84 Field Programmable Gate Arrays (FPGA) 988

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3030-70PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	70 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC4006-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	608	Yes	5.25 V	256	CMOS		61	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4 ns	256 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	768 flip-flops; typical gates = 5000-6000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC8109-1PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	2688	Yes	5.25 V	2688	CMOS		208	9000	5	3.3/5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	5.4 ns	2688 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	1344 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	208	225 °C (437 °F)	29.3116 mm
XC3142-5PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		74	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3020A-6PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS		64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		135 MHz		64		27.94 mm
XC3030-70PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS	38535Q/M;38534H;883B	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			70 MHz		74
XC3120A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-1500	e0	188 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3020L-8PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS		64	1000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	6.7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 1500 Logic gates	e0	80 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3330A-3PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3020-50PC84ISPC0110	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XC3064-100PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS		70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	7 ns	224 CLBS, 3500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	100 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC4003E-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	125 MHz	30 s	80	225 °C (437 °F)	29.3116 mm
XC5202L-3PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS			2000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 2000-3000	e0					29.3116 mm
XC3064A-6PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS			3500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 4500 Logic gates	e3	135 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3130A-3PG84I	Xilinx	FPGA		Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.7 ns	100 CLBS, 1500 Gates			Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		270 MHz		74		27.94 mm
XC5204-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	120	CMOS			4000	5		Chip Carrier			4.5 V	1.27 mm		3 ns	120 CLBS, 4000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 4000-6000	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
5962-01-356-8165	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS	38535Q/M;38534H;883B	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			50 MHz		74
XC3190A-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS			5000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 6000 Logic gates	e3	227 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC5202-6PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5		Chip Carrier			4.5 V	1.27 mm		5.6 ns	64 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3190-3PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes			CMOS		70		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0		30 s	70	225 °C (437 °F)
XC5202-6PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	5.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4010E-1PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS			7000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.3 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3030-100PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 1500-2000		100 MHz				29.3116 mm
XC2018-100PG84B	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883 Class B					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XC3090-50PC84CSPC0107	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS			9000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		320 CLBS, 9000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XC4006E-1PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	256	CMOS			4000	5		Chip Carrier			4.5 V	1.27 mm			256 CLBS, 4000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	166 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3195-5PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS		70	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	190 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3195A-2PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS		70	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.2 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 7500 Logic gates	e0	323 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3164A1PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS		70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 4500 Logic gates	e0	323 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3030A-7PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		113 MHz		74		27.94 mm
XC3195A-2PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	484	CMOS			6500	5		Chip Carrier			4.5 V	1.27 mm		2.2 ns	484 CLBS, 6500 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 7500 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3120-4PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS		64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		227 MHz		64		27.94 mm
XC3142-5PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		74	3000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		190 MHz		74		27.94 mm
XC3164A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS		70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 3500-4500	e0	188 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3064L-8PC84I	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	3.6 V	224	CMOS		70	3500	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	70 °C (158 °F)	6.7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 4500 Logic gates	e0	80 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XCS05XL-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	100				2000	3.3		Chip Carrier			3 V	1.27 mm			100 CLBS, 2000 Gates		Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No		e0					29.3116 mm
XC3030-50PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		100	CMOS			1500	5		Grid Array				2.54 mm	125 °C (257 °F)		100 CLBS, 1500 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000		50 MHz				27.94 mm
XC3042-50PC84CSPC0107	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS			4200	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C		50 MHz				29.3116 mm
XCS10-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS		112	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAXIMUM usable gates 10000	e0	125 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC3130A-2PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.2 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		323 MHz		74		27.94 mm
XC5404-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC4406-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3164A-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS			3500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2.7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 4500 Logic gates	e3	270 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC5206-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	784	Yes	5.25 V	196	CMOS		65	6000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 10000 Logic gates	e0	83 MHz	30 s	65	225 °C (437 °F)	29.3116 mm
XC4008E-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS			6000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	324 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 8000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3030-50PG84CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	100	CMOS			3000	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e3	50 MHz				27.94 mm
XC201870PG84B883	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	100	CMOS	MIL-STD-883		1000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	10 ns	100 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	174 flip-flops; typical gates = 1000-1500		70 MHz				27.94 mm
XC2018-33PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS		74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	33 MHz	30 s	74	225 °C (437 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.