84 Field Programmable Gate Arrays (FPGA) 988

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3020-70PG84MSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

64

CMOS

1000

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500

70 MHz

27.94 mm

XC3130-3PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.25 V

100

CMOS

74

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

70 °C (158 °F)

2.7 ns

100 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700

e0

270 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC3130A-3PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1500-2000

270 MHz

74

27.94 mm

XC4010XL-3PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

1.6 ns

400 CLBS, 7000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 10000 Logic gates

e0

166 MHz

30 s

160

225 °C (437 °F)

29.3116 mm

XC3042-70PG84CSPC0107

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

144

CMOS

2000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000

e3

70 MHz

27.94 mm

XC3142A-5PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.1 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 2000-3000

188 MHz

74

27.94 mm

XC4002XL-2PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

3.6 V

64

CMOS

64

1000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.5 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 1600 Logic gates

e0

179 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

XC3090-70PC84CSPC0107

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

320

CMOS

5000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

9 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

928 flip-flops; typical gates = 5000-6000

e0

70 MHz

29.3116 mm

XC3042-70PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

70 MHz

74

27.94 mm

XC3120A-4PG84I

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

3.3 ns

64 CLBS, 1000 Gates

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1000-1500

227 MHz

64

27.94 mm

XC4003E-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.5 V

100

CMOS

80

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

2.7 ns

100 CLBS, 2000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 3000 Logic gates

e0

111 MHz

30 s

80

225 °C (437 °F)

29.3116 mm

XC3030L-8PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

3.6 V

100

CMOS

74

1500

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

6.7 ns

100 CLBS, 1500 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 2000 Logic gates

e0

80 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC5206-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

784

Yes

5.5 V

196

CMOS

65

6000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

3.8 ns

196 CLBS, 6000 Gates

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 6000-10000

e0

83 MHz

30 s

65

225 °C (437 °F)

29.3116 mm

XC4008E-3PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

324

CMOS

6000

5

Chip Carrier

4.5 V

1.27 mm

2 ns

324 CLBS, 6000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 8000 Logic gates

e3

125 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC5210-4PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

324

CMOS

10000

5

Chip Carrier

4.5 V

1.27 mm

3.8 ns

324 CLBS, 10000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 10000-16000

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC4310-4PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

5962-8863802XX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

MIL-STD-883

1800

5

Grid Array

4.5 V

125 °C (257 °F)

1800 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

No

XC3130A-1PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

100

CMOS

1500

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

1.75 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 2000 Logic gates

e3

323 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3120-5PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.1 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1000-1500

188 MHz

64

27.94 mm

XC4008-6PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

770

Yes

5.5 V

324

CMOS

61

6500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

6 ns

324 CLBS, 6500 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

936 flip-flops; typical gates = 6500-8000

e0

90.9 MHz

30 s

61

225 °C (437 °F)

29.3116 mm

XC4003E-3PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

100

CMOS

2000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

2 ns

100 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 3000 Logic gates

e3

125 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC6264-2PCG84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

16384

CMOS

64000

5

Chip Carrier

4.75 V

1.27 mm

16384 CLBS, 64000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

16384 flip-flops; typical gates = 64000-100000

e3

111 MHz

29.3116 mm

XC3190A-5PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

5.25 V

320

CMOS

70

5000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4.1 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 5000-6000

e0

188 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC3090-50PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

5.25 V

320

CMOS

70

9000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

70 °C (158 °F)

320 CLBS, 9000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 70 I/OS; 928 flip-flops

e0

50 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC5206-3PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

784

Yes

5.5 V

196

CMOS

65

6000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

3 ns

196 CLBS, 6000 Gates

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 6000-10000

e0

83 MHz

30 s

65

225 °C (437 °F)

29.3116 mm

XCS05-3PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

100

2000

5

Chip Carrier

4.5 V

1.27 mm

100 CLBS, 2000 Gates

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

e0

29.3116 mm

XC3090A-7PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

320

CMOS

5000

5

Chip Carrier

4.5 V

1.27 mm

5.1 ns

320 CLBS, 5000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 6000 Logic gates

e3

113 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC4010D-5PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

400

Yes

5.5 V

400

CMOS

160

8000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

4.5 ns

400 CLBS, 8000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

1120 flip-flops; typical gates = 8000-10000

e0

133.3 MHz

30 s

160

225 °C (437 °F)

29.3116 mm

XC3390A-6PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC3030-100PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

7 ns

100 CLBS, 1500 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

100 MHz

74

27.94 mm

XC3142-5PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.5 V

144

CMOS

74

3000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

4.1 ns

144 CLBS, 3000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

e0

190 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC3130A-2PG84I

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.2 ns

100 CLBS, 1500 Gates

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1500-2000

323 MHz

74

27.94 mm

XC3030-100PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

7 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

100 MHz

74

27.94 mm

XC4008-6PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

770

Yes

5.25 V

324

CMOS

61

6500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

6 ns

324 CLBS, 6500 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

936 flip-flops; typical gates = 6500-8000

e0

90.9 MHz

30 s

61

225 °C (437 °F)

29.3116 mm

XC5204-3PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

120

CMOS

4000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

3 ns

120 CLBS, 4000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 6000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC8101-ESPC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

384

CMOS

1248

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

5.5 ns

384 CLBS, 1248 Gates

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

MAX 61 I/OS; MAX 192 flip-flops; OTP based

29.3116 mm

XC3030-125PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.25 V

100

CMOS

74

1500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

5.5 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

e0

125 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC3090-50PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

5.5 V

320

CMOS

70

9000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 70 I/OS; 928 flip-flops

e0

50 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC3142A-5PG84I

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.5 V

144

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

4.1 ns

144 CLBS, 2000 Gates

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 2000-3000

188 MHz

74

27.94 mm

XC3390L-8PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

3.3

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC5206L-5PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

6000

3.3

Chip Carrier

3 V

1.27 mm

85 °C (185 °F)

196 CLBS, 6000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 6000-10000

e0

29.3116 mm

XC5406L-4PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.3

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC3120-3PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

5.5 V

64

CMOS

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

2.7 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1000-1500

270 MHz

64

27.94 mm

5962-8863801MXX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

MIL-STD-883

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

27.94 mm

XC5206-4PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

196

CMOS

6000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

3.8 ns

196 CLBS, 6000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 10000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3130A-1PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1500

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.8 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 1500-2000

323 MHz

74

27.94 mm

XC6264-2PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

16384

CMOS

64000

5

Chip Carrier

4.5 V

1.27 mm

16384 CLBS, 64000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

16384 flip-flops; typical gates = 64000-100000

e3

111 MHz

29.3116 mm

XC3130A-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.25 V

100

CMOS

74

1500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

3.3 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 2000 Logic gates

e0

227 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.