Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2C35F484C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	322	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2076 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	306	260 °C (500 °F)	23 mm
EP2C8F256I8N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		516 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		174		17 mm
10M16DAF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			320		17 mm
EP3C40F780I7N	Intel	FPGA	Industrial	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	39600 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	535	260 °C (500 °F)	29 mm
10CL010YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2		Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10M16DAU324I7G	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					320		15 mm
5CEFA7U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	230	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm	No					230		19 mm
10M02SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)	125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				246		15 mm
10M08DAU324C8GES	Intel	FPGA
EP1S25F672C7N	Intel	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1			706		27 mm
EP2C35F672C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2076 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	459	260 °C (500 °F)	27 mm
EP4CE40F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475		331	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2475 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz	30 s	331	260 °C (500 °F)	23 mm
EP3C40F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		331		23 mm
10CX150YU484E5G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	188	.9		Grid Array			.87 V		100 °C (212 °F)	54770 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484									188
EP2C35F484I8N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	322	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm		2076 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	306	260 °C (500 °F)	23 mm
EP3C40F484C6N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		331		23 mm
10CL010YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
5CEFA5U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	238	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm	No					238		19 mm
EP4CE115F29I7N	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	114480	Yes	1.25 V	7155		531	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm		7155 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		531		29 mm
10CL016YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2		Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10M16SCU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M04SCM153C8G	Intel	FPGA	Other	Ball	153	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Grid Array	BGA153,15X15,20		2.85 V	.5 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				246		8 mm
10CL025YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)	1539 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10CX105YF672I6G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236	.9		Grid Array			.87 V		100 °C (212 °F)	38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672									236
10M04SAE144C8G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				246		20 mm
10CL016YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2		Grid Array, Fine Pitch			1.15 V	.8 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm								19 mm
5CGXFC3B7U15C8N	Intel	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	31500	Yes	1.13 V	1346	CMOS	144	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)	1346 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					144		15 mm
10CL016YU484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2		Grid Array			1.15 V		85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484
EP3C5M164I7N	Intel	FPGA	Industrial	Ball	164	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS	106	2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)	5136 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164				No					106
10M02DCV36C8G	Intel	FPGA	Commercial Extended	Ball	36	VFBGA	Rectangular	Plastic/Epoxy	2000	Yes	1.25 V	125		246	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)	125 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36	1	.54 mm	3.396 mm	No					246		3.466 mm
10M40DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	2500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
EP2C20F484C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	315	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1172 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	299	260 °C (500 °F)	23 mm
EP3C25F324C6N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		215		19 mm
EP1C12Q240I7N	Intel	FPGA	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		173	1.5	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)	1206 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	320 MHz		173		32 mm
10M50SCE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	50000	Yes	3.15 V	3125		500	3	3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)	3125 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				500		20 mm
EP3C16F256I7	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	15408 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		168		17 mm
10M08DCV81I7G	Intel	FPGA	Industrial	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No					250		4.496 mm
5CGTFD7C5F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V	5648	TSMC	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)	5648 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
EP3C40F780C8N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	39600 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	535	260 °C (500 °F)	29 mm
EP3C80F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	295	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	81264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		295		23 mm
EP3C25F324C7N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		215		19 mm
EP3C5F256C7N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5136 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		182		17 mm
10M08DAF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2		Grid Array	BGA256,16X16,40		1.15 V	1 mm	125 °C (257 °F)	500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			250		17 mm
10M16SAU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)	1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M25DCF484A7G	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2		Grid Array	BGA484,22X22,40		1.15 V	1 mm	125 °C (257 °F)	1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			360		23 mm
EP1C6T144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		98	1.5	1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	598 CLBS	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	275 MHz	30 s	98	260 °C (500 °F)	20 mm
10CL055YF484C6G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm								23 mm
10M04SAE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	100 °C (212 °F)	250 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				246		20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.