Rectangular Field Programmable Gate Arrays (FPGA) 716

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C40F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	39600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e1	472.5 MHz		331		23 mm
EP3C5E144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	94	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	5136 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No	e3			94		20 mm
EP3C16F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e1	472.5 MHz	30 s	346	260 °C (500 °F)	23 mm
EP3C25F324I7N	Intel	FPGA	Industrial	Ball	324	BGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	24624 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No	e1	472.5 MHz		215		19 mm
EP3C25F324C8N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No	e1	472.5 MHz		215		19 mm
EP3C16Q240C8N	Intel	FPGA	Other	Gull Wing	240	FQFP	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	160	1.2		Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No	e3	472.5 MHz		160		32 mm
EP3C5E144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	94	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	100 °C (212 °F)	5136 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No	e3			94		20 mm
EP3C5F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5136 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e1	472.5 MHz	30 s	182	260 °C (500 °F)	17 mm
EP3C40F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e1	472.5 MHz		331		23 mm
EP3C10E144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	94	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No	e3	472.5 MHz		94		20 mm
EP3C25F324C8NES	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	24624			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324		2.2 mm	19 mm	No	e1	472.5 MHz				19 mm
EP3C16F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e1	472.5 MHz	30 s	168	260 °C (500 °F)	17 mm
EP3C25E144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	82	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	100 °C (212 °F)	24624 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No	e3	472.5 MHz		82		20 mm
EP3C55F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	55856 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e1	472.5 MHz		327		23 mm
EP3C10F256I7N	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	10320 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e1	472.5 MHz	30 s	182	260 °C (500 °F)	17 mm
XCAU10P-2UBVA368I	Xilinx	FPGA		Ball	368	VFBGA	Rectangular	Plastic/Epoxy	96250	Yes	.876 V	5500		128	0.85		Grid Array, Very Thin Profile, Fine Pitch	BGA368,18X22,20		.825 V	.5 mm	100 °C (212 °F)	5500 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B368		.692 mm	9.5 mm					128		11.5 mm
EP3C40Q240C8N	Intel	FPGA	Other	Gull Wing	240	FQFP	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	128	1.2		Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No	e3	472.5 MHz		128		32 mm
EP3C25F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e1	472.5 MHz	30 s	156	260 °C (500 °F)	17 mm
M2S090-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180	1.2		Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B325	3	1.16 mm	11 mm				40 s	180	250 °C (482 °F)	13.5 mm
EP3C25Q240C8N	Intel	FPGA	Other	Gull Wing	240	FQFP	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	148	1.2		Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No	e3	472.5 MHz		148		32 mm
M2S090-FCSG325	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180	1.2		Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B325	3	1.16 mm	11 mm				40 s	180	250 °C (482 °F)	13.5 mm
EP3C25E144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	82	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No	e3	472.5 MHz		82		20 mm
EP3C16E144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	84	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No	e3	472.5 MHz		84		20 mm
EP3C55F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e1	472.5 MHz		327		23 mm
M2S090-FCS325	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180	1.2		Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B325		1.16 mm	11 mm				30 s	180	240 °C (464 °F)	13.5 mm
EP3C16F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	15408 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e1	472.5 MHz		346		23 mm
M2S090-FCS325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180	1.2		Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	R-PBGA-B325		1.16 mm	11 mm				30 s	180	240 °C (464 °F)	13.5 mm
XCAU15P-2UBVA368I	Xilinx	FPGA		Ball	368	VFBGA	Rectangular	Plastic/Epoxy	170100	Yes	.876 V	9720		128	0.85		Grid Array, Very Thin Profile, Fine Pitch	BGA368,18X22,20		.825 V	.5 mm	100 °C (212 °F)	9720 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B368		.692 mm	9.5 mm					128		11.5 mm
EP3C10E144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	94	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	100 °C (212 °F)	10320 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No	e3	472.5 MHz		94		20 mm
EP3C120F780I7N	Intel	FPGA	Industrial	Ball	780	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	531	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	119088 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No	e1	472.5 MHz	30 s	531	260 °C (500 °F)	29 mm
LCMXO3LF-4300E-5UWG81CTR1K	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540			1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)	540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1				260 °C (500 °F)	3.797 mm
EP3C25F256I7N	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	24624 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e1	472.5 MHz	30 s	156	260 °C (500 °F)	17 mm
EP3C10F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e1	472.5 MHz	30 s	182	260 °C (500 °F)	17 mm
EP3C40F324I7N	Intel	FPGA	Industrial	Ball	324	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	39600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No	e1	472.5 MHz		195		19 mm
EP3C16F256I7N	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	15408 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e1	472.5 MHz		168		17 mm
ICE40UP5K-UWG30ITR	Lattice Semiconductor	FPGA	Industrial	Ball	30	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	660	CMOS		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	660 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm				30 s		260 °C (500 °F)	2.537 mm
EP3C25E144C8NES	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy		Yes	1.25 V	24624			1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144		1.6 mm	20 mm	No	e3	472.5 MHz				20 mm
10M02DCV36I7G	Intel	FPGA	Industrial	Ball	36	VFBGA	Rectangular	Plastic/Epoxy	2000	Yes	1.25 V	125		246	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.15 V	.4 mm	100 °C (212 °F)	125 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36	1	.54 mm	3.396 mm	No				246		3.466 mm
EP3C25F256C8NES	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	24624			1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256		1.55 mm	17 mm	No	e1	472.5 MHz				17 mm
10M08DFV81I7G	Intel	FPGA	Industrial	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250		4.496 mm
EP3C40F780I7N	Intel	FPGA	Industrial	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	39600 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No	e1	472.5 MHz	30 s	535	260 °C (500 °F)	29 mm
EP3C40F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e1	472.5 MHz		331		23 mm
EP3C40F484C6N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No	e1	472.5 MHz		331		23 mm
10M02DCV36C8G	Intel	FPGA	Commercial Extended	Ball	36	VFBGA	Rectangular	Plastic/Epoxy	2000	Yes	1.25 V	125		246	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)	125 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36	1	.54 mm	3.396 mm	No				246		3.466 mm
LCMXO3LF-4300E-5UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63	1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm		e1			63	260 °C (500 °F)	3.797 mm
EP3C25F324C6N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No	e1	472.5 MHz		215		19 mm
EP3C16F256I7	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	15408 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No	e0	472.5 MHz		168		17 mm
10M08DCV81I7G	Intel	FPGA	Industrial	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250		4.496 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.