Rectangular Field Programmable Gate Arrays (FPGA) 716

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C40Q240C8	Altera	FPGA	Other	Gull Wing	240	FQFP	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	128	1.2	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No	e0	472.5 MHz	20 s	128	220 °C (428 °F)	32 mm
EP3C16U484C7	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e0	472.5 MHz	20 s	346	220 °C (428 °F)	19 mm
EP3C16U256C7	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e0	472.5 MHz	20 s	168	235 °C (455 °F)	14 mm
EP3C55U484C8NES	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	55856			1.2	Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)	55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484		2.2 mm	19 mm	No	e1	472.5 MHz				19 mm
EP3C16F484C7	Altera	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e0	472.5 MHz	20 s	346	220 °C (428 °F)	23 mm
EP3C40U484C6N	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e1	472.5 MHz	30 s	331	260 °C (500 °F)	19 mm
EP3C25Q240C8	Altera	FPGA	Other	Gull Wing	240	FQFP	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	148	1.2	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No	e0	472.5 MHz	20 s	148	220 °C (428 °F)	32 mm
EP3C80F780C7N	Altera	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	429	1.2	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	81264 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No	e1	472.5 MHz	30 s	429	260 °C (500 °F)	29 mm
EP3C55F780C7N	Altera	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	377	1.2	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	55856 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No	e1	472.5 MHz	30 s	377	260 °C (500 °F)	29 mm
EP3C120F484C7NES	Altera	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088			1.2	Grid Array			1.15 V	1 mm	85 °C (185 °F)	119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484		2.6 mm	23 mm	No	e1	472.5 MHz				23 mm
EPB1400DC	Altera	FPGA	Commercial	Through-Hole	40	DIP	Rectangular	Ceramic		No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T40				No	e0				220 °C (428 °F)
EP3C25E144I7	Altera	FPGA	Industrial	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	82	1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	100 °C (212 °F)	24624 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No	e0	472.5 MHz	20 s	82	220 °C (428 °F)	20 mm
EP3C55F780I7N	Altera	FPGA	Industrial	Ball	780	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	377	1.2	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	55856 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No	e1	472.5 MHz	30 s	377	260 °C (500 °F)	29 mm
EP3C16U256C6	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e0	472.5 MHz	20 s	168	235 °C (455 °F)	14 mm
EPB1400PI	Altera	FPGA	Industrial	Through-Hole	40	DIP	Rectangular	Plastic/Epoxy		No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T40				No	e0				220 °C (428 °F)
EP3C10U256C8N	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e1	472.5 MHz	30 s	182	260 °C (500 °F)	14 mm
EP3C80F780C6N	Altera	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	429	1.2	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	81264 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No	e1	472.5 MHz	30 s	429	260 °C (500 °F)	29 mm
EP3C25U256C7NES	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	24624			1.2	Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256		2.2 mm	14 mm	No	e1	472.5 MHz				14 mm
EP3C16U484I7	Altera	FPGA	Industrial	Ball	484	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	15408 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e0	472.5 MHz	20 s	346	220 °C (428 °F)	19 mm
EP3C16U484C6	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e0	472.5 MHz	20 s	346	220 °C (428 °F)	19 mm
EP3C25U256C8NES	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	24624			1.2	Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256		2.2 mm	14 mm	No	e1	472.5 MHz				14 mm
EP3C40U484C7N	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e1	472.5 MHz	30 s	331	260 °C (500 °F)	19 mm
EP3C16U484C7N	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e1	472.5 MHz	30 s	346	260 °C (500 °F)	19 mm
EP3C16U256I7N	Altera	FPGA	Industrial	Ball	256	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	15408 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e1	472.5 MHz		168		14 mm
EP3C16U256C7N	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e1	472.5 MHz	30 s	168	260 °C (500 °F)	14 mm
EP3C55U484C6N	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e1	472.5 MHz	30 s	327	260 °C (500 °F)	19 mm
EP3C16F484C8	Altera	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e0	472.5 MHz	20 s	346	220 °C (428 °F)	23 mm
EP3C16U256C8	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e0	472.5 MHz	20 s	168	235 °C (455 °F)	14 mm
EP3C80U484C6N	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	295	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e1	472.5 MHz	30 s	295	260 °C (500 °F)	19 mm
EP3C16F256C8	Altera	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e0	472.5 MHz	20 s	168	220 °C (428 °F)	17 mm
EP3C80F780I7N	Altera	FPGA	Industrial	Ball	780	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	429	1.2	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	81264 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No	e1	472.5 MHz	30 s	429	260 °C (500 °F)	29 mm
EPB1400DI	Altera	FPGA	Industrial	Through-Hole	40	DIP	Rectangular	Ceramic		No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Dual	R-XDIP-T40				No	e0				220 °C (428 °F)
EP3C10U256C7N	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e1	472.5 MHz	30 s	182	260 °C (500 °F)	14 mm
EP3C40U484C8N	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e1	472.5 MHz	30 s	331	260 °C (500 °F)	19 mm
EP3C16U256I7	Altera	FPGA	Industrial	Ball	256	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	15408 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e0	472.5 MHz	20 s	168	235 °C (455 °F)	14 mm
EP3C16F256C6	Altera	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e0	472.5 MHz	20 s	168	220 °C (428 °F)	17 mm
EP3C5U256C6N	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	5136 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e1	472.5 MHz	30 s	182	260 °C (500 °F)	14 mm
EP3C10U256I7N	Altera	FPGA	Industrial	Ball	256	FBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	10320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No	e1	472.5 MHz	30 s	182	260 °C (500 °F)	14 mm
EP3C120F780C7ES	Altera	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088			1.2	Grid Array			1.15 V	1 mm	85 °C (185 °F)	119088 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B780		3.5 mm	29 mm	No	e0	472.5 MHz				29 mm
EPB1400DC-2	Altera	FPGA	Commercial	Through-Hole	40	DIP	Rectangular	Ceramic		No			CMOS			In-Line	DIP40,.6	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T40				No	e0				220 °C (428 °F)
EP3C25E144C7N	Altera	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	82	1.2	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No	e3	472.5 MHz	30 s	82	260 °C (500 °F)	20 mm
EP3C55F780C6N	Altera	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	377	1.2	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	55856 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No	e1	472.5 MHz	30 s	377	260 °C (500 °F)	29 mm
EP3C16U484C6N	Altera	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No	e1	472.5 MHz	30 s	346	260 °C (500 °F)	19 mm
EP3C25F256C7ES	Altera	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	24624			1.2	Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B256		1.55 mm	17 mm	No	e0	472.5 MHz				17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.