Rectangular Field Programmable Gate Arrays (FPGA) 716

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC5206-5PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

196

CMOS

6000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

4.6 ns

196 CLBS, 6000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

MAX available 10000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XC4005E-1PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

196

CMOS

3000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

1.3 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 5000 Logic gates

e3

166 MHz

30 s

245 °C (473 °F)

20 mm

XC5402L-4PQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.3

Flatpack

.65 mm

Quad

R-PQFP-G100

3.4 mm

14 mm

No

20 mm

XC3390A-6PG175C

Xilinx

FPGA

Pin/Peg

175

PGA

Rectangular

Plastic/Epoxy

No

CMOS

5

Grid Array

Perpendicular

R-PPGA-P175

No

XC3120A-5PQ100M

Xilinx

FPGA

Military

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

64

CMOS

64

1300

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

4.1 ns

64 CLBS, 1300 Gates

-55 °C (-67 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800

e0

190 MHz

30 s

64

225 °C (437 °F)

20 mm

XCV800-6PQ240I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

2.625 V

4704

888439

2.5

Flatpack

2.375 V

.65 mm

0.6 ns

4704 CLBS, 888439 Gates

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e0

333 MHz

20 mm

XC3020-50PQ100ISPC0110

Xilinx

FPGA

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

64

CMOS

2000

5

Flatpack

4.5 V

.65 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.1496 mm

14 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

50 MHz

20 mm

XC4062XL-09BG560C

Xilinx

FPGA

Other

Ball

560

LBGA

Rectangular

Plastic/Epoxy

2304

Yes

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Low Profile

BGA560,33X33,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

2304 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

R-PBGA-B560

3

1.7 mm

42.5 mm

No

Typical gates = 40000-130000

e0

217 MHz

30 s

384

225 °C (437 °F)

42.5 mm

XC3342A-6VQ144I

Xilinx

FPGA

Gull Wing

144

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

Quad

R-PQFP-G144

No

XC4005XL-09CPGQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.6 V

196

CMOS

3000

3.3

Flatpack

3 V

.65 mm

85 °C (185 °F)

1.2 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3.4 mm

14 mm

No

Max usable 5000 Logic gates

e3

217 MHz

20 mm

XC5202-4PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

64

CMOS

2000

5

Flatpack

4.5 V

.65 mm

3.8 ns

64 CLBS, 2000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Typical gates = 2000-3000

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XCV600-4PQG240C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

2.625 V

3456

661111

2.5

Flatpack

2.375 V

.65 mm

85 °C (185 °F)

0.8 ns

3456 CLBS, 661111 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

250 MHz

20 mm

XCV800-5PQG240C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

2.625 V

4704

888439

2.5

Flatpack

2.375 V

.65 mm

85 °C (185 °F)

0.7 ns

4704 CLBS, 888439 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

294 MHz

20 mm

XCV800-5PQ240C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

2.625 V

4704

888439

2.5

Flatpack

2.375 V

.65 mm

85 °C (185 °F)

0.7 ns

4704 CLBS, 888439 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e0

294 MHz

20 mm

XC3130A-1PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

100

CMOS

1500

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

1.75 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

Max usable 2000 Logic gates

e3

323 MHz

30 s

245 °C (473 °F)

20 mm

XC5404-4PQ100C

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

.65 mm

Quad

R-PQFP-G100

3.4 mm

14 mm

No

20 mm

XC3130-5PQ100I

Xilinx

FPGA

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

100

Yes

5.5 V

100

CMOS

80

2000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.5 V

.65 mm

85 °C (185 °F)

4.1 ns

100 CLBS, 2000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700

e0

190 MHz

30 s

80

225 °C (437 °F)

20 mm

5962-8994802XX

Xilinx

FPGA

Military

Pin/Peg

84

PGA

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

64

CMOS

MIL-STD-883

2000

5

Grid Array

4.5 V

125 °C (257 °F)

9 ns

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

R-CPGA-P84

No

e4

25 MHz

XC4052XL-09BGG560C

Xilinx

FPGA

Other

Ball

560

LBGA

Rectangular

Plastic/Epoxy

Yes

3.6 V

1936

CMOS

33000

3.3

Grid Array, Low Profile

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

1936 CLBS, 33000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B560

3

1.7 mm

42.5 mm

No

Typical gates = 33000-100000

e1

217 MHz

30 s

260 °C (500 °F)

42.5 mm

XC5202-3PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

5.25 V

64

CMOS

84

2000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

3 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

MAX available 3000 Logic gates

e0

83 MHz

30 s

84

225 °C (437 °F)

20 mm

XC3130A-3PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

100

CMOS

1500

5

Flatpack

4.5 V

.65 mm

2.7 ns

100 CLBS, 1500 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

Max usable 2000 Logic gates

e3

270 MHz

30 s

245 °C (473 °F)

20 mm

XC3142A-2PQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

144

Yes

5.5 V

144

CMOS

82

2000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.5 V

.65 mm

2.2 ns

144 CLBS, 2000 Gates

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 3000 Logic gates

e0

323 MHz

30 s

82

225 °C (437 °F)

20 mm

XC4005E-4PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

196

CMOS

3000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

2.7 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 5000 Logic gates

e3

111 MHz

30 s

245 °C (473 °F)

20 mm

XC2318-70PQ100C

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

.65 mm

Quad

R-PQFP-G100

3.4 mm

14 mm

No

70 MHz

20 mm

XC3020A-7PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

5.25 V

64

CMOS

64

1000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

5.1 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 1500 Logic gates

e0

113 MHz

30 s

64

225 °C (437 °F)

20 mm

XC3142-2PQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

144

Yes

CMOS

82

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

.635 mm

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

No

e0

323 MHz

30 s

82

225 °C (437 °F)

XC3042-125PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

82

2000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

5.5 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

125 MHz

30 s

82

225 °C (437 °F)

20 mm

XC3130A-09PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

100

CMOS

1500

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

1.5 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

Max usable 2000 Logic gates

e3

370 MHz

30 s

245 °C (473 °F)

20 mm

XC3120A-3PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

5.25 V

64

CMOS

64

1000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

2.7 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 1500 Logic gates

e0

270 MHz

30 s

64

225 °C (437 °F)

20 mm

XC4005XL-3PQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

196

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

3 V

.65 mm

1.6 ns

196 CLBS, 3000 Gates

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 5000 Logic gates

e0

166 MHz

30 s

112

225 °C (437 °F)

20 mm

XC5204-4PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

120

CMOS

4000

5

Flatpack

4.5 V

.65 mm

3.8 ns

120 CLBS, 4000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Typical gates = 4000-6000

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XC3042-70PQ100CSPC0107

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

144

CMOS

2000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

9 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

2.87 mm

14 mm

No

480 flip-flops; typical gates = 2000-3000

e0

70 MHz

20 mm

XC5204-4PQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

120

Yes

5.5 V

120

CMOS

124

4000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.5 V

.65 mm

3.8 ns

120 CLBS, 4000 Gates

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Typical gates = 4000-6000

e0

83 MHz

30 s

124

225 °C (437 °F)

20 mm

XC3130A-2PQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

100

Yes

5.5 V

100

CMOS

80

1500

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.5 V

.65 mm

2.2 ns

100 CLBS, 1500 Gates

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 2000 Logic gates

e0

323 MHz

30 s

80

225 °C (437 °F)

20 mm

XC4005E-2PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

196

CMOS

3000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

1.6 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 5000 Logic gates

e3

125 MHz

30 s

245 °C (473 °F)

20 mm

XCV400-6PQG240I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

2.625 V

2400

468252

2.5

Flatpack

2.375 V

.65 mm

0.6 ns

2400 CLBS, 468252 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

333 MHz

20 mm

XC4002A-5PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

5.25 V

64

CMOS

64

1600

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

4.5 ns

64 CLBS, 1600 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

256 flip-flops; typical gates = 1600-2000

e0

133.3 MHz

30 s

64

225 °C (437 °F)

20 mm

XC5202L-6PQ100C

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.6 V

64

CMOS

2000

3.3

Flatpack

3 V

.65 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Typical gates = 2000-3000

e0

20 mm

EPB1400DC

Altera

FPGA

Commercial

Through-Hole

40

DIP

Rectangular

Ceramic

No

CMOS

In-Line

DIP40,.6

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T40

No

e0

220 °C (428 °F)

EP3C25E144I7

Altera

FPGA

Industrial

Gull Wing

144

LFQFP

Rectangular

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

82

1.2

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

100 °C (212 °F)

24624 CLBS

-40 °C (-40 °F)

Tin Lead

Quad

R-PQFP-G144

3

1.6 mm

20 mm

No

e0

472.5 MHz

20 s

82

220 °C (428 °F)

20 mm

EP3C55F780I7N

Altera

FPGA

Industrial

Ball

780

BGA

Rectangular

Plastic/Epoxy

55856

Yes

1.25 V

55856

CMOS

377

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

55856 CLBS

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

R-PBGA-B780

3

3.5 mm

29 mm

No

e1

472.5 MHz

30 s

377

260 °C (500 °F)

29 mm

EP3C16U256C6

Altera

FPGA

Other

Ball

256

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

168

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e0

472.5 MHz

20 s

168

235 °C (455 °F)

14 mm

EP3C16U256I7N

Altera

FPGA

Industrial

Ball

256

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

168

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

100 °C (212 °F)

15408 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

168

14 mm

EP3C16U256C7N

Altera

FPGA

Other

Ball

256

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

168

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

30 s

168

260 °C (500 °F)

14 mm

EPB1400DI

Altera

FPGA

Industrial

Through-Hole

40

DIP

Rectangular

Ceramic

No

CMOS

In-Line

DIP40,.6

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-XDIP-T40

No

e0

220 °C (428 °F)

EP3C10U256C7N

Altera

FPGA

Other

Ball

256

FBGA

Rectangular

Plastic/Epoxy

10320

Yes

1.25 V

10320

CMOS

182

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

10320 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

30 s

182

260 °C (500 °F)

14 mm

EP3C10U256I7N

Altera

FPGA

Industrial

Ball

256

FBGA

Rectangular

Plastic/Epoxy

10320

Yes

1.25 V

10320

CMOS

182

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

100 °C (212 °F)

10320 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

30 s

182

260 °C (500 °F)

14 mm

EP3C120F780C7ES

Altera

FPGA

Other

Ball

780

BGA

Rectangular

Plastic/Epoxy

Yes

1.25 V

119088

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

119088 CLBS

0 °C (32 °F)

Tin Lead

Bottom

R-PBGA-B780

3.5 mm

29 mm

No

e0

472.5 MHz

29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.