GQFF Field Programmable Gate Arrays (FPGA) 335

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5962-9850901QZX

Xilinx

FPGA

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

MIL-PRF-38535 Class Q

3.3

Flatpack, Guard Ring

3 V

.635 mm

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

5962-8994803MNC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

5.5 V

CMOS

MIL-STD-883

64

2000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

7 ns

2000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.2258 mm

19.05 mm

No

e4

100 MHz

64

19.05 mm

5962-9957301QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

3456

CMOS

MIL-PRF-38535 Class Q

661111

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

3456 CLBS, 661111 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

Yes

39.37 mm

XQVR300-4CBG228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

5962-9851101QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

40000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 130000

166 MHz

39.37 mm

5962-9561202MYX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

28.702 mm

5962-9473002MYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

5962R9957201QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

6912

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

162

322970

2.5

1.2/3.6,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

322970 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.37 mm

Yes

e4

162

39.37 mm

XC3020-70CB100MSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

64

CMOS

1000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500

70 MHz

19.05 mm

5962-9225203MZC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

CMOS

MIL-STD-883

112

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

133.3 MHz

112

28.702 mm

XQ4005E-4CB164M

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

MIL-PRF-38535

112

3000

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.7 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

3.302 mm

28.702 mm

No

Maximum usable gates = 9000

e0

111 MHz

112

28.702 mm

XQVR600-4CBG228V

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

3456

CMOS

661111

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

3456 CLBS, 661111 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

XC3020-50CB100MSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

64

CMOS

1000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500

50 MHz

19.05 mm

5962-8994802MNC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

5962-9752201QZC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

MIL-PRF-38535 Class Q

112

3000

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

Typical gates = 3000-9000

e4

111 MHz

112

28.702 mm

5962-9851101QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

40000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 130000

166 MHz

39.37 mm

5962-8971303MMC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

5.5 V

CMOS

MIL-STD-883

82

4200

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

4200 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.2258 mm

19.05 mm

No

e4

100 MHz

82

19.05 mm

XC3090-100CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

320

CMOS

MIL-STD-883 Class B

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

7 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

3.302 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

100 MHz

142

28.702 mm

5962-8982301MTC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

CMOS

MIL-STD-883

142

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

50 MHz

142

28.702 mm

XQ4013XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

1368

Yes

3.6 V

576

CMOS

MIL-PRF-38535

192

10000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

1

3.302 mm

39.37 mm

No

Typical gates = 10000 to 30000

e0

166 MHz

192

39.37 mm

5962-9561102MYC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

CMOS

MIL-STD-883

142

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

230 MHz

142

28.702 mm

5962-9471202MZC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

XC4005-6CB164M

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

112

4000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

4.5 V

.65 mm

125 °C (257 °F)

6 ns

196 CLBS, 4000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

2.921 mm

28.702 mm

No

616 flip-flops; typical gates = 4000-5000

e0

90.9 MHz

112

28.702 mm

XC3042-50CB100BSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

144

CMOS

2000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000

50 MHz

19.05 mm

XQV300-4CB228Q

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

39.37 mm

XC4013-10CB228B

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

576

MIL-STD-883 Class B

13000

5

Flatpack, Guard Ring

4.5 V

.65 mm

125 °C (257 °F)

576 CLBS, 13000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

5962-9752401QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

576

MIL-PRF-38535 Class Q

10000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 10000-30000

39.37 mm

5962-9225203MYX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

28.702 mm

5962-9851301QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

576

CMOS

MIL-PRF-38535 Class Q

10000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 30000

166 MHz

39.37 mm

5962R9957201QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

Yes

39.37 mm

5962-9561002MYC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

CMOS

MIL-STD-883

82

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

230 MHz

82

19.05 mm

5962-8982303MZC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

5.5 V

CMOS

MIL-STD-883

142

9000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

7 ns

9000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

100 MHz

142

28.702 mm

XC3142A-4CB100B

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

144

CMOS

MIL-STD-883 Class B

2000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

3.3 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

3000 Logic gates can also be used

19.05 mm

5962-9752401QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

576

MIL-PRF-38535 Class Q

10000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 10000-30000

39.37 mm

XC4010-10CB196B

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

400

CMOS

MIL-STD-883 Class B

8000

5

Flatpack, Guard Ring

4.5 V

.65 mm

125 °C (257 °F)

400 CLBS, 8000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F196

3.302 mm

28.702 mm

No

1120 flip-flops; typical gates = 8000-10000

28.702 mm

XC3120-5CB100B

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

64

CMOS

38535Q/M;38534H;883B

64

1300

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

64 CLBS, 1300 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

1

2.921 mm

19.05 mm

No

MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800

190 MHz

64

19.05 mm

5962-9957501QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

3136

CMOS

MIL-PRF-38535 Class Q

55000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.3 ns

3136 CLBS, 55000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e4

200 MHz

39.37 mm

XC3042-70CB100CSPC0107

Xilinx

FPGA

Other

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

144

CMOS

2000

5

Flatpack, Guard Ring

4.75 V

.65 mm

85 °C (185 °F)

9 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000

e0

70 MHz

19.05 mm

XC4005-6CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

MIL-STD-883 Class B

112

4000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

4.5 V

.65 mm

125 °C (257 °F)

6 ns

196 CLBS, 4000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

616 flip-flops; typical gates = 4000-5000

e0

90.9 MHz

112

28.702 mm

5962-9473002MZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

5962-9230501MZC

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F196

3.302 mm

28.702 mm

No

e4

28.702 mm

5962-9230502MYX

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

6 ns

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F196

3.302 mm

28.702 mm

No

e4

28.702 mm

XC3020-100CB100CSPC0107

Xilinx

FPGA

Other

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

64

CMOS

1000

5

Flatpack, Guard Ring

4.75 V

.65 mm

85 °C (185 °F)

7 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500

e0

100 MHz

19.05 mm

XC4013E-4CBG228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

576

CMOS

10000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

2.7 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 10000-30000

e3

111 MHz

39.37 mm

5962R9957301QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

3456

CMOS

MIL-PRF-38535 Class Q

661111

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

3456 CLBS, 661111 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

Yes

39.37 mm

5962-8994802MNX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

5962-9752501QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

1024

CMOS

MIL-PRF-38535 Class Q

192

15000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 15000-45000

e4

192

39.37 mm

XC4003A-6CB100B

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

238

Yes

5.5 V

100

CMOS

MIL-STD-883 Class B

77

2500

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

4.5 V

.65 mm

125 °C (257 °F)

6 ns

100 CLBS, 2500 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

1

3.429 mm

19.05 mm

No

360 flip-flops; typical gates = 2500-3000

90.9 MHz

77

19.05 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.