Rectangular Field Programmable Gate Arrays (FPGA) 716

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC4002XL-09CPQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.6 V

64

CMOS

1000

3.3

Flatpack

3 V

.65 mm

85 °C (185 °F)

1.2 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 1600 Logic gates

e3

217 MHz

30 s

245 °C (473 °F)

20 mm

XC3130-3PQ100I

Xilinx

FPGA

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

100

Yes

CMOS

80

5

5 V

Flatpack

QFP100,.7X.9,32

Field Programmable Gate Arrays

.8 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

No

e0

30 s

80

225 °C (437 °F)

XC8101-3PQ100C

Xilinx

FPGA

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

384

CMOS

1000

5

Flatpack

4.75 V

.65 mm

70 °C (158 °F)

384 CLBS, 1000 Gates

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

192 flip-flops; 3.3 V operation; OTP based

20 mm

XC3342A-6PQ100C

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

.65 mm

Quad

R-PQFP-G100

3.4 mm

14 mm

No

20 mm

XC4005E-4PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

196

CMOS

3000

5

Flatpack

4.5 V

.65 mm

2.7 ns

196 CLBS, 3000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 5000 Logic gates

e3

111 MHz

30 s

245 °C (473 °F)

20 mm

XC3020-100PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

5.25 V

64

CMOS

64

1000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

7 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

e0

100 MHz

30 s

64

225 °C (437 °F)

20 mm

XC5204-3PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

120

CMOS

4000

5

Flatpack

4.5 V

.65 mm

3 ns

120 CLBS, 4000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Typical gates = 4000-6000

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XC3390L-8VQ144I

Xilinx

FPGA

Gull Wing

144

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

3.3

Flatpack

Quad

R-PQFP-G144

No

XC8103-3PQ100C

Xilinx

FPGA

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

1024

CMOS

3000

5

Flatpack

4.75 V

.65 mm

70 °C (158 °F)

1024 CLBS, 3000 Gates

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

512 flip-flops; 3.3 V operation; OTP based

20 mm

XC8103-ESPQ100I

Xilinx

FPGA

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

1024

CMOS

3328

5

Flatpack

4.5 V

.65 mm

85 °C (185 °F)

5.5 ns

1024 CLBS, 3328 Gates

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

MAX 64 I/OS; MAX 512 flip-flops; OTP based

20 mm

XC4003E-3PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

100

CMOS

2000

5

Flatpack

4.5 V

.65 mm

2 ns

100 CLBS, 2000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 3000 Logic gates

e3

125 MHz

30 s

245 °C (473 °F)

20 mm

XC5204-5PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

120

CMOS

4000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

4.6 ns

120 CLBS, 4000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

MAX available 6000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XC3020A-7PQ100I

Xilinx

FPGA

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

64

1000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.5 V

.65 mm

85 °C (185 °F)

5.1 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 1500 Logic gates

e0

113 MHz

30 s

64

225 °C (437 °F)

20 mm

XC4005XL-09CPGQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.6 V

196

3000

3.3

Flatpack

3 V

.65 mm

1.2 ns

196 CLBS, 3000 Gates

Matte Tin

Quad

R-PQFP-G100

3.4 mm

14 mm

No

Can also use 9000 gates

e3

217 MHz

20 mm

XC5202-5PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

64

CMOS

2000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

4.6 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

MAX available 3000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XC3042-100PQ100I

Xilinx

FPGA

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

144

Yes

5.5 V

144

CMOS

82

2000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.5 V

.65 mm

85 °C (185 °F)

7 ns

144 CLBS, 2000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

100 MHz

30 s

82

225 °C (437 °F)

20 mm

XC3030-70PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

100

Yes

5.25 V

100

CMOS

80

1500

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

9 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

e0

70 MHz

30 s

80

225 °C (437 °F)

20 mm

XC4005XL-09CPQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.6 V

196

CMOS

3000

3.3

Flatpack

3 V

.65 mm

85 °C (185 °F)

1.2 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 5000 Logic gates

e3

217 MHz

20 mm

XC5202-4PQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

84

2000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.5 V

.65 mm

3.8 ns

64 CLBS, 2000 Gates

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Typical gates = 2000-3000

e0

83 MHz

30 s

84

225 °C (437 °F)

20 mm

XC3120A-3PQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

64

1000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.5 V

.65 mm

2.7 ns

64 CLBS, 1000 Gates

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 1500 Logic gates

e0

270 MHz

30 s

64

225 °C (437 °F)

20 mm

XC5202L-5PQ100C

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.6 V

64

CMOS

2000

3.3

Flatpack

3 V

.65 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Typical gates = 2000-3000

e0

20 mm

XC8109-ESPQ100I

Xilinx

FPGA

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

2688

CMOS

8700

5

Flatpack

4.5 V

.65 mm

85 °C (185 °F)

5.5 ns

2688 CLBS, 8700 Gates

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

MAX 78 I/OS; MAX 1344 flip-flops; OTP based

20 mm

XC4005-5PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

196

Yes

5.25 V

196

CMOS

112

4000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

4.5 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

616 flip-flops; typical gates = 4000-5000

e0

133.3 MHz

30 s

112

225 °C (437 °F)

20 mm

XC3390L-8VQ144C

Xilinx

FPGA

Gull Wing

144

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

3.3

Flatpack

Quad

R-PQFP-G144

No

XCV800-6PQG240I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

2.625 V

4704

888439

2.5

Flatpack

2.375 V

.65 mm

0.6 ns

4704 CLBS, 888439 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

333 MHz

20 mm

XC5402L-4PQ100C

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.3

Flatpack

.65 mm

Quad

R-PQFP-G100

3.4 mm

14 mm

No

20 mm

XC3042-100PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

82

2000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

7 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

e0

100 MHz

30 s

82

225 °C (437 °F)

20 mm

XC5206-5PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

196

CMOS

6000

5

Flatpack

4.5 V

.65 mm

4.6 ns

196 CLBS, 6000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

MAX available 10000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XC5202-5PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

64

CMOS

2000

5

Flatpack

4.5 V

.65 mm

4.6 ns

64 CLBS, 2000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

MAX available 3000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XC3042A-7PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

144

CMOS

2000

5

Flatpack

4.5 V

.65 mm

5.1 ns

144 CLBS, 2000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

Max usable 3000 Logic gates

e3

113 MHz

30 s

245 °C (473 °F)

20 mm

XC5204-6PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

120

CMOS

4000

5

Flatpack

4.5 V

.65 mm

5.6 ns

120 CLBS, 4000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

MAX available 6000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XC4002XL-3PQ100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

3.6 V

64

CMOS

64

1000

3.3

3.3 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

3 V

.65 mm

1.6 ns

64 CLBS, 1000 Gates

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 1600 Logic gates

e0

166 MHz

30 s

64

225 °C (437 °F)

20 mm

XC4002XL-09CPQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

152

Yes

3.6 V

64

CMOS

64

1000

3.3

3.3 V

Flatpack

QFP100,.67X.9

Field Programmable Gate Arrays

3 V

.65 mm

85 °C (185 °F)

1.2 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 1600 Logic gates

e0

217 MHz

30 s

64

225 °C (437 °F)

20 mm

XC4010XL-09CPQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.6 V

400

CMOS

7000

3.3

Flatpack

3 V

.65 mm

85 °C (185 °F)

1.2 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 10000 Logic gates

e3

217 MHz

20 mm

XCV400-6PQ240I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

2.625 V

2400

468252

2.5

Flatpack

2.375 V

.65 mm

0.6 ns

2400 CLBS, 468252 Gates

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e0

333 MHz

20 mm

5962-9461701MPA

Xilinx

FPGA

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

No

MIL-STD-883

In-Line

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T8

4.318 mm

7.62 mm

No

e0

9.906 mm

XC3120-09PQ100C

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

64

CMOS

1000

5

Flatpack

4.75 V

.65 mm

1.5 ns

64 CLBS, 1000 Gates

Quad

R-PQFP-G100

3.4 mm

14 mm

No

Typical gates = 1000-1500

370 MHz

20 mm

XC8109-ESPQ100C

Xilinx

FPGA

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

2688

CMOS

8700

5

Flatpack

4.75 V

.65 mm

70 °C (158 °F)

5.5 ns

2688 CLBS, 8700 Gates

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

MAX 78 I/OS; MAX 1344 flip-flops; OTP based

20 mm

EP3C5U256C7N

Altera

FPGA

Other

Ball

256

FBGA

Rectangular

Plastic/Epoxy

5136

Yes

1.25 V

5136

CMOS

182

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

5136 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

30 s

182

260 °C (500 °F)

14 mm

EPB1400PC

Altera

FPGA

Commercial

Through-Hole

40

DIP

Rectangular

Plastic

No

CMOS

In-Line

DIP40,.6

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

No

e0

220 °C (428 °F)

EP3C120F780C8ES

Altera

FPGA

Other

Ball

780

BGA

Rectangular

Plastic/Epoxy

Yes

1.25 V

119088

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

119088 CLBS

0 °C (32 °F)

Tin Lead

Bottom

R-PBGA-B780

3.5 mm

29 mm

No

e0

472.5 MHz

29 mm

EP3C25E144C7

Altera

FPGA

Other

Gull Wing

144

LFQFP

Rectangular

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

82

1.2

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

85 °C (185 °F)

24624 CLBS

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G144

3

1.6 mm

20 mm

No

e0

472.5 MHz

20 s

82

220 °C (428 °F)

20 mm

EP3C16U484C8

Altera

FPGA

Other

Ball

484

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

346

1.2

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin Lead

Bottom

R-PBGA-B484

3

2.2 mm

19 mm

No

e0

472.5 MHz

20 s

346

220 °C (428 °F)

19 mm

EP3C16U256C6N

Altera

FPGA

Other

Ball

256

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

168

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

30 s

168

260 °C (500 °F)

14 mm

EP3C120F484C7ES

Altera

FPGA

Other

Ball

484

BGA

Rectangular

Plastic/Epoxy

Yes

1.25 V

119088

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

119088 CLBS

0 °C (32 °F)

Tin Lead

Bottom

R-PBGA-B484

2.6 mm

23 mm

No

e0

472.5 MHz

23 mm

EP3C80U484C7N

Altera

FPGA

Other

Ball

484

FBGA

Rectangular

Plastic/Epoxy

81264

Yes

1.25 V

81264

CMOS

295

1.2

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

81264 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

R-PBGA-B484

3

2.2 mm

19 mm

No

e1

472.5 MHz

30 s

295

260 °C (500 °F)

19 mm

EPB1400DM

Altera

FPGA

Military

Through-Hole

40

DIP

Rectangular

Ceramic

No

CMOS

In-Line

DIP40,.6

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T40

No

e0

220 °C (428 °F)

EPB1400PC-2

Altera

FPGA

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

CMOS

In-Line

DIP40,.6

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

No

e0

220 °C (428 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.