Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C5F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5136 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	182	260 °C (500 °F)	17 mm
EP3C40F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		331		23 mm
10M16SAU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply	e1		30 s	320	260 °C (500 °F)	11 mm
EP3C10E144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	94	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3	472.5 MHz		94		20 mm
5CEBA7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
10M04SCE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3	3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)	250 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
EP2C8Q208C8N	Intel	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	138	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	516 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e3	402.5 MHz		130		28 mm
10M04SAM153C8G	Intel	FPGA	Other	Ball	153	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Grid Array	BGA153,15X15,20		2.85 V	.5 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				246		8 mm
EP4CGX15BF14C8N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
10M02SCE144A7G	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3	3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	125 °C (257 °F)	125 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
10M08SAM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA153,15X15,20		2.85 V	.5 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				250		8 mm
5CEBA2F17C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	128	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
EP4CE40F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475		331	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz	30 s	331	260 °C (500 °F)	23 mm
10M08SAU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply	e1		30 s	250	260 °C (500 °F)	11 mm
EP4CE10F17I7N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		645 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	179	260 °C (500 °F)	17 mm
10M25SAE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	25000	Yes	3.15 V	1563		360	3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	100 °C (212 °F)	1563 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				360		20 mm
EP3C40U484I7	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	39600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.05 mm	19 mm	No		e0	472.5 MHz		331		19 mm
10M04SCE144C8G	Intel	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3	3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
EP3C25F324C8NES	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	24624			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324		2.2 mm	19 mm	No		e1	472.5 MHz				19 mm
EP3C16F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	168	260 °C (500 °F)	17 mm
EP4CE55F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm		3491 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz	30 s	327	260 °C (500 °F)	23 mm
EP1C4F324C8N	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	275 MHz		249		19 mm
10CL055YF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm								23 mm
EP4CE40F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475		331	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm		2475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		331		23 mm
10M08SCU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				250		11 mm
EP3C25E144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	82	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	100 °C (212 °F)	24624 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3	472.5 MHz		82		20 mm
EP4CE10E22I7N	Intel	FPGA		Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		91	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm		645 CLBS		Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
10M02SCM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3	3/3.3 V	Grid Array	BGA153,15X15,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)	125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm	No	Also Operates at 3.3 V nominal supply				246		8 mm
EP4CGX15BF14I7N	Intel	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm		900 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz	30 s	72	260 °C (500 °F)	14 mm
10M04SCU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				246		11 mm
EP2C5F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	158	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	288 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		150		17 mm
EP4CE15E22C8N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		81	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		81		20 mm
EP4CE55F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP3C55F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	55856 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP3C10M164C8N	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V		CMOS	106	1.2	1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B164	3	1.2 mm	8 mm	No		e1	472.5 MHz	30 s	106	260 °C (500 °F)	8 mm
EP3C10F256I7N	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	10320 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	182	260 °C (500 °F)	17 mm
10CX150YF672E5G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	236	.9		Grid Array			.87 V		100 °C (212 °F)	54770 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									236
10M08SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				250		11 mm
10M40DAF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	2500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
EP4CE15F17C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		165	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		165		17 mm
10CL006YU256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2		Grid Array			1.15 V		85 °C (185 °F)	392 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256
10CL010YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2		Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	100 °C (212 °F)	645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
5CEFA5F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm					Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
10M16SAU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
EP3C40Q240C8N	Intel	FPGA	Other	Gull Wing	240	FQFP	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	128	1.2		Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No		e3	472.5 MHz		128		32 mm
10M16SCU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	320	260 °C (500 °F)	11 mm
EP4CE15F17C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		165	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		165		17 mm
EP3C25F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	156	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.