84 Field Programmable Gate Arrays (FPGA) 988

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3030-70PC84CSPC0107

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

100

CMOS

1500

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

9 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

360 flip-flops; typical gates = 1500-2000

e0

70 MHz

29.3116 mm

XC6264-2PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

16384

CMOS

64000

5

Chip Carrier

4.5 V

1.27 mm

16384 CLBS, 64000 Gates

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

16384 flip-flops; typical gates = 64000-100000

e0

111 MHz

29.3116 mm

5962-9561001MXC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

MIL-STD-883

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 2000-3000

e4

188 MHz

74

27.94 mm

XC3195A-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

484

Yes

5.25 V

484

CMOS

70

6500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

3.3 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 7500 Logic gates

e0

227 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

5962-01-417-5318

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

CMOS

74

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-J84

No

70 MHz

74

XC3030-70PG84ISPC0104

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

100

CMOS

3000

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

9 ns

100 CLBS, 3000 Gates

-40 °C (-40 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C

e3

70 MHz

27.94 mm

XC5404L-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.3

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC3330A-6PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC2018-70PG84M

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

10 ns

100 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

174 flip-flops; typical gates = 1000-1500

70 MHz

74

27.94 mm

5962-01-358-5654

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P84

No

50 MHz

74

XC3130A-09PG84C

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

1.5 ns

100 CLBS, 1500 Gates

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1500-2000

370 MHz

74

27.94 mm

5962-8863803XC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

100

CMOS

1800

5

Grid Array

2.54 mm

125 °C (257 °F)

10 ns

100 CLBS, 1800 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

50 MHz

27.94 mm

XC3064-100PC84CSPC0108

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

224

CMOS

6400

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

7 ns

224 CLBS, 6400 Gates

0 °C (32 °F)

Quad

S-PQCC-J84

4.699 mm

29.3116 mm

No

MAX 70 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C

100 MHz

29.3116 mm

XC5210-3PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

324

Yes

5.5 V

324

CMOS

196

10000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

3 ns

324 CLBS, 10000 Gates

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 10000-16000

e0

83 MHz

30 s

196

225 °C (437 °F)

29.3116 mm

XC4005A-5PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

5.25 V

196

CMOS

112

4000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4.5 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

616 flip-flops; typical gates = 4000-5000

e0

133.3 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC4006E-2PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

256

CMOS

4000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

1.6 ns

256 CLBS, 4000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 6000 Logic gates

e3

125 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC4010E-4PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

400

CMOS

7000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

2.7 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 10000 Logic gates

e3

111 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC4005XL-3PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

3000

3.3

Chip Carrier

3 V

1.27 mm

85 °C (185 °F)

1.6 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e3

166 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3020A-7PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

64

CMOS

1000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

5.1 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 1500 Logic gates

e3

113 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3042-100PG84MSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

144

CMOS

2000

5

Grid Array

2.54 mm

125 °C (257 °F)

7 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000

e3

100 MHz

27.94 mm

XC4010XL-1PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.3 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 10000 Logic gates

e0

200 MHz

30 s

160

225 °C (437 °F)

29.3116 mm

XC4008E-3PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

324

CMOS

6000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

2 ns

324 CLBS, 6000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 8000 Logic gates

e3

125 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC2018-70PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.5 V

100

CMOS

74

1000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

10 ns

100 CLBS, 1000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

174 flip-flops; typical gates = 1000-1500

e0

70 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC3064-125PC84CSPC0108

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

224

CMOS

6400

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

5.5 ns

224 CLBS, 6400 Gates

0 °C (32 °F)

Quad

S-PQCC-J84

4.699 mm

29.3116 mm

No

MAX 70 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C

125 MHz

29.3116 mm

XC6209-2PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

2304

Yes

5.25 V

2304

CMOS

9000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

3 ns

2304 CLBS, 9000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

2304 flip-flops; typical gates = 9000-13000

e0

111 MHz

29.3116 mm

XC3164-5PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

224

Yes

5.5 V

224

CMOS

70

4000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

4.1 ns

224 CLBS, 4000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500

e0

190 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC3020-50PC84CSPC0107

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

64

CMOS

2000

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

4.699 mm

29.3116 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e0

50 MHz

29.3116 mm

XC5202-4PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

64

CMOS

2000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

3.8 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 3000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

5962-8971302MXX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

144

CMOS

MIL-STD-883

4200

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

144 CLBS, 4200 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

70 MHz

27.94 mm

XC3042-125PG84CSPC0107

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

144

CMOS

2000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000

e3

125 MHz

27.94 mm

XC3142A-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.5 V

144

CMOS

74

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

3.3 ns

144 CLBS, 2000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 3000 Logic gates

e0

227 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC4008E-1PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

324

Yes

5.5 V

324

CMOS

144

6000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

324 CLBS, 6000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

166 MHz

30 s

144

225 °C (437 °F)

29.3116 mm

XC3142L-3PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

3.6 V

144

CMOS

74

2000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

70 °C (158 °F)

2.7 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 2000-3000

e0

270 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC3164A-3PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

224

Yes

5.25 V

224

CMOS

70

3500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

2.7 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 4500 Logic gates

e0

270 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC5210-5PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

324

CMOS

10000

5

Chip Carrier

4.5 V

1.27 mm

4.6 ns

324 CLBS, 10000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 16000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3042A-6PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

144

CMOS

2000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

4.1 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 3000 Logic gates

e3

135 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3042A-7PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.5 V

144

CMOS

74

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

5.1 ns

144 CLBS, 2000 Gates

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 3000 Logic gates

e0

113 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC3164A-09PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

224

Yes

5.25 V

224

CMOS

70

3500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

1.5 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 4500 Logic gates

e0

370 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC3042-125PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

74

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

5.5 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

125 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC3190-4PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

5.5 V

320

CMOS

70

5000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

3.3 ns

320 CLBS, 5000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500

e0

230 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC3020A-2PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

CMOS

64

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

No

e0

325 MHz

30 s

64

225 °C (437 °F)

XC3030A-6PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.1 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1500-2000

135 MHz

74

27.94 mm

5962-01-368-2698

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic

144

No

CMOS

38535Q/M;38534H;883B

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P84

No

50 MHz

74

XC3064-70PC84CSPC0107

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

224

CMOS

3500

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

9 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

688 flip-flops; typical gates = 3500-4500

e0

70 MHz

29.3116 mm

XC2018-100PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

8 ns

100 CLBS, 1000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

174 flip-flops; typical gates = 1000-1500

100 MHz

74

27.94 mm

XC3020-50PG84ISPC0110

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

2000

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e3

50 MHz

27.94 mm

XC3164A-2PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

224

Yes

5.25 V

224

CMOS

70

3500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

2.2 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 4500 Logic gates

e0

323 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC5210-3PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

324

CMOS

10000

5

Chip Carrier

4.5 V

1.27 mm

3 ns

324 CLBS, 10000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 10000-16000

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.