HBGA Field Programmable Gate Arrays (FPGA) 791

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2VP20-8FF1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0		30 s		225 °C (437 °F)	35 mm
XC2VP20-6BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V10000-6BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V2000-5BG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B957		3.5 mm	40 mm	No	e0	750 MHz				40 mm
XC2VP40-7FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.29 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	1350 MHz	30 s	804	225 °C (437 °F)	40 mm
XC2VP50-8FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			5648 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V10000-5BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	880 MHz	30 s		245 °C (473 °F)	40 mm
XC2V8000-6BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy	11648	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Heat Sink/Slug	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	820 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2VP20-6BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V10000-4FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.45 ns	15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	765 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP50-8BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V10000-4FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.45 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	765 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP20-7BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2VP50-6BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			5648 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V3000-5FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	934.58 MHz	30 s		225 °C (437 °F)	40 mm
XC2V3000-4FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.5 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	813.67 MHz	30 s		225 °C (437 °F)	40 mm
XC2VP7-8FF896C	Xilinx	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	1232	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		1232 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0		30 s		225 °C (437 °F)	31 mm
XC2VP20-8FFG896C	Xilinx	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1		30 s		245 °C (473 °F)	31 mm
XC2V10000-6FF1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0		30 s		225 °C (437 °F)	35 mm
XC2VP20-7BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V10000-5FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	880 MHz	30 s		225 °C (437 °F)	40 mm
XC2V10000-6FF1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0		30 s		225 °C (437 °F)	35 mm
XC2V8000-6BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy	11648	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Heat Sink/Slug	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	820 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2V2000-6BGG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B957		3.5 mm	40 mm	No	e1	820 MHz				40 mm
XC2VP40-5FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.37 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	1050 MHz	30 s	804	225 °C (437 °F)	40 mm
XC2V8000-5BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.39 ns	11648 CLBS, 8000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP50-6BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			5648 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2VP20-6BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2VP50-8FFG1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			5648 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC2VP40-6FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.33 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	1200 MHz	30 s		245 °C (473 °F)	40 mm
XC2V10000-4FF1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.45 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	765 MHz	30 s		225 °C (437 °F)	35 mm
XC2V10000-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC2VP20-8FF896C	Xilinx	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0		30 s		225 °C (437 °F)	31 mm
XC2V10000-6BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2VP20-8FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC2VP40-7FFG1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.29 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP20-8BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V10000-4FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.45 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	765 MHz	30 s		245 °C (473 °F)	35 mm
XC2V8000-5BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy	11648	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Heat Sink/Slug	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2VP50-8FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC2V2000-4BG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B957		3.5 mm	40 mm	No	e0	650 MHz				40 mm
XC2VP40-7FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.29 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP50-7BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V10000-4BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.45 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	765 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP50-8FF1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			5648 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0		30 s		225 °C (437 °F)	35 mm
XC2V10000-4BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.45 ns	15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	765 MHz	30 s		225 °C (437 °F)	40 mm
XC2VP40-6FF1517I	Xilinx	FPGA		Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.33 ns	4848 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	1200 MHz	30 s	804	225 °C (437 °F)	40 mm
XC2VP40-6FF1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.33 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	1200 MHz	30 s	804	225 °C (437 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.