GQFF Field Programmable Gate Arrays (FPGA) 335

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3090-70CB164BSPC0107

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

320

CMOS

5000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

2.921 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000

70 MHz

28.702 mm

XC3090-100CB164BSPC0107

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

320

CMOS

5000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

7 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

2.921 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000

e0

100 MHz

28.702 mm

XC3090-50CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

320

CMOS

MIL-STD-883 Class B

5000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

50 MHz

28.702 mm

5962-8994801MMC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

XC3042-70CB100B

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

144

CMOS

MIL-STD-883 Class B

82

2000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

9 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

1

3.429 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

70 MHz

82

19.05 mm

5962-9230501MZX

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F196

3.302 mm

28.702 mm

No

e4

28.702 mm

XC4005-5CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

196

MIL-STD-883 Class B

3000

5

Flatpack, Guard Ring

4.5 V

.65 mm

125 °C (257 °F)

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

28.702 mm

XC3090-50CB164BSPC0107

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

320

CMOS

5000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

2.921 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000

50 MHz

28.702 mm

5962-9230502MZX

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

400

CMOS

8000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

400 CLBS, 8000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F196

3.302 mm

28.702 mm

No

28.702 mm

5962-9561201MZX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

28.702 mm

XC3020-100CB100B

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

64

CMOS

MIL-STD-883 Class B

64

1000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

7 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

1

3.429 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

e0

100 MHz

64

19.05 mm

XQV300-4CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

6912

Yes

2.625 V

1536

CMOS

MIL-PRF-38535

162

322970

2.5

1.2/3.6,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

162

39.37 mm

5962-8982302MZX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

320

CMOS

MIL-STD-883

5000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

70 MHz

28.702 mm

XC3042-100CB100CSPC0107

Xilinx

FPGA

Other

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

144

CMOS

2000

5

Flatpack, Guard Ring

4.75 V

.65 mm

85 °C (185 °F)

7 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000

e0

100 MHz

19.05 mm

5962-9851001QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

3078

Yes

3.6 V

1296

CMOS

MIL-PRF-38535 Class Q

192

22000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 65000

e4

166 MHz

192

39.37 mm

5962-9752301QZX

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

400

MIL-PRF-38535 Class Q

7000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

400 CLBS, 7000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F196

3.302 mm

34.29 mm

No

Typical gates = 7000-20000

34.29 mm

XQ4028EX-4CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

1024

CMOS

MIL-PRF-38535

256

18000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.2 ns

1024 CLBS, 18000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

1

3.302 mm

39.37 mm

No

Maximum usable gates = 50000

e0

143 MHz

256

39.37 mm

XC3020-50CB100BSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

64

CMOS

1000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500

50 MHz

19.05 mm

5962-9230502MZA

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

400

CMOS

MIL-STD-883

8000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

400 CLBS, 8000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F196

3.302 mm

28.702 mm

No

e4

28.702 mm

5962-9561002MZC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

CMOS

MIL-STD-883

82

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

230 MHz

82

19.05 mm

5962-9850901QZX

Xilinx

FPGA

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

MIL-PRF-38535 Class Q

3.3

Flatpack, Guard Ring

3 V

.635 mm

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

5962-8994803MNC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

5.5 V

CMOS

MIL-STD-883

64

2000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

7 ns

2000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.2258 mm

19.05 mm

No

e4

100 MHz

64

19.05 mm

5962-9957301QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

3456

CMOS

MIL-PRF-38535 Class Q

661111

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

3456 CLBS, 661111 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

Yes

39.37 mm

XQVR300-4CBG228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

5962-9851101QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

40000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 130000

166 MHz

39.37 mm

5962-9561202MYX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

28.702 mm

5962-9473002MYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

5962R9957201QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

6912

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

162

322970

2.5

1.2/3.6,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

322970 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.37 mm

Yes

e4

162

39.37 mm

XC3020-70CB100MSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

64

CMOS

1000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500

70 MHz

19.05 mm

5962-9225203MZC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

CMOS

MIL-STD-883

112

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

133.3 MHz

112

28.702 mm

XQ4005E-4CB164M

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

MIL-PRF-38535

112

3000

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.7 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

3.302 mm

28.702 mm

No

Maximum usable gates = 9000

e0

111 MHz

112

28.702 mm

XQVR600-4CBG228V

Xilinx

FPGA

Military

Flat

228

GQFF

Square

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

3456

CMOS

661111

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

3456 CLBS, 661111 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

XC3020-50CB100MSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

64

CMOS

1000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500

50 MHz

19.05 mm

5962-8994802MNC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

5962-9752201QZC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

MIL-PRF-38535 Class Q

112

3000

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

Typical gates = 3000-9000

e4

111 MHz

112

28.702 mm

5962-9851101QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

40000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 130000

166 MHz

39.37 mm

5962-8971303MMC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

5.5 V

CMOS

MIL-STD-883

82

4200

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

4200 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.2258 mm

19.05 mm

No

e4

100 MHz

82

19.05 mm

XC3090-100CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

320

CMOS

MIL-STD-883 Class B

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

7 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

3.302 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

100 MHz

142

28.702 mm

5962-8982301MTC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

CMOS

MIL-STD-883

142

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

50 MHz

142

28.702 mm

XQ4013XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

1368

Yes

3.6 V

576

CMOS

MIL-PRF-38535

192

10000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

1

3.302 mm

39.37 mm

No

Typical gates = 10000 to 30000

e0

166 MHz

192

39.37 mm

5962-9561102MYC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

CMOS

MIL-STD-883

142

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

230 MHz

142

28.702 mm

5962-9471202MZC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

XC4005-6CB164M

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

112

4000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

4.5 V

.65 mm

125 °C (257 °F)

6 ns

196 CLBS, 4000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

2.921 mm

28.702 mm

No

616 flip-flops; typical gates = 4000-5000

e0

90.9 MHz

112

28.702 mm

XC3042-50CB100BSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

144

CMOS

2000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000

50 MHz

19.05 mm

XC3142-5CB100M

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

144

CMOS

82

3000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

144 CLBS, 3000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

1

2.921 mm

19.05 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

e0

190 MHz

82

19.05 mm

5962-9957201QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

1536

CMOS

MIL-PRF-38535 Class Q

322970

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

1536 CLBS, 322970 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

Yes

39.37 mm

5962-9850901QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

CMOS

MIL-PRF-38535 Class Q

192

28000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.2 ns

28000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.68 mm

No

e4

143 MHz

192

39.68 mm

5962-9851101QX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

2304

CMOS

MIL-PRF-38535

40000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 40000 to 130000

166 MHz

39.37 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.