HBGA Field Programmable Gate Arrays (FPGA) 791

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGXMA5G4F31C4G	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544		1.1		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)		7170 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5AGXMA5G4F31I3G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.18 V	7170	TSMC	544		1.15		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.12 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5AGXMA5G4F31I5G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544		1.1		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5AGXMB3G6F40C6G	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688	TSMC	704		1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)		13688 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						704		40 mm
EP2AGX125DF25C4N	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		260		.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		4964 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572	3	2.2 mm	25 mm	No		e1	500 MHz		260		25 mm
EP2AGX45DF25C4G	Intel	FPGA		Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260		0.9		Grid Array, Heat Sink/Slug	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572		2.15 mm	25 mm						260		25 mm
EP2AGX45DF25C6G	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260		0.9		Grid Array, Heat Sink/Slug	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572		2.15 mm	25 mm						260		25 mm
EP2AGX45DF29C6N	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		372		.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP2AGX65DF29C6N	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		372		.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		2530 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP2AGX95DF25I3N	Intel	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		260		.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm	No		e1	500 MHz		260		25 mm
EP2AGX95EF35C4G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		612		0.9		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		3747 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.55 mm	35 mm						612		35 mm
XC2V10000-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC2VP20-8FF896C	Xilinx	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0		30 s		225 °C (437 °F)	31 mm
XC2V10000-6BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC2VP20-8FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC2VP40-7FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.29 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1350 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP50-8BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			5648 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1		30 s		245 °C (473 °F)	40 mm
XC2VP40-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.33 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1200 MHz	30 s		245 °C (473 °F)	40 mm
XC2V8000-4BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy	11648	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Heat Sink/Slug	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0	650 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2V8000-5BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy	11648	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Heat Sink/Slug	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0	750 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2VP20-8BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1		30 s		245 °C (473 °F)	40 mm
XC2V8000-4BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1	650 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP50-8FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC2V10000-6FFG1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC2V10000-4FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.45 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	765 MHz	30 s		225 °C (437 °F)	40 mm
XC2V10000-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	880 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP20-6BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1		30 s		245 °C (473 °F)	40 mm
XC2VP50-8FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1		30 s		245 °C (473 °F)	40 mm
XC2V2000-6BG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B957		3.5 mm	40 mm	No		e0	820 MHz				40 mm
XC2VP40-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.37 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1050 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP50-8BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			5648 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC2V10000-6FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1		30 s		245 °C (473 °F)	40 mm
XQ2VP40-5FG676N	Xilinx	FPGA	Military	Ball	676	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.36 ns	4848 CLBS	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	1050 MHz	30 s	416	225 °C (437 °F)	27 mm
XC2V3000-4FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.5 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	813.67 MHz				40 mm
XC2VP40-7FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.29 ns	4848 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1350 MHz	30 s	804	225 °C (437 °F)	40 mm
XC2V10000-5BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.39 ns	15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1	880 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP40-6FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.33 ns	4848 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1200 MHz	30 s	804	225 °C (437 °F)	40 mm
XC2VP40-6FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.33 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1200 MHz	30 s	804	225 °C (437 °F)	40 mm
XC2V10000-5FF1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.39 ns	15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	880 MHz	30 s		225 °C (437 °F)	35 mm
XC2VP50-8BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC2VP20-8BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1		30 s		245 °C (473 °F)	40 mm
XC2VP7-8FF896I	Xilinx	FPGA		Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	1232	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			1232 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0		30 s		225 °C (437 °F)	31 mm
XCKU13P-L1FFVE900I	Xilinx	FPGA	Industrial	Ball	900	HBGA	Square	Plastic/Epoxy	746550	Yes	.742 V	42660		304		.72		Grid Array, Heat Sink/Slug	BGA900,30X30,40		.698 V	1 mm	100 °C (212 °F)		42660 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		It also Operates at 0.85 V	e1		30 s	304	245 °C (473 °F)	31 mm
XC2V10000-6BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC2VP20-8FFG1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC2V2000-4BGG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B957		3.5 mm	40 mm	No		e1	650 MHz				40 mm
XC2VP50-7BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC2VP50-8FF1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0		30 s		225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.