84 Field Programmable Gate Arrays (FPGA) 988

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3142A1PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	323 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3190A-4PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	320	CMOS		5000	5		Chip Carrier			4.5 V	1.27 mm		3.3 ns	320 CLBS, 5000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 6000 Logic gates	e3	227 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3190A-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	270 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3042-50PG84BSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS		2000	5		Grid Array				2.54 mm	125 °C (257 °F)	14 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000		50 MHz				27.94 mm
XC3120A-2PG84I	Xilinx	FPGA		Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS	64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.2 ns	64 CLBS, 1000 Gates			Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		323 MHz		64		27.94 mm
XC3142A-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.2 ns	144 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	323 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3120A-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 1500 Logic gates	e0	270 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XCS05XL-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	100			2000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		100 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3		30 s		245 °C (473 °F)	29.3116 mm
XC8103-ESPC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	1024	CMOS		3328	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	5.5 ns	1024 CLBS, 3328 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	MAX 61 I/OS; MAX 512 flip-flops; OTP based						29.3116 mm
XC3390-100PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes			CMOS	70		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	100 MHz	30 s	70	225 °C (437 °F)
XC3064-50PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	6400	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 70 I/OS; 688 flip-flops	e0	50 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3130A-4PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS	74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		227 MHz		74		27.94 mm
XC5206L-3PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		6000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e0					29.3116 mm
XC3120-3PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-1500	e0	270 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3020-50PC84CSPC0110	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XCS10-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	196			3000	5		Chip Carrier			4.5 V	1.27 mm			196 CLBS, 3000 Gates		Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0					29.3116 mm
XC3064A-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 4500 Logic gates	e0	135 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3090-125PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	125 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3164-4PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	224 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3330L-8PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3020-50PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops	e0	50 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3030-125PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS	74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA		125 MHz		74		27.94 mm
CP20220PLCC84A-0C	Renesas Electronics	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1896	Yes			CMOS	91		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J84				No		e0			91
CP20420PLCC84A-0I	Renesas Electronics	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	3584	Yes			CMOS	130		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQCC-J84				No		e0			130
CP20420PLCC84A-0C	Renesas Electronics	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	3584	Yes			CMOS	130		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J84				No		e0			130
CP20220PLCC84A-0I	Renesas Electronics	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1896	Yes			CMOS	91		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQCC-J84				No		e0			91
EPF8452LC-2	Altera	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	336	Yes			CMOS	68			3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84				No		e0			68	220 °C (428 °F)
EPF8452LC-3	Altera	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	336	Yes			CMOS	68			3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84				No		e0			68	220 °C (428 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.