84 Field Programmable Gate Arrays (FPGA) 988

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
ICE40LP1K-QN84	Lattice Semiconductor	FPGA	Industrial	Butt	84	HVBCC	Square			1280	Yes	1.26 V	160	CMOS		67		1.2		1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	SLGA84,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)		Bottom	S-XBCC-B84	3	.95 mm	7 mm	No			133 MHz	30 s	67	260 °C (500 °F)	7 mm
A42MX09-PLG84I	Microchip Technology	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.5 ns	684 CLBS, 14000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	117 MHz	30 s		245 °C (473 °F)	29.3116 mm
LCMXO2-4000HC-6QN84I	Lattice Semiconductor	FPGA	Industrial	No Lead	84	HVQCCN	Square		Plastic/Epoxy	4320	Yes	3.6 V				68		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC84,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-N84	3	.95 mm	7 mm		Also Operates at 3.3 V nominal supply	e3			68	260 °C (500 °F)	7 mm
A42MX09-PLG84IX39	Microchip Technology	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy	684	Yes	5.5 V		CMOS		104		5		3.3,3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J84	3		29.21 mm	No					104		29.21 mm
A42MX09-PLG84M	Microchip Technology	FPGA	Military	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3	Tube		Chip Carrier			3 V	1.27 mm	125 °C (257 °F)	2.5 ns	684 CLBS, 14000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	117 MHz				29.3116 mm
A42MX09-PLG84	Microchip Technology	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3	Tube		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.5 ns	684 CLBS, 14000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	117 MHz				29.3116 mm
A42MX09-PLG84A	Microchip Technology	FPGA	Automotive	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	5.25 V	684	CMOS			14000	5	Tube		Chip Carrier			4.75 V	1.27 mm	125 °C (257 °F)	2 ns	684 CLBS, 14000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Can also be operated at 5.0 V supply	e3	174 MHz				29.3116 mm
A42MX09-PL84	Microsemi	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3			Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.5 ns	684 CLBS, 14000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e0	117 MHz	20 s		225 °C (437 °F)	29.3116 mm
A42MX09-PL84A	Microchip Technology	FPGA	Automotive	J Bend	84	QCCJ	Square		Plastic/Epoxy	684	Yes	5.25 V	336	CMOS		104	14000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	125 °C (257 °F)	2 ns	336 CLBS, 14000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Can also be operated at 3 V supply	e0	174 MHz		104		29.3116 mm
A42MX09-PL84I	Microsemi	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy	684	Yes	3.6 V	684	CMOS			14000	3.3			Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.5 ns	684 CLBS, 14000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e0	117 MHz	20 s		225 °C (437 °F)	29.3116 mm
A42MX09-PL84M	Microsemi	FPGA	Military	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3			Chip Carrier			3 V	1.27 mm	125 °C (257 °F)	2.5 ns	684 CLBS, 14000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e0	117 MHz				29.3116 mm
A42MX16-PLG84I	Microchip Technology	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	1232	CMOS			24000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.8 ns	1232 CLBS, 24000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	94 MHz	30 s		245 °C (473 °F)	29.3116 mm
RTSX32SUCQ84B	Microchip Technology	FPGA	Military	Flat	84	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	227	48000	2.5		2.5,3.3/5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	2.25 V	.635 mm	125 °C (257 °F)	1.4 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F84		2.4 mm	16.51 mm	No	32000 typical gates available	e0	310 MHz	20 s	227	225 °C (437 °F)	16.51 mm
RTSX32SU-CQ84B	Microsemi	FPGA	Military	Flat	84	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	227	48000	2.5		2.5,3.3/5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	2.25 V	.635 mm	125 °C (257 °F)	1.4 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F84		2.4 mm	16.51 mm	No	32000 typical gates available	e0	310 MHz	20 s	227	225 °C (437 °F)	16.51 mm
XC3090A-7PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square		Plastic/Epoxy	320	Yes	5.5 V	320	CMOS		70	5000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		5.1 ns	320 CLBS, 5000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	113 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
A42MX16-FPL84	Microsemi	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	1232	CMOS			24000	3.3			Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	4 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e0	56 MHz				29.3116 mm
XC3130-4PC84C	Rochester Electronics	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	5.25 V	100	CMOS			2000	5			Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		230 MHz				29.3116 mm
XC3020-50PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS		64	2000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops		50 MHz		64		27.94 mm
A42MX16-PL84	Microsemi	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	1232	CMOS			24000	3.3			Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.8 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e0	94 MHz				29.3116 mm
A42MX16-PLG84	Microchip Technology	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	1232	CMOS			24000	3.3	Tube		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.8 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	94 MHz				29.3116 mm
LCMXO2-4000HC-6QN84C	Lattice Semiconductor	FPGA	Other	No Lead	84	HVQCCN	Square		Plastic/Epoxy	4320	Yes	3.6 V				68		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC84,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQCC-N84	3	.95 mm	7 mm		Also Operates at 3.3 V nominal supply	e3			68	260 °C (500 °F)	7 mm
XC2018-70PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		74	1000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	10 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	174 flip-flops; typical gates = 1000-1500	e0	70 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC5210-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy	324	Yes	5.25 V	324	CMOS		196	10000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	29.3116 mm
XC3030A-7PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		74	1500	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC4003A-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square		Plastic/Epoxy	238	Yes	5.25 V	100	CMOS		61	2500	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC3030A-7PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		74	1500	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3042-100PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	144	No		144	CMOS	MIL-STD-883 Class B	74	2000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		100 MHz		74		27.94 mm
XC5202-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square		Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		84	2000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		3 ns	64 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 2000-3000	e0	83 MHz	30 s	84	225 °C (437 °F)	29.3116 mm
A40MX04-PLG84I	Microchip Technology	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.7 ns	547 CLBS, 6000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	80 MHz	30 s		245 °C (473 °F)	29.3116 mm
A42MX24-PLG84	Microchip Technology	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy	1866	Yes	3.6 V	1890	CMOS		176	36000	3.3	Tube	3.3,3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	70 °C (158 °F)	2.5 ns	1890 CLBS, 36000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3			176		29.3116 mm
A42MX24-PLG84I	Microchip Technology	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes	3.6 V	1890	CMOS			36000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.5 ns	1890 CLBS, 36000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	91.8 MHz	30 s		245 °C (473 °F)	29.3116 mm
TPC1020BFN-084I	Texas Instruments	FPGA	Industrial	J Bend	84	QCCJ	Square		Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J84				No					69
TPC1010AMHFG84B-1	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular		Ceramic	295	Yes			CMOS	38535Q/M;38534H;883B	57		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					57
5962-9096401MYX	Texas Instruments	FPGA	Military	Flat	84	QFF	Square		Ceramic	295	Yes			CMOS	38535Q/M;38534H;883B	57		5		5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					57
TPC1010AMHFG84	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular		Ceramic	295	Yes			CMOS		57		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					57
TPC1020AMHFG84B	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular		Ceramic	547	Yes			CMOS	38535Q/M;38534H;883B	69		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					69
5962-9096504MUX	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V	547	CMOS			1200	5			Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	4.7 ns	547 CLBS, 1200 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No			44 MHz				27.94 mm
M38510/60604BYX	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			4000	5			Grid Array			4.5 V		125 °C (257 °F)		4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84				No
5962-9096401MZX	Texas Instruments	FPGA	Military	Flat	84	GQFF	Square		Ceramic, Metal-Sealed Cofired	295	Yes	5.5 V		CMOS	MIL-STD-883 Class B	57	1200	5		5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		1200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F84		3.302 mm	16.51 mm	No					57		16.51 mm
TPC1020BFN-084C2	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J84				No					69
TPC1010AMHT84	Texas Instruments	FPGA	Military	Flat	84	QFF	Square		Ceramic	295	Yes			CMOS		57		5		5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					57
TPC1225AFN-84C1	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy	451	Yes	5.25 V	451	CMOS		83	2500	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		451 CLBS, 2500 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No			85 MHz		83		29.3116 mm
TPC1020AMHT84B	Texas Instruments	FPGA	Military	Flat	84	QFF	Square		Ceramic, Metal-Sealed Cofired	547	Yes	5.5 V	547	CMOS	38535Q/M;38534H;883B	69	2000	5		5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	19.332 ns	547 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F84		3.3 mm	16.51 mm	No	MAX 69 I/OS; 273 flip-flops		100 MHz		69		16.51 mm
TPC1425FN-84C	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy		Yes			CMOS							Chip Carrier				1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No							29.3116 mm
TPC1020AMGB84B-1	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic, Metal-Sealed Cofired	547	No	5.5 V	547	CMOS	38535Q/M;38534H;883B	69	2000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	16.092 ns	547 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.21 mm	27.94 mm	No	MAX 69 I/OS; 273 flip-flops				69		27.94 mm
TPC1020AFJ-084C	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square		Ceramic	547	Yes			CMOS		69		5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-XQCC-J84				No					69
TPC1225AFN-84C	Texas Instruments	FPGA	Commercial	J Bend	84	QCCJ	Square		Plastic/Epoxy	451	Yes	5.25 V	451	CMOS		83	2500	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		451 CLBS, 2500 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No			75 MHz		83		29.3116 mm
TPC1020APB-084M	Texas Instruments	FPGA	Military	Pin/Peg	84	PGA	Square		Ceramic	547	No			CMOS		69		5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No					69

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.