84 Field Programmable Gate Arrays (FPGA) 988

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5206-4PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	196	CMOS			6000	5		Chip Carrier			4.5 V	1.27 mm		3.8 ns	196 CLBS, 6000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4408-3PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3090A-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS		70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	135 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3042-100PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000		100 MHz				29.3116 mm
XC3330A-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3164A-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS			3500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2.2 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 4500 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC5204-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	120	Yes	5.5 V	120	CMOS		124	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		3.8 ns	120 CLBS, 4000 Gates		Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 4000-6000	e0	83 MHz	30 s	124	225 °C (437 °F)	29.3116 mm
XC3030-70PC84CSPC0104	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS			3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	9 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				29.3116 mm
XC3020A-7PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.25 V	64	CMOS		64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	5.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		113 MHz		64		27.94 mm
XC3142A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 2000-3000	e0	188 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC5202-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3142A-3PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 2000-3000		270 MHz		74		27.94 mm
XC4004A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		61	3200	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	144 CLBS, 3200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 3200-4000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC4003-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes	5.25 V	100	CMOS		61	2500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 2500-3000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC3030-50PG84ISPC0107	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	100	CMOS			3000	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e3	50 MHz				27.94 mm
XC4010-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS		160	8000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC3164-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS		70	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	224 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3030-100PG84CSPC0107	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	100	CMOS			1500	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000	e3	100 MHz				27.94 mm
XC3142A-09PG84C	Xilinx	FPGA		Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm		1.5 ns	144 CLBS, 2000 Gates			Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 2000-3000		370 MHz		74		27.94 mm
5962-8863801XX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS				5		Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XC3042-70PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3042-70PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		70 MHz		74		27.94 mm
XC6236-2PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	9216	Yes	5.25 V	9216	CMOS			36000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3 ns	9216 CLBS, 36000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	9216 flip-flops; typical gates = 36000-55000	e0	111 MHz				29.3116 mm
XC3142A-2PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.2 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	323 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
5962-8971303MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns		-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XC3042L-8PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	3.6 V	144	CMOS		74	2000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	6.7 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	80 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
5962-8994801XC	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS	MIL-STD-883		2000	5		Grid Array			4.5 V		125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Perpendicular	R-CPGA-P84				No		e4	16 MHz
XC3020-70PC84ISPC0110	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				29.3116 mm
XC4005XL-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS		112	3000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e0	166 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XCS10XL-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196				3000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3		30 s		245 °C (473 °F)	29.3116 mm
XCS05XL-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	100				2000	3.3		Chip Carrier			3 V	1.27 mm			100 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3					29.3116 mm
XC3042-100PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	100 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3030-70PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA		70 MHz		74		27.94 mm
5962-01-414-9645	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic	144	No			CMOS	38535Q/M;38534H;883B	74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P84				No			70 MHz		74
XC3130A-5PG84I	Xilinx	FPGA		Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm		4.1 ns	100 CLBS, 1500 Gates			Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		188 MHz		74		27.94 mm
XC5410-4PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3030-125PG84CSPC0107	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	100	CMOS			1500	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000	e3	125 MHz				27.94 mm
XC4010XL-09PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 7000-20000	e3	217 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3164-3PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes			CMOS		70		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0		30 s	70	225 °C (437 °F)
XC3020-70PC84CSPC0110	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	9 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				29.3116 mm
XC3020-70PG84M	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No		64	CMOS		64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		70 MHz		64		27.94 mm
XC3120-1PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS			1000	5		Chip Carrier			4.75 V	1.27 mm		1.8 ns	64 CLBS, 1000 Gates			Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Typical gates = 1000-1500		323 MHz				29.3116 mm
XC4005E-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS			3000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4008E-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	324	Yes	5.5 V	324	CMOS		144	6000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2 ns	324 CLBS, 6000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 8000 Logic gates	e0	125 MHz	30 s	144	225 °C (437 °F)	29.3116 mm
5962-8994803MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No			CMOS	MIL-STD-883			5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns		-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XC3064-50PC84CSPC0108	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS			6400	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XC3130A-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.7 ns	100 CLBS, 1500 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	270 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
5962-8971302MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		144	CMOS	MIL-STD-883		4200	5		Grid Array				2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)	Gold	Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No		e4	70 MHz				27.94 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.