84 Field Programmable Gate Arrays (FPGA) 988

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3130-3PG84I

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic

100

No

CMOS

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-XPGA-P84

No

74

XC4002A-5PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

5.25 V

64

CMOS

64

1600

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4.5 ns

64 CLBS, 1600 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

256 flip-flops; typical gates = 1600-2000

e0

133.3 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

XC5402L-4PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.3

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC3142L-2PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

3.6 V

144

CMOS

74

2000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

70 °C (158 °F)

2.2 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 2000-3000

e0

325 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC3190A-09PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

5.25 V

320

CMOS

70

5000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

1.5 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 6000 Logic gates

e0

370 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC4005XL-09PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 3000-9000

e0

217 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC3142A-2PG84I

Xilinx

FPGA

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.5 V

144

CMOS

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.2 ns

144 CLBS, 2000 Gates

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Typical gates = 2000-3000

323 MHz

74

27.94 mm

XC3120-4PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

64

1000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

3.3 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 1000-1500

e0

227 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

XC6216-2PC84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

4096

Yes

5.25 V

4096

CMOS

256

16000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

4096 CLBS, 16000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 16000-24000

e0

111 MHz

30 s

256

225 °C (437 °F)

29.3116 mm

XC3042-50PG84B

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

MIL-STD-883 Class B

74

2000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

14 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

50 MHz

74

27.94 mm

XC3020-70PC84CSPC0107

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

64

CMOS

1000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

9 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

256 flip-flops; typical gates = 1000-1500

e0

70 MHz

29.3116 mm

XC4405-3PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC5210-5PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

324

Yes

5.25 V

324

CMOS

196

10000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4.6 ns

324 CLBS, 10000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 16000 Logic gates

e0

83 MHz

30 s

196

225 °C (437 °F)

29.3116 mm

XC4010XL-09CPC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

950

Yes

3.6 V

400

CMOS

61

7000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 10000 Logic gates

e0

217 MHz

30 s

61

225 °C (437 °F)

29.3116 mm

XC4305-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

5

Chip Carrier

1.27 mm

Quad

S-PQCC-J84

5.08 mm

29.3116 mm

No

29.3116 mm

XC5206-6PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

784

Yes

5.5 V

196

CMOS

65

6000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

5.6 ns

196 CLBS, 6000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 10000 Logic gates

e0

83 MHz

30 s

65

225 °C (437 °F)

29.3116 mm

XC4005XL-2PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

3000

3.3

Chip Carrier

3 V

1.27 mm

85 °C (185 °F)

1.5 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e3

179 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3130A-2PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

100

CMOS

1500

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

2.2 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 2000 Logic gates

e3

323 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3090-100PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

320

Yes

5.25 V

320

CMOS

70

5000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

100 MHz

30 s

70

225 °C (437 °F)

29.3116 mm

XC4008-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

770

Yes

5.25 V

324

CMOS

61

6500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4 ns

324 CLBS, 6500 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

936 flip-flops; typical gates = 6500-8000

e0

133.3 MHz

30 s

61

225 °C (437 °F)

29.3116 mm

XC4008E-4PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

324

CMOS

6000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

2.7 ns

324 CLBS, 6000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 8000 Logic gates

e3

111 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC4002XL-1PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

3.6 V

64

CMOS

64

1000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

1.3 ns

64 CLBS, 1000 Gates

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 1600 Logic gates

e0

200 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

XC3142-4PC84C

Xilinx

FPGA

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

74

3000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

70 °C (158 °F)

3.3 ns

144 CLBS, 3000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

e0

230 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC5210-4PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

324

CMOS

10000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

3.8 ns

324 CLBS, 10000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 16000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3142A-1PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

144

CMOS

2000

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

1.75 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 3000 Logic gates

e3

323 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC4008-5PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

770

Yes

5.5 V

324

CMOS

61

6500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

4.5 ns

324 CLBS, 6500 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

936 flip-flops; typical gates = 6500-8000

e0

133.3 MHz

30 s

61

225 °C (437 °F)

29.3116 mm

XC3020-70PG84CSPC0110

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

64

CMOS

2000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

9 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e3

70 MHz

27.94 mm

XC3020A-7PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

64

1000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

5.1 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 1500 Logic gates

e0

113 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

XC3042-70PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

74

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

9 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

70 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

5962-8971302MXC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

MIL-STD-883

74

4200

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

9 ns

144 CLBS, 4200 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

70 MHz

74

27.94 mm

5962-01-416-6251

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic

144

No

CMOS

38535Q/M;38534H;883B

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P84

No

50 MHz

74

XC3042A-7PG84C

Xilinx

FPGA

Other

Pin/Peg

84

HPGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

74

2000

5

5 V

Grid Array, Heat Sink/Slug

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

5.1 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

Max usable 3000 Logic gates

113 MHz

74

27.94 mm

XC3142A-2PCG84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

144

CMOS

2000

5

Chip Carrier

4.5 V

1.27 mm

2.2 ns

144 CLBS, 2000 Gates

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 3000 Logic gates

e3

323 MHz

30 s

245 °C (473 °F)

29.3116 mm

5962-9561002MXC

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

CMOS

MIL-STD-883

74

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

e4

230 MHz

74

27.94 mm

XC4005A-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

196

Yes

5.25 V

196

CMOS

112

4000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

4 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

616 flip-flops; typical gates = 4000-5000

e0

133.3 MHz

30 s

112

225 °C (437 °F)

29.3116 mm

XC5202L-3PCG84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

64

CMOS

2000

3.3

Chip Carrier

3 V

1.27 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 2000-3000

e3

29.3116 mm

XC4002XL-2PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

3.6 V

64

CMOS

64

1000

3.3

3.3 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

3 V

1.27 mm

1.5 ns

64 CLBS, 1000 Gates

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 1600 Logic gates

e0

179 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

XC5206L-3PCG84C

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

6000

3.3

Chip Carrier

3 V

1.27 mm

85 °C (185 °F)

196 CLBS, 6000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Typical gates = 6000-10000

e3

29.3116 mm

XC3020-50PG84ISPC0107

Xilinx

FPGA

Industrial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

2000

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Matte Tin

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e3

50 MHz

27.94 mm

XC3042-100PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

74

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

7 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

100 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC5204-4PC84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

120

Yes

5.25 V

120

CMOS

124

4000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.75 V

1.27 mm

85 °C (185 °F)

3.8 ns

120 CLBS, 4000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

MAX available 6000 Logic gates

e0

83 MHz

30 s

124

225 °C (437 °F)

29.3116 mm

XC3020-50PC84I

Xilinx

FPGA

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

64

2000

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

4.699 mm

29.3116 mm

No

MAX 64 I/OS; 256 flip-flops

e0

50 MHz

30 s

64

225 °C (437 °F)

29.3116 mm

XC3195A-2PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

484

CMOS

6500

5

Chip Carrier

4.75 V

1.27 mm

85 °C (185 °F)

2.2 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

Max usable 7500 Logic gates

e3

323 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC3020-50PG84B

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

64

No

64

CMOS

MIL-STD-883 Class B

64

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

14 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

5.207 mm

27.94 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

50 MHz

64

27.94 mm

XC3130A-4PC84I

Xilinx

FPGA

J Bend

84

QCCJ

Square

Plastic/Epoxy

100

Yes

5.5 V

100

CMOS

74

1500

5

5 V

Chip Carrier

LDCC84,1.2SQ

Field Programmable Gate Arrays

4.5 V

1.27 mm

3.3 ns

100 CLBS, 1500 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 2000 Logic gates

e0

227 MHz

30 s

74

225 °C (437 °F)

29.3116 mm

XC4005XL-1PCG84C

Xilinx

FPGA

Other

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

3000

3.3

Chip Carrier

3 V

1.27 mm

85 °C (185 °F)

1.3 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

Max usable 5000 Logic gates

e3

200 MHz

30 s

245 °C (473 °F)

29.3116 mm

XC2018-70PG84C

Xilinx

FPGA

Other

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

10 ns

100 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

174 flip-flops; typical gates = 1000-1500

70 MHz

74

27.94 mm

XC2018-50PG84C

Xilinx

FPGA

Commercial

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

100

No

5.25 V

100

CMOS

74

1000

5

5 V

Grid Array

PGA84M,11X11

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

15 ns

100 CLBS, 1000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P84

4.318 mm

27.94 mm

No

MAX 74 I/OS; 174 flip-flops; typical gates = 1000 - 1500

50 MHz

74

27.94 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.