Square Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU3P-2FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	355950	Yes	.876 V	20340		304		0.85			Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
10CL080YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square		Plastic/Epoxy		Yes		5079				1.2			Grid Array, Fine Pitch				.8 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.2 mm	19 mm								19 mm
LCMXO3LF-2100C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square		Plastic/Epoxy		Yes	3.465 V	264				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
XC6SLX16-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square		Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	232		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	232	260 °C (500 °F)	15 mm
A3PE1500-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s	147	245 °C (473 °F)	28 mm
XC4VFX12-10FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square		Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	320		1.2			Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC7A50T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7K325T-1FB676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	326080	Yes			CMOS	400				1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B676	4			No		e0	1818 MHz	30 s	400	225 °C (437 °F)
XC7A15T-2CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square		Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	10 mm
ICE40HX8K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square		Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2			93	260 °C (500 °F)	9 mm
XC3S400-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	173	400000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	630 MHz	30 s	173	260 °C (500 °F)	17 mm
XC6SLX45-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square		Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	218		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	218	260 °C (500 °F)	15 mm
A3P1000-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M2GL005-TQG144	Microchip Technology	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-PQFP-G144	3	1.6 mm	20 mm					30 s		260 °C (500 °F)	20 mm
XQR5VFX130-1CN1752B	Xilinx	FPGA	Military		1752	CGA	Square	1M Rad(Si)	Ceramic, Metal-Sealed Cofired	131072	Yes	1.05 V	10240	CMOS			1			Grid Array			.95 V	1 mm	125 °C (257 °F)	0.11 ns	10240 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1752		8.8 mm	45 mm	No							45 mm
M2GL060-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square		Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm					30 s		260 °C (500 °F)	17 mm
M2GL090T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	86316	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm
XC7A50T-1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7S50-L1CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		250		15 mm
10CL006YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square		Plastic/Epoxy		Yes	1.25 V	392				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10M02SCE144C7G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square		Plastic/Epoxy	2000	Yes	3.15 V	125		246		3		3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
LFD2NX-40-8BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square		Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm			e1		30 s	111	260 °C (500 °F)	14 mm
LCMXO2-7000HC-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	6864	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
XC6SLX25T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	190		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	190	260 °C (500 °F)	15 mm
EP2C5T144I8N	Intel	FPGA		Gull Wing	144	LFQFP	Square		Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	89		1.2		1.2,1.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm			288 CLBS		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also requires 3.3 V supply	e3			81		20 mm
MPF100T-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.03 V		CMOS	244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
XC6SLX25-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	266		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	266	250 °C (482 °F)	23 mm
XC7S25-2FTGB196C	Xilinx	FPGA	Other	Ball	196	LFBGA	Square		Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1			Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1286 MHz		150		15 mm
LFD2NX-40-7BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square		Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92		1						.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm						92		12 mm
10M25DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
LCMXO2-7000HC-4FTG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	6864	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
10M16DAF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square		Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			320		17 mm
ICE40HX4K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square		Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	93		1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2			93	260 °C (500 °F)	9 mm
LCMXO2-256HC-4SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			256	Yes	3.6 V	32		40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
10M25DAF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			360		17 mm
ICE40HX8K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square		Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2			93	260 °C (500 °F)	9 mm
LCMXO2-640UHC-4TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	640	Yes	3.465 V			107		2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3		30 s	107	260 °C (500 °F)	20 mm
10M04SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square		Plastic/Epoxy	4000	Yes	3.15 V	250		246		3		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)		250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				246		11 mm
XC7A50T-3CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No		e1	1412 MHz	30 s	250	260 °C (500 °F)	10 mm
LCMXO2-1200ZE-1MG132I	Lattice Semiconductor	FPGA		Ball	132	BGA	Square		Plastic/Epoxy	1280	Yes	1.26 V			104		1.2	Tray	1.2 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
LFXP2-8E-5FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
5CGXFC7C6F23I7N	Intel	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1		30 s	240	260 °C (500 °F)	23 mm
XC3S250E-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	172	250000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	132	260 °C (500 °F)	17 mm
XC7A15T-2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square		Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	10 mm
LCMXO2-256ZE-1MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square		Plastic/Epoxy	256	Yes	1.26 V			55		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	55	250 °C (482 °F)	8 mm
LCMXO2280C-3BN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square		Plastic/Epoxy	2280	Yes	3.465 V	285		211		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			211	260 °C (500 °F)	14 mm
M2GL010-TQG144	Microchip Technology	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-PQFP-G144	3	1.6 mm	20 mm					30 s		260 °C (500 °F)	20 mm
MPF100T-1FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.03 V		CMOS	244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.