Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
295 |
Yes |
CMOS |
57 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
295 |
Yes |
CMOS |
38535Q/M;38534H;883B |
57 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
||||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
38535Q/M;38534H;883B |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
547 |
Yes |
5.5 V |
547 |
CMOS |
69 |
2000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
14.796 ns |
547 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
MAX 69 I/OS; 273 flip-flops |
69 |
20 mm |
|||||||||||
Texas Instruments |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
295 |
Yes |
5.25 V |
295 |
CMOS |
57 |
1200 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
70 °C (158 °F) |
16.632 ns |
295 CLBS, 1200 Gates |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
MAX 57 I/OS; 130 flip-flops |
100 MHz |
57 |
20 mm |
||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
||||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
295 |
Yes |
CMOS |
57 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
451 |
Yes |
5.25 V |
451 |
CMOS |
83 |
2500 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
70 °C (158 °F) |
451 CLBS, 2500 Gates |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
85 MHz |
83 |
20 mm |
||||||||||||
Texas Instruments |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
451 |
Yes |
5.5 V |
451 |
CMOS |
83 |
2500 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
451 CLBS, 2500 Gates |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
75 MHz |
83 |
20 mm |
||||||||||||
Texas Instruments |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Military |
Flat |
84 |
DFP |
Rectangular |
Ceramic |
547 |
Yes |
CMOS |
38535Q/M;38534H;883B |
69 |
5 |
5 V |
Flatpack |
FL84(UNSPEC) |
Field Programmable Gate Arrays |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDFP-F84 |
No |
69 |
|||||||||||||||||||||
|
Maxim Integrated |
FPGA |
Industrial |
No Lead |
6 |
SON |
Rectangular |
Plastic |
Yes |
1.8 |
1.8 V |
Small Outline |
SOLCC6,.11,37 |
Field Programmable Gate Arrays |
.95 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-N6 |
1 |
No |
e3 |
30 s |
260 °C (500 °F) |
|||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
5.25 V |
196 |
CMOS |
112 |
3000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
2 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 5000 Logic gates |
e0 |
125 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
64 |
CMOS |
1000 |
5 |
Flatpack |
4.5 V |
.65 mm |
9 ns |
64 CLBS, 1000 Gates |
Quad |
R-PQFP-G100 |
2.87 mm |
14 mm |
No |
256 flip-flops; typical gates = 1000-1500 |
70 MHz |
20 mm |
|||||||||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.5 V |
64 |
CMOS |
64 |
2000 |
5 |
5 V |
Flatpack |
QFP100,.7X1.0 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
64 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.1496 mm |
14 mm |
No |
MAX 64 I/OS; 256 flip-flops |
e0 |
50 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
64 |
1600 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
70 °C (158 °F) |
4 ns |
64 CLBS, 1600 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
2.87 mm |
14 mm |
No |
MAX 64 I/OS; 256 flip-flops; typical gates = 1600 - 2000 |
e0 |
133.3 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
2 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e0 |
125 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
3000 |
5 |
Flatpack |
4.75 V |
.65 mm |
70 °C (158 °F) |
100 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3.1496 mm |
14 mm |
No |
MAX 80 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C |
e0 |
50 MHz |
20 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Ball |
676 |
Rectangular |
Plastic/Epoxy |
Yes |
Grid Array |
Tin Silver Copper |
Bottom |
R-PBGA-B676 |
3 |
No |
e1 |
||||||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack |
.65 mm |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
20 mm |
||||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
2400 |
468252 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
85 °C (185 °F) |
0.8 ns |
2400 CLBS, 468252 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e0 |
250 MHz |
20 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Ball |
676 |
BGA |
Rectangular |
Plastic/Epoxy |
53712 |
Yes |
1.26 V |
5968 |
469 |
3400000 |
1.2 |
Grid Array |
BGA676,26X26,40 |
1.14 V |
1 mm |
100 °C (212 °F) |
5968 CLBS, 3400000 Gates |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B676 |
3 |
2.44 mm |
27 mm |
No |
e1 |
469 |
27 mm |
||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.5 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 5000 Logic gates |
e0 |
179 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.3 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 5000 Logic gates |
e0 |
200 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Military |
Pin/Peg |
84 |
PGA |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
64 |
CMOS |
MIL-STD-883 |
2000 |
5 |
Grid Array |
4.5 V |
125 °C (257 °F) |
14 ns |
64 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Gold |
Perpendicular |
R-CPGA-P84 |
No |
e4 |
16 MHz |
||||||||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
64 |
CMOS |
2000 |
5 |
Flatpack |
4.5 V |
.65 mm |
85 °C (185 °F) |
9 ns |
64 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.1496 mm |
14 mm |
No |
MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C |
70 MHz |
20 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
1500 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
2.7 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
Max usable 2000 Logic gates |
e3 |
270 MHz |
30 s |
245 °C (473 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
64 |
CMOS |
2000 |
5 |
Flatpack |
4.75 V |
.65 mm |
70 °C (158 °F) |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.1496 mm |
14 mm |
No |
MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C |
50 MHz |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
64 |
1000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.75 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 1500 Logic gates |
e0 |
323 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.5 V |
64 |
CMOS |
64 |
1600 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
6 ns |
64 CLBS, 1600 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
2.87 mm |
14 mm |
No |
256 flip-flops; typical gates = 1600-2000 |
e0 |
90.9 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
4704 |
888439 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
0.7 ns |
4704 CLBS, 888439 Gates |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
294 MHz |
20 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
2400 |
468252 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
85 °C (185 °F) |
0.6 ns |
2400 CLBS, 468252 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
333 MHz |
20 mm |
||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
64 |
1000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
70 °C (158 °F) |
2.7 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Typical gates = 1000-1500 |
e0 |
270 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Typical gates = 6000-10000 |
e3 |
20 mm |
|||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.3 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e0 |
166 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
64 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack |
Quad |
R-PQFP-G64 |
No |
70 MHz |
||||||||||||||||||||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
2688 |
CMOS |
8700 |
5 |
Flatpack |
4.5 V |
.65 mm |
85 °C (185 °F) |
5.5 ns |
2688 CLBS, 8700 Gates |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
MAX 78 I/OS; MAX 1344 flip-flops; OTP based |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
5.25 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
4.5 ns |
196 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
2.87 mm |
14 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
133.3 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack |
Quad |
R-PQFP-G144 |
No |
|||||||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
4704 |
888439 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
0.6 ns |
4704 CLBS, 888439 Gates |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
333 MHz |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack |
.65 mm |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
20 mm |
||||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
144 |
Yes |
5.25 V |
144 |
CMOS |
82 |
2000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
7 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
2.87 mm |
14 mm |
No |
480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA |
e0 |
100 MHz |
30 s |
82 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
196 |
CMOS |
6000 |
5 |
Flatpack |
4.5 V |
.65 mm |
4.6 ns |
196 CLBS, 6000 Gates |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
MAX available 10000 Logic gates |
e3 |
83 MHz |
30 s |
245 °C (473 °F) |
20 mm |
|||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
64 |
CMOS |
2000 |
5 |
Flatpack |
4.5 V |
.65 mm |
4.6 ns |
64 CLBS, 2000 Gates |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
MAX available 3000 Logic gates |
e3 |
83 MHz |
30 s |
245 °C (473 °F) |
20 mm |
|||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
144 |
CMOS |
2000 |
5 |
Flatpack |
4.5 V |
.65 mm |
5.1 ns |
144 CLBS, 2000 Gates |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
Max usable 3000 Logic gates |
e3 |
113 MHz |
30 s |
245 °C (473 °F) |
20 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.