GQFF Field Programmable Gate Arrays (FPGA) 335

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5962-9850901QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2432

Yes

5.5 V

CMOS

MIL-PRF-38535 Class Q

192

28000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.2 ns

28000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.68 mm

No

e4

143 MHz

192

39.68 mm

5962-9561101MZC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

CMOS

MIL-STD-883

142

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

190 MHz

142

28.702 mm

5962-9851001QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

1296

CMOS

MIL-PRF-38535 Class Q

22000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 65000

166 MHz

39.37 mm

5962-9851101QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

5472

Yes

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

192

40000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 130000

e4

166 MHz

192

39.37 mm

XQ4013E-4CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

1368

Yes

5.5 V

576

CMOS

MIL-PRF-38535

192

10000

5

5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.7 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates = 30000

e0

111 MHz

192

39.37 mm

XC3042-70CB100BSPC0107

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

144

CMOS

2000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

9 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000

70 MHz

19.05 mm

5962-8982303MZX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

7 ns

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

28.702 mm

XC3190A-5CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

320

CMOS

38535Q/M;38534H;883B

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

Typical gates = 5000-6000

e0

188 MHz

142

28.702 mm

5962-9561001MYX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

144

CMOS

MIL-STD-883

2000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

4.1 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

Typical gates = 2000-3000

e4

188 MHz

19.05 mm

XC4036XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

1296

CMOS

22000

3.3

Flatpack, Guard Ring

3 V

.65 mm

125 °C (257 °F)

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

XC3042-70CB100C

Xilinx

FPGA

Other

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

5.25 V

144

CMOS

82

2000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

9 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Quad

S-CQFP-F100

1

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

70 MHz

82

19.05 mm

5962-9850901QYB

Xilinx

FPGA

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

MIL-PRF-38535 Class Q

3.3

Flatpack, Guard Ring

3 V

.635 mm

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

39.37 mm

XQV600-4CBG228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

2.625 V

3456

CMOS

MIL-PRF-38535

661111

2.5

Flatpack, Guard Ring

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

3456 CLBS, 661111 Gates

-55 °C (-67 °F)

Matte Tin

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e3

39.37 mm

XQR4036XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

60k Rad(Si)

Ceramic, Metal-Sealed Cofired

3078

Yes

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

1

3.302 mm

39.37 mm

No

Typical gates = 22000 to 65000

e0

166 MHz

288

39.37 mm

XQ4085XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

3136

55000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

2.9 ns

3136 CLBS, 55000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 180000

e0

166 MHz

39.37 mm

XC4005E-4CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

MIL-STD-883 Class B

112

3000

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.65 mm

125 °C (257 °F)

2.7 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

3.302 mm

28.702 mm

No

Typical gates = 3000-9000

e0

111 MHz

112

28.702 mm

5962-9752201QYX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

196

MIL-PRF-38535 Class Q

3000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

Typical gates = 3000-9000

28.702 mm

5962-9225202MZC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

CMOS

MIL-STD-883

112

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

6 ns

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

112

28.702 mm

5962-8994801MNX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

19.05 mm

5962-9850901QZB

Xilinx

FPGA

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

MIL-PRF-38535 Class Q

3.3

Flatpack, Guard Ring

3 V

.635 mm

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

39.37 mm

5962-8982301MZX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

320

CMOS

MIL-STD-883

5000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

50 MHz

28.702 mm

5962-9561201MYC

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

484

Yes

484

CMOS

MIL-STD-883

142

6500

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

Typical gates = 6500-7500

e4

188 MHz

142

28.702 mm

5962-9561102MYX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

28.702 mm

5962-9851101QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

5472

Yes

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

192

40000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 130000

e4

166 MHz

192

39.37 mm

5962-9752501QYX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

1024

MIL-PRF-38535 Class Q

15000

5

Flatpack, Guard Ring

4.5 V

.635 mm

125 °C (257 °F)

3.9 ns

1024 CLBS, 15000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Typical gates = 15000-45000

39.37 mm

XC4013-6CB228B

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

576

MIL-STD-883 Class B

13000

5

Flatpack, Guard Ring

4.5 V

.65 mm

125 °C (257 °F)

576 CLBS, 13000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

39.37 mm

XC3090-70CB164B

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

320

CMOS

MIL-STD-883 Class B

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

9 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

3.302 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

70 MHz

142

28.702 mm

5962-9957301QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

15552

Yes

2.625 V

3456

CMOS

MIL-PRF-38535 Class Q

162

661111

2.5

1.2/3.6,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

661111 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.0226 mm

39.37 mm

Yes

e4

162

39.37 mm

5962-8982302MTX

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F164

3.302 mm

28.702 mm

No

e4

28.702 mm

5962-9851001QZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

1296

CMOS

MIL-PRF-38535 Class Q

22000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 65000

166 MHz

39.37 mm

XQV100-4CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

2700

Yes

2.625 V

600

CMOS

MIL-PRF-38535

162

108904

2.5

1.5/3.3,2.5 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

2.375 V

.635 mm

125 °C (257 °F)

0.8 ns

600 CLBS, 108904 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e0

162

39.37 mm

5962-9851301QZA

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

576

CMOS

10000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 30000

e0

166 MHz

39.37 mm

XQ4010E-4CB196M

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

950

Yes

5.5 V

400

CMOS

MIL-PRF-38535

160

7000

5

5 V

Flatpack, Guard Ring

TPAK196,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.7 ns

400 CLBS, 7000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F196

3.302 mm

34.29 mm

No

Maximum usable gates = 20000

e0

111 MHz

160

34.29 mm

XC3090-100CB164C

Xilinx

FPGA

Other

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

5.25 V

320

CMOS

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Quad

S-CQFP-F164

2.921 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

100 MHz

142

28.702 mm

5962-9473001MZX

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

e4

39.37 mm

5962-9851101QYB

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

2304

CMOS

MIL-PRF-38535 Class Q

40000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

2304 CLBS, 40000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 130000

e0

166 MHz

39.37 mm

XC3090-100CB164CSPC0107

Xilinx

FPGA

Other

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

320

CMOS

5000

5

Flatpack, Guard Ring

4.75 V

.65 mm

85 °C (185 °F)

7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F164

2.921 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000

e0

100 MHz

28.702 mm

5962-9851001QZC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

3078

Yes

3.6 V

1296

CMOS

MIL-PRF-38535 Class Q

192

22000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 65000

e4

166 MHz

192

39.37 mm

5962-9851001QZB

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

3.6 V

1296

CMOS

MIL-PRF-38535 Class Q

22000

3.3

Flatpack, Guard Ring

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 65000

e0

166 MHz

39.37 mm

XC3090-100CB164M

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

320

Yes

320

CMOS

142

5000

5

5 V

Flatpack, Guard Ring

TAPEPAK,164P,.025

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

7 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

2.921 mm

28.702 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

100 MHz

142

28.702 mm

5962-9230503MZX

Xilinx

FPGA

Military

Flat

196

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F196

3.302 mm

28.702 mm

No

28.702 mm

5962-9851301QYC

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

1368

Yes

3.6 V

576

CMOS

MIL-PRF-38535 Class Q

192

10000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

576 CLBS, 10000 Gates

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F228

3.302 mm

39.37 mm

No

Maximum usable gates 30000

e4

166 MHz

192

39.37 mm

XC3042-100CB100M

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

144

CMOS

82

2000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

7 ns

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

1

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

100 MHz

82

19.05 mm

5962-8971301M9C

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

CMOS

MIL-STD-883

82

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

50 MHz

82

19.05 mm

5962-9561002MZX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

5962-9471201MZC

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

19.05 mm

XQ4036XL-3CB228M

Xilinx

FPGA

Military

Flat

228

GQFF

Square

Ceramic, Metal-Sealed Cofired

3078

Yes

3.6 V

1296

CMOS

MIL-PRF-38535

192

22000

3.3

3.3 V

Flatpack, Guard Ring

TPAK228,2.5SQ,25

Field Programmable Gate Arrays

3 V

.635 mm

125 °C (257 °F)

1.6 ns

1296 CLBS, 22000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F228

1

3.302 mm

39.37 mm

No

Typical gates = 22000 to 65000

e0

166 MHz

192

39.37 mm

XC4005E-4CB164M

Xilinx

FPGA

Military

Flat

164

GQFF

Square

Ceramic, Metal-Sealed Cofired

466

Yes

5.5 V

196

CMOS

112

3000

5

5 V

Flatpack, Guard Ring

TPAK164,2.5SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

2.7 ns

196 CLBS, 3000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F164

1

3.302 mm

28.702 mm

No

Typical gates = 3000-9000

e0

111 MHz

112

28.702 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.