780 Field Programmable Gate Arrays (FPGA) 1,765

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP1S30F780I6	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm			3819 CLBS		Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0		20 s	726	220 °C (428 °F)	29 mm
10AS027E2F29I1SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP2AGX45HF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX65FF29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		364	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		2530 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.7 mm	29 mm			e0			364		29 mm
10AS022E3F29I1MP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP2AGX190EF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy	181165	Yes	.93 V		CMOS	372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
5AGZME3E3H29I4N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584		342	0.85		Grid Array	BGA780,28X28,40		.82 V	1 mm	100 °C (212 °F)		13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm						342		33 mm
EP3C55F780I7N	Altera	FPGA	Industrial	Ball	780	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	377	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		55856 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	377	260 °C (500 °F)	29 mm
5SGSMD4E2H29C1N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.93 V	13584	CMOS	360	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AX032E1F29E1LG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP3SL70F780I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	29 mm
EP3SE80F780I4LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	29 mm
5SGSMD4E3H29C2L	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
EP2AGX125HF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
10AX016E3F29I1SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V		CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
EP2AGZ350DF29C3N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP4CE55F29I7N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		377	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm			3491 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz	30 s	377	260 °C (500 °F)	29 mm
EP2SGX30DF780I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	33380	Yes	1.25 V	33880	CMOS	361	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.006 ns	33880 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e0	622.08 MHz		361		29 mm
10AS027E2F29I1MP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
10AX048E2F29E1SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	480000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
EP2AGX95CF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP2AGX95DF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX125FF29I5N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX95DF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX190HF29I5N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP1S25F780I6N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm			2852 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1		40 s	706	245 °C (473 °F)	29 mm
EP2AGX190EF29C6N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	181165	Yes	.93 V		CMOS	372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz	30 s	372	250 °C (482 °F)	29 mm
5AGZME1E2F29I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B780		3.6 mm	33 mm			e1	670 MHz				33 mm
EP4SGX360FH29M3	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144		289	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)		14144 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.4 mm	33 mm						289		33 mm
EP2AGX45FF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		364	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.7 mm	29 mm			e0			364		29 mm
EP4SGX70DF29I4N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			2904 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	3	3.3 mm	29 mm	No		e1	717 MHz	30 s	372	245 °C (473 °F)	29 mm
5AGZME1H2F29I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B780		3.6 mm	33 mm			e1	670 MHz				33 mm
EP2SGX30DF780C5	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	33880	CMOS	361	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	33880 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	640 MHz	20 s	361	220 °C (428 °F)	29 mm
EP1S60F780C7ES	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780				No		e0
10AS048E1F29I1SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP4SGX70DF29C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		2904 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.3 mm	29 mm	No		e0	717 MHz	20 s	372	220 °C (428 °F)	29 mm
EP4SGX70DF29M3	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)		2048 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.3 mm	29 mm				637.5 MHz		372		29 mm
5AGZME3E3H29C4N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584		342	0.85		Grid Array	BGA780,28X28,40		.82 V	1 mm	85 °C (185 °F)		13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm						342		33 mm
EP3SL50F780I4L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
EP4SGX230DF29I4	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			9120 CLBS		Tin Lead	Bottom	S-PBGA-B780	4	3.5 mm	29 mm	No		e0	717 MHz	20 s	372	220 °C (428 °F)	29 mm
EP3SL110F780I4L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
5AGZME1H2F29C4N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.6 mm	33 mm			e1	670 MHz				33 mm
EP3SL50F780I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
EP1S40F780I8	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	41250	Yes			CMOS	822		1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	3			No		e0			822	220 °C (428 °F)
10AX016E3F29I1LP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP2AGZ350HF29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		13940 CLBs	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
EP3SL110F780I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
EP2SGX30CF780I4N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	33880	CMOS	361	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	3.337 ns	33880 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1	622.08 MHz	40 s	361	245 °C (473 °F)	29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.