84 Field Programmable Gate Arrays (FPGA) 988

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3342A-3PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC4005E-3PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

5.5 V

196

CMOS

112

3000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

2 ns

196 CLBS, 3000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e0

125 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC3020-50PG84MSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

64

CMOS

1000

5

Grid Array

2.54 mm

125 °C (257 °F)

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500

50 MHz

27.94 mm

XC4005XL-1PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

1.3 ns

196 CLBS, 3000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e0

200 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC3090-70PC84CSPC0109

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

320

CMOS

9000

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

9 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

4.699 mm

29.3116 mm

No

MAX 70 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

e0

70 MHz

29.3116 mm

XC6236-2PCG84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

9216

Yes

5.25 V

9216

CMOS

36000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

3 ns

9216 CLBS, 36000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

9216 flip-flops; typical gates = 36000-55000

e3

111 MHz

29.3116 mm

5962-8863804XX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

CMOS

MIL-STD-883

1800

5

Grid Array

4.5 V

125 °C (257 °F)

1800 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

No

XC3195A-2PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

484

Yes

5.5 V

484

CMOS

70

6500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

2.2 ns

484 CLBS, 6500 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 7500 Logic gates

e0

323 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC3042-70PG84BSPC0107

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

144

CMOS

2000

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000

70 MHz

27.94 mm

XC5202-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

5.25 V

64

CMOS

84

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

3.8 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 3000 Logic gates

e0

83 MHz

30 s

84

225 °C (437 °F)

29.3116 mm

XC4006E-2PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

256

Yes

5.25 V

256

CMOS

128

4000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

1.6 ns

256 CLBS, 4000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 6000 Logic gates

e0

125 MHz

30 s

128

225 °C (437 °F)

29.3116 mm

XC3064A-7PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

224

CMOS

3500

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

5.1 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 4500 Logic gates

e3

113 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3030-50PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.5 V

100

CMOS

74

3000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

100 CLBS, 3000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 360 flip-flops

50 MHz

74

27.94 mm

XC3120-2PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

64

CMOS

1000

5

Chip Carrier

4.75 V

1.27 mm

2.2 ns

64 CLBS, 1000 Gates

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

Typical gates = 1000-1500

323 MHz

29.3116 mm

XC3195A-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

484

Yes

5.5 V

484

CMOS

70

6500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

3.3 ns

484 CLBS, 6500 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 7500 Logic gates

e0

227 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC8106-1PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

1728

Yes

5.25 V

1728

CMOS

168

6000

5

3.3/5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

70 °C (158 °F)

5.4 ns

1728 CLBS, 6000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

864 flip-flops; 3.3 V operation; OTP based

e0

144 MHz

30 s

168

225 °C (437 °F)

29.3116 mm

XC3142-4PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.5 V

144

CMOS

74

3000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

3.3 ns

144 CLBS, 3000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

e0

230 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC8106-ESPC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

1728

CMOS

5616

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

5.5 ns

1728 CLBS, 5616 Gates

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

MAX 61 I/OS; MAX 864 flip-flops; OTP based

29.3116 mm

XC3042-70PG84M

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

9 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Tin Silver Copper

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e1

70 MHz

74

27.94 mm

XC5204-6PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

120

CMOS

4000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

5.6 ns

120 CLBS, 4000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 6000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3142-3PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

CMOS

74

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

1.27 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

No

e0

30 s

74

225 °C (437 °F)

XC3030-50PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.5 V

100

CMOS

74

3000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

100 CLBS, 3000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 74 I/OS; 360 flip-flops

e0

50 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC5206L-5PCG84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

6000

3.3

Chip Carrier

3 V

1.27 mm

85 °C (185 °F)

196 CLBS, 6000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 6000-10000

e3

29.3116 mm

XC3130A-3PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.25 V

100

CMOS

74

1500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

2.7 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 2000 Logic gates

e0

270 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

5962-01-366-2171

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P84

No

70 MHz

74

XC4010D-6PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

400

Yes

5.25 V

400

CMOS

160

8000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

6 ns

400 CLBS, 8000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

1120 flip-flops; typical gates = 8000-10000

e0

90.9 MHz

30 s

160

225 °C (437 °F)

29.3116 mm

XC3042A-7PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

144

CMOS

2000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

5.1 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 3000 Logic gates

e3

113 MHz

30 s

245 °C (473 °F)

29.3116 mm

5962-8863801MXC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

MIL-STD-883

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

27.94 mm

XC3090L-8PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

3.6 V

320

CMOS

70

5000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

6.7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 6000 Logic gates

e0

80 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC4010E-1PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

400

CMOS

7000

5

Chip Carrier

4.5 V

1.27 mm

400 CLBS, 7000 Gates

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

e0

166 MHz

29.3116 mm

XC4008E-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

324

Yes

5.25 V

324

CMOS

144

6000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

2.7 ns

324 CLBS, 6000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 8000 Logic gates

e0

111 MHz

30 s

144

225 °C (437 °F)

29.3116 mm

XC8103-ESPC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

1024

CMOS

3328

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

5.5 ns

1024 CLBS, 3328 Gates

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

MAX 61 I/OS; MAX 512 flip-flops; OTP based

29.3116 mm

XC4003A-6PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

238

Yes

5.5 V

100

CMOS

61

2500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

6 ns

100 CLBS, 2500 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

360 flip-flops; typical gates = 2500-3000

e0

90.9 MHz

30 s

61

225 °C (437 °F)

29.3116 mm

XC3020A-2PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic

64

No

CMOS

64

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P84

No

e0

325 MHz

64

XC4010D-5PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

400

Yes

5.25 V

400

CMOS

160

8000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4.5 ns

400 CLBS, 8000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

1120 flip-flops; typical gates = 8000-10000

e0

133.3 MHz

30 s

160

225 °C (437 °F)

29.3116 mm

XC3030-70PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.25 V

100

CMOS

74

1500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

9 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

e0

70 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC5206-3PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

784

Yes

5.25 V

196

CMOS

65

6000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

3 ns

196 CLBS, 6000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 10000 Logic gates

e0

83 MHz

30 s

65

225 °C (437 °F)

29.3116 mm

XC3090L-8PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

3.6 V

320

CMOS

70

5000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

6.7 ns

320 CLBS, 5000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 6000 Logic gates

e0

80 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC3020-100PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

64

1000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

7 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

e0

100 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

XC3030-50PG84MSPC0104

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

100

CMOS

3000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

100 CLBS, 3000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C

50 MHz

27.94 mm

XC3190A-2PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

320

CMOS

5000

5

Chip Carrier

4.5 V

1.27 mm

2.2 ns

320 CLBS, 5000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 6000 Logic gates

e3

323 MHz

30 s

245 °C (473 °F)

29.3116 mm

5962-8863803MXC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

MIL-STD-883

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

27.94 mm

XC3195A1PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

484

Yes

5.25 V

484

CMOS

70

6500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

1.75 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 7500 Logic gates

e0

323 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC8103-2PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

1024

CMOS

3000

5

Chip Carrier

4.75 V

1.27 mm

70 °C (158 °F)

1024 CLBS, 3000 Gates

0 °C (32 °F)

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

512 flip-flops; 3.3 V operation; OTP based

29.3116 mm

XC3042-50PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

74

4200

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

70 °C (158 °F)

144 CLBS, 4200 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 74 I/OS; 480 flip-flops

e0

50 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC5206-6PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

784

Yes

5.25 V

196

CMOS

65

6000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

5.6 ns

196 CLBS, 6000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 10000 Logic gates

e0

83 MHz

30 s

65

225 °C (437 °F)

29.3116 mm

XC3130A-5PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.25 V

100

CMOS

74

1500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4.1 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 1500-2000

e0

188 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC3120-5PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

5.25 V

64

CMOS

64

1000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

70 °C (158 °F)

4.1 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 1000-1500

e0

188 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.