)	29 mm
EP4SE360H29I4	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	488	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			14144 CLBS		Tin Lead	Bottom	S-PBGA-B780	4	3.4 mm	33 mm	No		e0	717 MHz	20 s	488	220 °C (428 °F)	33 mm
5SGSMD3E2H29I3L	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	236000	Yes	.88 V	8900	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		8900 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AX048E3F29E2SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	480000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
5SGXMA3E3H29C4N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
5SGXMA3E3H29I3LN	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		12830 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
EP2AGX260DF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		10260 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP2AGZ300FF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP3CLS200F780C8N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	198464	Yes	1.25 V	198464	CMOS	413	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		198464 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	450 MHz	30 s	413	260 °C (500 °F)	29 mm
EP2AGX190EF29C5	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	181165	Yes			CMOS	372		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	3			No		e0		20 s	372	220 °C (428 °F)
EP2AGX190FF29I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		7612 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
10AX027E3F29E2LG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP2AGZ300DF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
10AS016E3F29I1LP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP2AGX65EF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		364	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		2530 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.7 mm	29 mm			e0			364		29 mm
EP2AGX260EF29C6	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	244188	Yes			CMOS	372		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	3			No		e0		20 s	372	220 °C (428 °F)
EP4SGX70DF29I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			2904 CLBS		Tin Lead	Bottom	S-PBGA-B780	3	3.3 mm	29 mm	No		e0	717 MHz	20 s	372	220 °C (428 °F)	29 mm
EP2AGX125CF29I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		4964 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
10AS032E3F29I2SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10AX032E3F29I2SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP2AGZ300HF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
10AX027E2F29I1MP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP1S20F780I7	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V		CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B780	3			No		e0			586	220 °C (428 °F)
10AS022E4F29E3SG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V		CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
EP2AGZ300EF29C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	298000	Yes	.93 V	11920		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		11920 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
EP2AGX125EF29C4	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes			CMOS	372		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	3			No		e0		20 s	372	220 °C (428 °F)
EP4SGX360FH29I4	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	289	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			14144 CLBS		Tin Lead	Bottom	S-PBGA-B780	4	3.4 mm	33 mm	No		e0	717 MHz	20 s	289	220 °C (428 °F)	33 mm
EP2AGX45FF29C6N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.