84 Field Programmable Gate Arrays (FPGA) 988

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3030-125PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	125 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC3090-50PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.5 V	320	CMOS		70	9000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 70 I/OS; 928 flip-flops	e0	50 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3142A-5PG84I	Xilinx	FPGA		Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS		74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm		4.1 ns	144 CLBS, 2000 Gates			Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 2000-3000		188 MHz		74		27.94 mm
XC3390L-8PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC5206L-5PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			6000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e0					29.3116 mm
XC5406L-4PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes							3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3120-3PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS		64	1000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	2.7 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		270 MHz		64		27.94 mm
5962-8863801MXX	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No				MIL-STD-883					Grid Array				2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No							27.94 mm
XC5206-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS			6000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3.8 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3130A-1PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.8 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		323 MHz		74		27.94 mm
XC6264-2PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	16384	CMOS			64000	5		Chip Carrier			4.5 V	1.27 mm			16384 CLBS, 64000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	16384 flip-flops; typical gates = 64000-100000	e3	111 MHz				29.3116 mm
XC3130A-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	227 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XCS10XL-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS		112	3000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s	112	225 °C (437 °F)	29.3116 mm
XC4010E-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	400	CMOS			7000	5		Chip Carrier			4.5 V	1.27 mm		2 ns	400 CLBS, 7000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC2018-33PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS		74		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-XPGA-P84				No			33 MHz		74
XC4005L-6PCG84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS			3000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)		196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 3000-9000	e3					29.3116 mm
XC4005XL-09CPGC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			3000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	217 MHz				29.3116 mm
XC3020A-7PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS			1000	5		Chip Carrier			4.5 V	1.27 mm		5.1 ns	64 CLBS, 1000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 1500 Logic gates	e3	113 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC5402-4PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3020-50PG84BSPC0110	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	64	CMOS			2000	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	14 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.94 mm
XC3020-70PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	70 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC4008E-4PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	324	CMOS			6000	5		Chip Carrier			4.5 V	1.27 mm		2.7 ns	324 CLBS, 6000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 8000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3064-70PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS		70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	9 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	70 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC4010L-5PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS			7000	5		Chip Carrier			4.75 V	1.27 mm			400 CLBS, 7000 Gates			Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	Typical gates = 7000-20000						29.3116 mm
XC3090A-6PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS			5000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 6000 Logic gates	e3	135 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC5210-6PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	324	Yes	5.5 V	324	CMOS		196	10000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		5.6 ns	324 CLBS, 10000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	29.3116 mm
XC3042-50PG84C	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		74	4200	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 480 flip-flops		50 MHz		74		27.94 mm
XC4003E-1PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	166 MHz	30 s	80	225 °C (437 °F)	29.3116 mm
XC3030A-7PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		113 MHz		74		27.94 mm
XC4005A-6PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS		112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC5206L-6PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			6000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 6000-10000	e0					29.3116 mm
XC3190-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.5 V	320	CMOS		70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	190 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
5962-01-425-4363	Xilinx	FPGA	Commercial	Pin/Peg	84	PGA	Square	Ceramic	64	No			CMOS		64		5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P84				No			70 MHz		64
XC3142A-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e0	227 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC4403-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS				5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC4005E-1PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS			3000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.3 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4002XL-09CPCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS			1000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 1600 Logic gates	e3	217 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3030-100PC84CSPC0104	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS			3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		100 MHz				29.3116 mm
XC4006-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	608	Yes	5.25 V	256	CMOS		61	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	6 ns	256 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	768 flip-flops; typical gates = 5000-6000	e0	90.9 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC2018-130PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		74	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	174 flip-flops; typical gates = 1000-1500	e0	130 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC5202-5PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		84	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		4.6 ns	64 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	225 °C (437 °F)	29.3116 mm
XC3030-100PG84MSPC0107	Xilinx	FPGA	Military	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No		100	CMOS			1500	5		Grid Array				2.54 mm	125 °C (257 °F)	7 ns	100 CLBS, 1500 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	360 flip-flops; typical gates = 1500-2000	e3	100 MHz				27.94 mm
XC6236-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	9216	Yes	5.5 V	9216	CMOS			36000	5		Chip Carrier			4.5 V	1.27 mm	100 °C (212 °F)	3 ns	9216 CLBS, 36000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	9216 flip-flops; typical gates = 36000-55000	e0	111 MHz				29.3116 mm
XC4006E-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	256	Yes	5.25 V	256	CMOS		128	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	125 MHz	30 s	128	225 °C (437 °F)	29.3116 mm
XC3042A-6PG84C	Xilinx	FPGA	Other	Pin/Peg	84	HPGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		74	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Max usable 3000 Logic gates		135 MHz		74		27.94 mm
XC4003E-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			2000	5		Chip Carrier			4.5 V	1.27 mm		2 ns	100 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3130A-5PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS		74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		188 MHz		74		27.94 mm
XC6216-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	4096	Yes	5.5 V	4096	CMOS		256	16000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm			4096 CLBS, 16000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 16000-24000	e0	111 MHz	30 s	256	225 °C (437 °F)	29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.