780 Field Programmable Gate Arrays (FPGA) 1,765

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP1S25F780C6N	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1			706		29 mm
EP1S40F780I6	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V		CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B780	3			No		e0			822
EP1S40F780I6N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V		CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B780	3			No		e1			822
EP3C120F780C8NES	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780		3.5 mm	29 mm	No		e1	472.5 MHz				29 mm
EP2AGX65DF29C5N	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		2530 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP4CE30F29I7N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	28848	Yes	1.25 V	1803		535	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm			1803 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz	30 s	535	260 °C (500 °F)	29 mm
EP4CE75F29C6	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	4713		429	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		4713 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz		429		29 mm
EP4CE75F29C6N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	4713		429	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		4713 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		429		29 mm
EP4CE75F29C7N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	75408		429	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		75408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz		429		29 mm
EP3SL150F780C4G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		488	0.9		Grid Array	BGA780,28X28,40		.86 V	1 mm	85 °C (185 °F)		5700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3 mm	29 mm		It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP4SE230F29I3N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	228000	CMOS	488	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			228000 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	4	3.45 mm	29 mm	No		e1	717 MHz		488		29 mm
EP1AGX20CF780C6N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	21580		230	1.2	1.2,2.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		21580 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	640 MHz		230		29 mm
5AGZME1E2H29C3G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.88 V	8302		342	0.85		Grid Array	BGA780,28X28,40		.82 V	1 mm	85 °C (185 °F)		8302 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.5 mm	33 mm						342		33 mm
EP4CE115F29C7N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	114480	Yes	1.25 V	7155		531	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		7155 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		531		29 mm
10AX032E4F29I3LG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	TSMC	360	0.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP3SL110F780C3N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V	4300		488	0.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		4300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP1S20F780C7	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2132 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0			586		29 mm
EP2AGX260EF29I3N	Intel	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP2AGX45DF29C4N	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP3SL150F780I3N	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		488	0.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	100 °C (212 °F)		5700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1			488		29 mm
EP4CE75F29I7N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	4713		429	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm			4713 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		429		29 mm
10AX027E1F29I1HG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.98 V	10162	TSMC	360	.95		Grid Array			.92 V	1 mm	100 °C (212 °F)		10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm						360		29 mm
EP2AGX125EF29I5	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes			CMOS	372		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					372
EP2AGX125EF29I5G	Intel	FPGA		Ball	780	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9		Grid Array, Heat Sink/Slug	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		4964 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.6 mm	29 mm						372		29 mm
EP2AGX65DF29C6G	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		372	0.9		Grid Array, Heat Sink/Slug	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		2530 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.6 mm	29 mm						372		29 mm
EP3SL50F780C2N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V	1900		488	0.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		1900 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP3SL50F780C4G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V	1900		488	0.9		Grid Array	BGA780,28X28,40		.86 V	1 mm	85 °C (185 °F)		1900 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3 mm	29 mm		It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP4CE40F29C7N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475		535	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		535		29 mm
10AX027E4F29I3SG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	360	0.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10AX032E2F29E1SG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990		384	0.9	0.9 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No	Also Operates at 0.95 V nominal supply				384		29 mm
EP1AGX60DF780C6N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	60100		350	1.2	1.2,2.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		60100 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	640 MHz		350		29 mm
EP1S10F780C6	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0			426		29 mm
EP1S20F780C6N	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2132 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1			586		29 mm
EP1S30F780C6	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		3819 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0			726		29 mm
EP2AGX45DF29C6N	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP2AGX65DF29C6N	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		2530 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP2S130F780I4N	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	6627	CMOS	534	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	6627 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	717 MHz		526		29 mm
EP2SGX60DF780C4	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	717 MHz		364		29 mm
EP2SGX60DF780C4N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	717 MHz	30 s	364	245 °C (473 °F)	29 mm
EP3C40F780I7	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz		535		29 mm
EP3SE80F780C4LG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200			.9		Grid Array	BGA780,28X28,40		.86 V	1 mm	85 °C (185 °F)		3200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.2 mm	29 mm		Also Operates at 1.1 V VCC nominal						29 mm
EP3SL110F780I4N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V	4300		488	0.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	100 °C (212 °F)		4300 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP3SL150F780I4N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		488	0.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	100 °C (212 °F)		5700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780	3	3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP3SL50F780C4	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply		717 MHz		488		29 mm
EP3SL50F780I4LN	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm						Bottom	S-PBGA-B780		3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply		717 MHz		488		29 mm
EP3SL70F780I3G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V	2700		488	0.9		Grid Array	BGA780,28X28,40		.86 V	1 mm	100 °C (212 °F)		2700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3 mm	29 mm		It can also operate from 1.05 to 1.15 V supply				488		29 mm
EP4CE115F29C7	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	114480	Yes	1.25 V	7155		531	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		7155 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz		531		29 mm
EP4SGX70DF29C4G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		2904 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.3 mm	29 mm						372		29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.