GQFF Field Programmable Gate Arrays (FPGA) 335

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
5962-8994803MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V		CMOS	MIL-STD-883	64	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.2258 mm	19.05 mm	No		e4	100 MHz	64	19.05 mm
XQV600-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535	162	661111	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0		162	39.37 mm
5962-9561202MYC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	484	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	230 MHz	142	28.702 mm
XC3142-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS		82	3000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	82	19.05 mm
5962-9957201QZX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	1536	CMOS	MIL-PRF-38535 Class Q		322970	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	Yes					39.37 mm
5962-9850901QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V		CMOS	MIL-PRF-38535 Class Q	192	28000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.2 ns	28000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.0226 mm	39.68 mm	No		e4	143 MHz	192	39.68 mm
5962-9851101QX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	2304	CMOS	MIL-PRF-38535		40000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 40000 to 130000		166 MHz		39.37 mm
5962-9561001MZX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4			19.05 mm
5962-9957501QX	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	3136	CMOS	MIL-PRF-38535		55000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.3 ns	3136 CLBS, 55000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 55000 to 180000		200 MHz		39.37 mm
5962-9561101MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS	MIL-STD-883		5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	4.1 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	Typical gates = 5000-6000	e4	188 MHz		28.702 mm
XC3090-50CB164M	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		50 MHz		28.702 mm
XC3120A-5CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS		64	1300	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800		190 MHz	64	19.05 mm
5962-9752401QZC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes	5.5 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 10000-30000	e4	111 MHz	192	39.37 mm
XQR4062XL-3CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square	60k Rad(Si)	Ceramic, Metal-Sealed Cofired	5472	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Typical gates = 40000 to 130000	e0	166 MHz	384	39.37 mm
XC4025E-4CB228B	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V	1024	CMOS	MIL-STD-883 Class B	192	15000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	2.7 ns	1024 CLBS, 15000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Typical gates = 15000-45000	e0	111 MHz	192	39.37 mm
XC4003A-10CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	100	CMOS	MIL-STD-883 Class B		2500	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		100 CLBS, 2500 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		3.429 mm	19.05 mm	No	360 flip-flops; typical gates = 2500-3000				19.05 mm
5962-9230501MYC	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4			28.702 mm
5962-9851001QY	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	3.6 V	1296	CMOS	MIL-PRF-38535		22000	3.3		Flatpack, Guard Ring			3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 22000 to 65000		166 MHz		39.37 mm
XC3020-100CB100M	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS		64	1000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	100 MHz	64	19.05 mm
5962-9561102MZC	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired	320	Yes			CMOS	MIL-STD-883	142		5	5 V	Flatpack, Guard Ring	TAPEPAK,164P,.025	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	230 MHz	142	28.702 mm
XQVR600-4CBG228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q		661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)		3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e3			39.37 mm
XQV600-4CB228Q	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	2.625 V	3456	CMOS	MIL-PRF-38535 Class Q		661111	2.5		Flatpack, Guard Ring			2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0			39.37 mm
5962-9225201MYX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			28.702 mm
5962-8994802MMX	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4			19.05 mm
XC4010E-4CBG196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400	CMOS			7000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000	e3	111 MHz		34.29 mm
5962-9225202MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			28.702 mm
5962-9752401QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	1368	Yes	5.5 V	576	CMOS	MIL-PRF-38535 Class Q	192	10000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Typical gates = 10000-30000	e4	111 MHz	192	39.37 mm
5962-9230501MYX	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4			28.702 mm
XC3090-70CB164BSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000		70 MHz		28.702 mm
XC3090-100CB164BSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	100 MHz		28.702 mm
XC3090-50CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS	MIL-STD-883 Class B		5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		50 MHz		28.702 mm
5962-8994801MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4			19.05 mm
XC3042-70CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes		144	CMOS	MIL-STD-883 Class B	82	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz	82	19.05 mm
5962-9230501MZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4			28.702 mm
XC4005-5CB164B	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	196		MIL-STD-883 Class B		3000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		196 CLBS, 3000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		3.302 mm	28.702 mm	No					28.702 mm
XC3090-50CB164BSPC0107	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS			5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		320 CLBS, 5000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000		50 MHz		28.702 mm
5962-9230502MZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		400	CMOS			8000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No					28.702 mm
5962-9561201MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4			28.702 mm
XC3020-100CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS	MIL-STD-883 Class B	64	1000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	7 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	100 MHz	64	19.05 mm
XQV300-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	6912	Yes	2.625 V	1536	CMOS	MIL-PRF-38535	162	322970	2.5	1.2/3.6,2.5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	2.375 V	.635 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No		e0		162	39.37 mm
5962-8982302MZX	Xilinx	FPGA	Military	Flat	164	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		320	CMOS	MIL-STD-883		5000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	320 CLBS, 5000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F164		3.302 mm	28.702 mm	No		e4	70 MHz		28.702 mm
XC3042-100CB100CSPC0107	Xilinx	FPGA	Other	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.25 V	144	CMOS			2000	5		Flatpack, Guard Ring			4.75 V	.65 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000	e0	100 MHz		19.05 mm
5962-9851001QYC	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	3078	Yes	3.6 V	1296	CMOS	MIL-PRF-38535 Class Q	192	22000	3.3	3.3 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	3 V	.635 mm	125 °C (257 °F)	1.6 ns	1296 CLBS, 22000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F228		3.302 mm	39.37 mm	No	Maximum usable gates 65000	e4	166 MHz	192	39.37 mm
5962-9752301QZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400		MIL-PRF-38535 Class Q		7000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000				34.29 mm
XQ4028EX-4CB228M	Xilinx	FPGA	Military	Flat	228	GQFF	Square		Ceramic, Metal-Sealed Cofired	2432	Yes	5.5 V	1024	CMOS	MIL-PRF-38535	256	18000	5	5 V	Flatpack, Guard Ring	TPAK228,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.2 ns	1024 CLBS, 18000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F228	1	3.302 mm	39.37 mm	No	Maximum usable gates = 50000	e0	143 MHz	256	39.37 mm
XC3020-50CB100BSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500		50 MHz		19.05 mm
5962-9230502MZA	Xilinx	FPGA	Military	Flat	196	GQFF	Square		Ceramic, Metal-Sealed Cofired		Yes		400	CMOS	MIL-STD-883		8000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4			28.702 mm
5962-9561002MZC	Xilinx	FPGA	Military	Flat	100	GQFF	Square		Ceramic, Metal-Sealed Cofired	144	Yes			CMOS	MIL-STD-883	82		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	230 MHz	82	19.05 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.