Rectangular Field Programmable Gate Arrays (FPGA) 716

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO2-2000ZE-1UWG49ITR1K	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2112	Yes	1.26 V	264			38		1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA49,7X7,16		1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B49		.6 mm	3.106 mm						38		3.185 mm
EP3C25U256C7N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS		156		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		156		14 mm
EP3C40U484I7N	Intel	FPGA	Industrial	Ball	484	FBGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS		331		1.2			Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		331		19 mm
ICE40LP1K-SWG16TR	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS		10		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm						10		1.48 mm
LCMXO3LF-1300E-5UWG36CTR1K	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160					1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm								2.541 mm
10M08DFV81C8G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500			250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No					250		4.496 mm
EP3C10U256C6N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS		182		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		10320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		182		14 mm
EP3C25E144C8	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS		82		1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e0	472.5 MHz		82		20 mm
EP3C40F324C6N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS		195		1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		195		19 mm
ICE40LP1K-SWG16TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS		10		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm						10		1.48 mm
ICE40UP3K-UWG30ITR1K	Lattice Semiconductor	FPGA		Ball	30	VFBGA	Rectangular	Plastic/Epoxy	2800	Yes	1.26 V	350	CMOS		21		1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA30,5X6,16		1.14 V	.4 mm	100 °C (212 °F)	9 ns	350 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm					30 s	21	260 °C (500 °F)	2.537 mm
EP3C120F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS		283		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		283		23 mm
EP3C16F256C7	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS		168		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		168		17 mm
EP3C16F484C6	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS		346		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e0	472.5 MHz		346		23 mm
EP3C25U256C6N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS		156		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		156		14 mm
EP3C40F324C7N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS		195		1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		195		19 mm
EP3C5F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS		182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		182		17 mm
EP3C80F484C6N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS		295		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		295		23 mm
LCMXO3L-1300E-5UWG36CTR1K	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160					1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm								2.541 mm
XC3030A-7PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	1500	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	80	225 °C (437 °F)	20 mm
XC3142A-3PQ100C	Rochester Electronics	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5			Flatpack			4.75 V	.65 mm	85 °C (185 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100		3.4 mm	14 mm		Max usable 3000 Logic gates	e0	270 MHz				20 mm
XC5202-6PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5			Flatpack			4.75 V	.65 mm	85 °C (185 °F)	5.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC5204-6PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	120	Yes	5.25 V	120	CMOS		124	4000	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	5.6 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	225 °C (437 °F)	20 mm
A42MX09-PQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	684	Yes	3.6 V	684	CMOS			14000	3.3	Tray		Flatpack			3 V	.65 mm	85 °C (185 °F)	2.5 ns	684 CLBS, 14000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Also Operates at 5 V supply	e3	117 MHz	30 s		245 °C (473 °F)	20 mm
TPC1020BVE-100C1	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	R-PQFP-G100				No					69
TPC1010AMHFG84B-1	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular	Ceramic	295	Yes			CMOS	38535Q/M;38534H;883B	57		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					57
TPC1010AMHFG84	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular	Ceramic	295	Yes			CMOS		57		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					57
TPC1020AMHFG84B	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular	Ceramic	547	Yes			CMOS	38535Q/M;38534H;883B	69		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					69
TPC1010BVE-100I2	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	295	Yes			CMOS		57		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	R-PQFP-G100				No					57
TPC1225AVE-100I	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	451	Yes	5.5 V	451	CMOS		83	2500	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)		451 CLBS, 2500 Gates	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			66 MHz		83		20 mm
TPC1460GB-207I	Texas Instruments	FPGA	Industrial	Pin/Peg	207	PGA	Rectangular	Ceramic, Metal-Sealed Cofired		No			CMOS							Grid Array					85 °C (185 °F)			-40 °C (-40 °F)			R-CPGA-P207				No	MAX 168 I/OS
TPC1020AVE-100C1	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes	5.25 V	547	CMOS		69	2000	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	13.824 ns	547 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 69 I/OS; 273 flip-flops				69		20 mm
TPC1020BVE-100I2	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	R-PQFP-G100				No					69
TPC1010BVE-100I	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	295	Yes			CMOS		57		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	R-PQFP-G100				No					57
TPC1225AVE-100C	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	451	Yes	5.25 V	451	CMOS		83	2500	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)		451 CLBS, 2500 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			75 MHz		83		20 mm
M38510/60504BQX	Texas Instruments	FPGA	Military	Through-Hole	40	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			4000	5			In-Line			4.5 V		125 °C (257 °F)		4000 Gates	-55 °C (-67 °F)		Dual	R-CDIP-T40				No
TPC1010BVE-100C	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	295	Yes			CMOS		57		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	R-PQFP-G100				No					57
TPC1020BVE-100I1	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	R-PQFP-G100				No					69
TPC1010AVE-100C1	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	295	Yes	5.25 V	295	CMOS		57	1200	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	13.824 ns	295 CLBS, 1200 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 57 I/OS; 130 flip-flops				57		20 mm
TPC1460GB-207C	Texas Instruments	FPGA	Commercial	Pin/Peg	207	PGA	Rectangular	Ceramic, Metal-Sealed Cofired		No			CMOS							Grid Array					70 °C (158 °F)			0 °C (32 °F)			R-CPGA-P207				No	MAX 168 I/OS
TPC1010AMHFG84-1	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular	Ceramic	295	Yes			CMOS		57		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					57
TPC1010BVE-100C1	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	295	Yes			CMOS		57		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	R-PQFP-G100				No					57
TPC1010AMHFG84B	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular	Ceramic	295	Yes			CMOS	38535Q/M;38534H;883B	57		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					57
TPC1020AMHFG84-1	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular	Ceramic	547	Yes			CMOS		69		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					69
5962-01-393-7815	Texas Instruments	FPGA	Military	Flat	84	DFP	Rectangular	Ceramic	547	Yes			CMOS	38535Q/M;38534H;883B	69		5		5 V	Flatpack	FL84(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F84				No					69
TPC1020AVE-100I1	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes	5.5 V	547	CMOS		69	2000	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	14.796 ns	547 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 69 I/OS; 273 flip-flops				69		20 mm
TPC1020BVE-100I	Texas Instruments	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	R-PQFP-G100				No					69
TPC1010AVE-100C	Texas Instruments	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	295	Yes	5.25 V	295	CMOS		57	1200	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	16.632 ns	295 CLBS, 1200 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 57 I/OS; 130 flip-flops		100 MHz		57		20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.