84 Field Programmable Gate Arrays (FPGA) 988

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3342L-8PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

3.3

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC4303-4PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC2018LPC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

100

CMOS

1500

3.3

Chip Carrier

3 V

1.27 mm

70 °C (158 °F)

100 CLBS, 1500 Gates

0 °C (32 °F)

Quad

S-PQCC-J84

4.699 mm

29.3116 mm

No

MAX 74 I/OS; 1200 to 1500 available gates

29.3116 mm

XC5404-4PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC3030-70PG84M

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

9 ns

100 CLBS, 1500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

70 MHz

74

27.94 mm

5962-01-292-9185

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P84

No

70 MHz

74

XC4005XL-3PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

1.6 ns

196 CLBS, 3000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e0

166 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC3020-70PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

9 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

70 MHz

64

27.94 mm

XC4005E-1PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

5.25 V

196

CMOS

112

3000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

1.3 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e0

166 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC8109-ESPC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

2688

CMOS

8700

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

5.5 ns

2688 CLBS, 8700 Gates

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

MAX 61 I/OS; MAX 1344 flip-flops; OTP based

29.3116 mm

XC3064-100PC84CSPC0107

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

224

CMOS

3500

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

7 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

688 flip-flops; typical gates = 3500-4500

100 MHz

29.3116 mm

XC4005-5PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

5.25 V

196

CMOS

112

4000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4.5 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

616 flip-flops; typical gates = 4000-5000

e0

133.3 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC2018-100PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

7.5 ns

100 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

174 flip-flops; typical gates = 1000-1500

100 MHz

74

27.94 mm

XC4006E-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

256

Yes

5.25 V

256

CMOS

128

4000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

2.7 ns

256 CLBS, 4000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 6000 Logic gates

e0

111 MHz

30 s

128

225 °C (437 °F)

29.3116 mm

XC3020-100PG84ISPC0107

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

1000

5

Grid Array

4.5 V

2.54 mm

7 ns

64 CLBS, 1000 Gates

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500

e3

100 MHz

27.94 mm

5962-01-382-7899

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P84

No

50 MHz

74

XC4005XL-09CPC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

466

Yes

3.6 V

196

CMOS

61

3000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e0

217 MHz

30 s

61

225 °C (437 °F)

29.3116 mm

XC5410L-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.3

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC3195A-4PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

484

CMOS

6500

5

Chip Carrier

4.5 V

1.27 mm

3.3 ns

484 CLBS, 6500 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 7500 Logic gates

e3

227 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3130-5PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.5 V

100

CMOS

74

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

4.1 ns

100 CLBS, 2000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700

e0

190 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC5210-5PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

324

Yes

5.5 V

324

CMOS

196

10000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

4.6 ns

324 CLBS, 10000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 16000 Logic gates

e0

83 MHz

30 s

196

225 °C (437 °F)

29.3116 mm

XC4010E-3PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

400

CMOS

7000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

2 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 10000 Logic gates

e3

125 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3090-70PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

5.25 V

320

CMOS

70

5000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

9 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

70 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC4008E-1PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

324

CMOS

6000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

1.3 ns

324 CLBS, 6000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 8000 Logic gates

e3

166 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3064-125PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

224

Yes

5.25 V

224

CMOS

70

3500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

5.5 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA

e0

125 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC3190A-3PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

5.5 V

320

CMOS

70

5000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

2.7 ns

320 CLBS, 5000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 6000 Logic gates

e0

270 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC4010XL-3PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

400

CMOS

7000

3.3

Chip Carrier

3 V

1.27 mm

1.6 ns

400 CLBS, 7000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 10000 Logic gates

e3

166 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC4005E-1PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

5.5 V

196

CMOS

112

3000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

196 CLBS, 3000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

166 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC5202-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

84

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

3.8 ns

64 CLBS, 2000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 2000-3000

e0

83 MHz

30 s

84

225 °C (437 °F)

29.3116 mm

XC4003-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

238

Yes

5.25 V

100

CMOS

61

2500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4 ns

100 CLBS, 2500 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

360 flip-flops; typical gates = 2500-3000

e0

133.3 MHz

30 s

61

225 °C (437 °F)

29.3116 mm

XC4005E-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

5.5 V

196

CMOS

112

3000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

2.7 ns

196 CLBS, 3000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e0

111 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC4010XL-09CPCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

400

CMOS

7000

3.3

Chip Carrier

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 10000 Logic gates

e3

217 MHz

29.3116 mm

XC3020-50PG84ISPC0107

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

2000

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e3

50 MHz

27.94 mm

XC3042-100PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

74

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

7 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

100 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC5204-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

120

Yes

5.25 V

120

CMOS

124

4000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

3.8 ns

120 CLBS, 4000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 6000 Logic gates

e0

83 MHz

30 s

124

225 °C (437 °F)

29.3116 mm

XC3020-50PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

64

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 64 I/OS; 256 flip-flops

e0

50 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

XC3195A-2PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

484

CMOS

6500

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

2.2 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 7500 Logic gates

e3

323 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3020-50PG84B

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

64

CMOS

MIL-STD-883 Class B

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

14 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

50 MHz

64

27.94 mm

XC3130A-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.5 V

100

CMOS

74

1500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

3.3 ns

100 CLBS, 1500 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 2000 Logic gates

e0

227 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC4005XL-1PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

3000

3.3

Chip Carrier

3 V

1.27 mm

85 °C (185 °F)

1.3 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e3

200 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC2018-70PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

10 ns

100 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

174 flip-flops; typical gates = 1000-1500

70 MHz

74

27.94 mm

XC2018-50PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

15 ns

100 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 174 flip-flops; typical gates = 1000 - 1500

50 MHz

74

27.94 mm

XC4003E-1PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.5 V

100

CMOS

80

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

100 CLBS, 2000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

166 MHz

30 s

80

225 °C (437 °F)

29.3116 mm

XC3030-70PG84MSPC0104

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

100

CMOS

3000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

9 ns

100 CLBS, 3000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C

70 MHz

27.94 mm

XC6264-2PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

16384

CMOS

64000

5

Chip Carrier

4.75 V

1.27 mm

16384 CLBS, 64000 Gates

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

16384 flip-flops; typical gates = 64000-100000

e0

111 MHz

29.3116 mm

XC4005XL-3PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

3000

3.3

Chip Carrier

3 V

1.27 mm

1.6 ns

196 CLBS, 3000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e3

166 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3064-70PC84CSPC0108

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

224

CMOS

6400

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

9 ns

224 CLBS, 6400 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

4.699 mm

29.3116 mm

No

MAX 70 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C

e0

70 MHz

29.3116 mm

XC3130-5PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4.1 ns

100 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700

190 MHz

74

27.94 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.