Rectangular Field Programmable Gate Arrays (FPGA) 716

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C16F484I7	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		15408 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e0	472.5 MHz	20 s	346	220 °C (428 °F)	23 mm
LCMXO3L-4300E-5UWG81CTR	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1				260 °C (500 °F)	3.797 mm
LCMXO3LF-2100E-5UWG49CTR50	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1				260 °C (500 °F)	3.185 mm
LIFCL-17-8UWG72C	Lattice Semiconductor	FPGA	Other	Ball	72	VFBGA	Rectangular	Plastic/Epoxy	17000	Yes	1.05 V			24		1			Grid Array, Very Thin Profile, Fine Pitch	BGA72,8X9,16		.95 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	R-PBGA-B72	1	.608 mm	3.8074 mm					30 s	24	260 °C (500 °F)	4.1251 mm
M2S090TS-1FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B325	3	1.16 mm	11 mm					40 s	180	250 °C (482 °F)	13.5 mm
EP3C10F256C7N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		10320 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	182	260 °C (500 °F)	17 mm
LCMXO3L-4300E-5UWG81ITR50	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1			63	260 °C (500 °F)	3.797 mm
LCMXO3LF-2100E-5UWG49ITR	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2100	Yes	1.26 V	264		38		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1			38	260 °C (500 °F)	3.185 mm
ICE40LP1K-SWG16TR50	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160	CMOS			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm								1.48 mm
LCMXO3LF-4300E-5UWG81ITR50	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1			63	260 °C (500 °F)	3.797 mm
M1AFS250-1PQG208I	Microsemi	FPGA	Industrial	Flat	208	QFF	Rectangular	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5			Flatpack			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-F208	3	4.1 mm	28 mm	No		e3					30.6 mm
10M08DCV81C8G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No					250		4.496 mm
EP3C80F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	295		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		295		23 mm
LCMXO3LF-4300E-5UWG81CTR50	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1				260 °C (500 °F)	3.797 mm
EP3C120F484C8NES	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088				1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484		2.6 mm	23 mm	No		e1	472.5 MHz				23 mm
EP3C25U256C8N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		156		14 mm
10M08DCV81C7G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No					250		4.496 mm
EP3C120F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	283		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		119088 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		283		23 mm
EP3C120F780C7N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	531		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	531	260 °C (500 °F)	29 mm
EP3C120F780C7NES	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088				1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780		3.5 mm	29 mm	No		e1	472.5 MHz				29 mm
LCMXO3L-2100E-5UWG49ITR1K	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2100	Yes	1.26 V	264		38		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1			38	260 °C (500 °F)	3.185 mm
LCMXO3L-2100E-5UWG49ITR50	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2100	Yes	1.26 V	264		38		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1			38	260 °C (500 °F)	3.185 mm
M2S090TS-1FCS325I	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	R-PBGA-B325		1.16 mm	11 mm					30 s	180	240 °C (464 °F)	13.5 mm
EP3C55U484C7N	Intel	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327		1.2			Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		327		19 mm
LCMXO3LF-4300E-5UWG81CTR	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1				260 °C (500 °F)	3.797 mm
M2S090TS-FCS325	Microchip Technology	FPGA		Ball	325	TFBGA	Rectangular	Plastic/Epoxy	86184	Yes	1.26 V			180		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B325		1.16 mm	11 mm					30 s	180	240 °C (464 °F)	13.5 mm
EP3C16F256C7N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		168		17 mm
EP3C40F780C6N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz		535		29 mm
EP3C40F780C7N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz		535		29 mm
ICE40UP3K-UWG30ITR50	Lattice Semiconductor	FPGA		Ball	30	VFBGA	Rectangular	Plastic/Epoxy	2800	Yes	1.26 V	350	CMOS	21		1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA30,5X6,16		1.14 V	.4 mm	100 °C (212 °F)	9 ns	350 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm					30 s	21	260 °C (500 °F)	2.537 mm
LIF-MD6000-6UWG36ITR1K	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	1500				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm			1500 CLBS		Tin Silver Copper Nickel	Bottom	R-PBGA-B36	1	.6 mm	2.535 mm			e2				260 °C (500 °F)	2.585 mm
EP3C10F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		10320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		182		17 mm
EP3C120F780C8NES	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088				1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780		3.5 mm	29 mm	No		e1	472.5 MHz				29 mm
LCMXO2-4000ZE-1UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	3.6 V			63		1.2			Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16		1.14 V	.4 mm	85 °C (185 °F)			-40 °C (-40 °F)		Bottom	R-PBGA-B81		.567 mm	3.693 mm						63		3.797 mm
LCMXO3L-1300E-5UWG36ITR1K	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm						28		2.541 mm
XC3020-50PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	2000	5		5 V	Flatpack	QFP100,.7X1.0	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops	e0	50 MHz	30 s	64	225 °C (437 °F)	20 mm
LCMXO3L-1300E-5UWG36CTR	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm								2.541 mm
LCMXO3L-1300E-5UWG36CTR50	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm								2.541 mm
LCMXO3L-1300E-5UWG36ITR	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm						28		2.541 mm
LCMXO3LF-2100E-5UWG49CTR	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1				260 °C (500 °F)	3.185 mm
MPF200TS-FCS325M	Microchip Technology	FPGA	Military	Ball	325	LFBGA	Rectangular	Plastic/Epoxy	192000	Yes	1.03 V		CMOS	170		1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	R-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		14.5 mm
XC5204-6PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	120	Yes	5.5 V	120	CMOS	124	4000	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm		5.6 ns	120 CLBS, 4000 Gates		Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	225 °C (437 °F)	20 mm
EP3C16F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		168		17 mm
LCMXO3LF-1300E-5UWG36ITR	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm						28		2.541 mm
EP3C5U256I7N	Intel	FPGA	Industrial	Ball	256	FBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		5136 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		182		14 mm
XC5202-6PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	84	2000	5		5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm		5.6 ns	64 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	225 °C (437 °F)	20 mm
EP3C16E144C7N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	84		1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3	472.5 MHz		84		20 mm
EP3C16U484I7N	Intel	FPGA	Industrial	Ball	484	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346		1.2			Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		15408 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		346		19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.