GQFF Field Programmable Gate Arrays (FPGA) 335

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
RT3PE3000L-1CQ256PROTO	Microchip Technology	FPGA		Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	75264	CMOS			3000000	1.2		Flatpack, Guard Ring			1.14 V	.5 mm			75264 CLBS, 3000000 Gates			Quad	S-CQFP-F256		3.3 mm	36 mm								36 mm
RT3PE3000L-CQ256PROTO	Microchip Technology	FPGA		Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	1.575 V	75264	CMOS			3000000	1.2		Flatpack, Guard Ring			1.14 V	.5 mm			75264 CLBS, 3000000 Gates		Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm			e0		20 s		225 °C (437 °F)	36 mm
RT3PE3000L-1CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2	1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F256		3.3 mm	36 mm	No			250 MHz				36 mm
RT3PE3000L-CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2	1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No		e0	250 MHz	20 s		225 °C (437 °F)	36 mm
RT4G150-CQ352B	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-STD-883 Class B	166		1.2		Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
RT4G150-CQ352E	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V				166		1.2		Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
RT4G150-CQ352V	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-PRF-38535 Class V	166		1.2		Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
5962-0151801QYC	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.75 V		CMOS	MIL-PRF-38535 Class Q		32000	2.5		Flatpack, Guard Ring			2.25 V	.5 mm	125 °C (257 °F)		32000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F208		3.22 mm	29.21 mm	No	2.5 V, 3.3 V, and 5.0 V mixed voltage operation	e4					29.21 mm
A42MX36-1CQ208	Microchip Technology	FPGA	Commercial	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2438	CMOS			54000	3.3		Flatpack, Guard Ring			3 V	.5 mm	70 °C (158 °F)	2.3 ns	2438 CLBS, 54000 Gates	0 °C (32 °F)		Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply		83 MHz				29.21 mm
A42MX36-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	2414	Yes	3.6 V	2438	CMOS			54000	3.3		Flatpack, Guard Ring			3 V	.5 mm	70 °C (158 °F)	2.7 ns	2438 CLBS, 54000 Gates	0 °C (32 °F)		Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply		73 MHz				29.21 mm
APA1000-CQ208B	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	56320	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	1000000	2.5	2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
APA1000-CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	56320	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	1000000	2.5	2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
APA600-CQ208B	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	21504	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	600000	2.5	2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
5962-0151802QYC	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.75 V		CMOS	MIL-PRF-38535 Class Q		32000	2.5		Flatpack, Guard Ring			2.25 V	.5 mm	125 °C (257 °F)		32000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F208		3.22 mm	29.21 mm	No	2.5 V, 3.3 V, and 5.0 V mixed voltage operation	e4					29.21 mm
A42MX36-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	2414	Yes	3.6 V	2438	CMOS			54000	3.3		Flatpack, Guard Ring			3 V	.5 mm	125 °C (257 °F)	2.3 ns	2438 CLBS, 54000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	Also Operates at 5 V supply	e0	83 MHz				29.21 mm
AX250-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	4224	Yes	1.575 V	2816	CMOS	MIL-STD-883 Class B	248	250000	1.5	1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	2816 CLBS, 250000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	250000 system gates avaiable	e0	763 MHz		248		29.21 mm
AX500-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	8064	Yes	1.575 V	5376	CMOS	MIL-STD-883 Class B	336	500000	1.5	1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	5376 CLBS, 500000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	500000 system gates avaiable	e0	763 MHz		336		29.21 mm
RTSX32SUCQ84B	Microchip Technology	FPGA	Military	Flat	84	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	227	48000	2.5	2.5,3.3/5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	2.25 V	.635 mm	125 °C (257 °F)	1.4 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F84		2.4 mm	16.51 mm	No	32000 typical gates available	e0	310 MHz	20 s	227	225 °C (437 °F)	16.51 mm
RTSX32SU-CQ84B	Microsemi	FPGA	Military	Flat	84	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	227	48000	2.5	2.5,3.3/5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	2.25 V	.635 mm	125 °C (257 °F)	1.4 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F84		2.4 mm	16.51 mm	No	32000 typical gates available	e0	310 MHz	20 s	227	225 °C (437 °F)	16.51 mm
APA600-CQ208M	Microchip Technology	FPGA	Military	Flat	208	GQFF	Square		Ceramic, Metal-Sealed Cofired	21504	Yes	2.7 V		CMOS	MIL-STD-883 Class B	158	600000	2.5	2.5,2.5/3.3 V	Flatpack, Guard Ring	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		600000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No		e0	180 MHz		158		29.21 mm
XQVR300-4CB228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q	316	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
RTAX2000S-1CQ352PROTO	Microchip Technology	FPGA		Flat	352	GQFF	Square	300k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	1.575 V		CMOS		198	2000000	1.5		Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.425 V	.5 mm			2000000 Gates			Quad	S-CQFP-F352		2.89 mm	48 mm				649 MHz		198		48 mm
AX2000-1CQ352M	Microchip Technology	FPGA	Military	Flat	352	GQFF	Square		Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class B	684	2000000	1.5	1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	2000000 system gates avaiable	e0	763 MHz		684		48 mm
5962-9096401MZX	Texas Instruments	FPGA	Military	Flat	84	GQFF	Square		Ceramic, Metal-Sealed Cofired	295	Yes	5.5 V		CMOS	MIL-STD-883 Class B	57	1200	5	5 V	Flatpack, Guard Ring	TPAK84,1.63SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		1200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F84		3.302 mm	16.51 mm	No					57		16.51 mm
5962-9215601MYX	Texas Instruments	FPGA	Military	Flat	172	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1232	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	6.1 ns	1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172		2.9464 mm	29.972 mm	No			41 MHz				29.972 mm
5962-9215602MYX	Texas Instruments	FPGA	Military	Flat	172	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1232	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	5.2 ns	1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172		2.9464 mm	29.972 mm	No			60 MHz				29.972 mm
5962-9215601MYA	Texas Instruments	FPGA	Military	Flat	172	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1232	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	6.1 ns	8000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F172		3.175 mm	29.972 mm	No		e0	41 MHz	30 s		225 °C (437 °F)	29.972 mm
5962-9215602MYA	Texas Instruments	FPGA	Military	Flat	172	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	1232	CMOS			8000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	5.2 ns	8000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F172		3.175 mm	29.972 mm	No		e0	60 MHz	30 s		225 °C (437 °F)	29.972 mm
5962-9225202MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes		196	CMOS	MIL-STD-883	112	4000	5	5 V	Flatpack, Guard Ring	TPAK164,2.5SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)		196 CLBS, 4000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			112		28.702 mm
5962-8971303MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No							19.05 mm
5962-9230503MZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired	950	Yes			CMOS	MIL-STD-883	160		5	5 V	Flatpack, Guard Ring	QFL196,1.4SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4	77 MHz		160		28.702 mm
5962-9471202MZX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	238	Yes			CMOS	MIL-STD-883	77		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	90.9 MHz		77		19.05 mm
5962-9851301QZB	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS	MIL-PRF-38535 Class Q		10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 30000	e0	166 MHz				39.37 mm
XC3120-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS		64	1300	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800		190 MHz		64		19.05 mm
XC3090-70CB164MSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	70 MHz				28.702 mm
5962-9225203MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	466	Yes			CMOS	MIL-STD-883	112		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	133.3 MHz		112		28.702 mm
XC3090-70CB164CSPC0107	Xilinx	FPGA	Other	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS			5000	5		Flatpack, Guard Ring			4.75 V	.65 mm	85 °C (185 °F)	9 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	70 MHz				28.702 mm
XC3042-70CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS		82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz		82		19.05 mm
5962-8994801MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
5962-9851301QY	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 10000 to 30000		166 MHz				39.37 mm
5962-9225201MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4					28.702 mm
XC3090-70CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes		320	CMOS		142	5000	5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	70 MHz		142		28.702 mm
5962-9752301QZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-PRF-38535 Class Q	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000	e4	111 MHz		160		34.29 mm
5962-8971302MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC3020-70CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS		64	1000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		70 MHz		64		19.05 mm
XC3042-50CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		144	CMOS			2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		144 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000		50 MHz				19.05 mm
XQVR600-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	15552	Yes	2.625 V	3456	CMOS		316	661111	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	QFP228(UNSPEC)	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			316		39.37 mm
5962-8982303MTX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No							28.702 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.