Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CEBA2F17C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	128	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
EP3C25F324C8	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		215		19 mm
EP4CE75F23I8LN	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75408	Yes	1.03 V	4713		295	1	1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm			4713 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	362 MHz		295		23 mm
10AX022E4F29I3SG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	8033	TSMC	288	0.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		8033 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10M08DAF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			250		17 mm
10M08DFV81C7G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No					250		4.496 mm
10M16SCU169I7P	Intel	FPGA	Industrial	Ball	169	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M50DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500	1.2		Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						500		23 mm
10M50DAF672I7G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
5CEBA2F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					224		23 mm
EP1C12Q240C6N	Intel	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		173	1.5	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		1206 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	405 MHz		173		32 mm
EP2C50F484I8N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3158	CMOS	294	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			3158 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	278	245 °C (473 °F)	23 mm
EP2S15F672C3N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	15600	Yes	1.25 V	6240	CMOS	366	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	4.45 ns	6240 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	717 MHz		358		35 mm
EP4CE30F29C7N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	28848	Yes	1.25 V	1803		535	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1803 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		535		29 mm
10AX027E4F29E3SG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	360	0.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10CX105YF780E6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	284	.9		Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780									284
10CX105YU484E5G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	188	.9		Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484									188
10M25DAF256I7P	Intel	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2		Grid Array, Low Profile	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm						360		17 mm
5CEBA5F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V	2908	CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		2908 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
EP1S20F484I6	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V		CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm						Bottom	S-PBGA-B484				No					586
EP1S20F484I6N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V		CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1			586
EP4CE22E22A7N	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		79	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	125 °C (257 °F)		1395 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		79		20 mm
10M16DAF484A7G	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2		Grid Array	BGA484,22X22,40		1.15 V	1 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			320		23 mm
5CEBA2U15C7N	Intel	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	176	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					176		15 mm
5CEFA5F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
EP3C55U484I7N	Intel	FPGA	Industrial	Ball	484	FBGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2		Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		55856 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		327		19 mm
EP3C5E144C7	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	94	1.2		Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	472.5 MHz		94		20 mm
EP3C80U484C8N	Intel	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	295	1.2		Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		295		19 mm
EP4CGX30CF19I7N	Intel	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm			1840 CLBS		Tin Silver Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	472.5 MHz	30 s	150	260 °C (500 °F)	19 mm
10M04DCF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s	246	260 °C (500 °F)	17 mm
10M04DCU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
5CEBA7F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
EP1C3T144I7	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		104	1.5	1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		291 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	320 MHz		104		20 mm
EP3C120F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	283	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		283		23 mm
EP4CE15M8I7N	Intel	FPGA		Ball	164	TFBGA	Square	Plastic/Epoxy	15408	Yes		15408		89	1	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20	Field Programmable Gate Arrays		.5 mm			15408 CLBS		Tin Silver Copper	Bottom	S-PBGA-B164	3	1.2 mm	8 mm	No		e1			89		8 mm
EP4CE22E22I8LN	Intel	FPGA		Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395		79	1	1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm			1395 CLBS		Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	362 MHz		79		20 mm
10CL006YE144C6G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10CL025YE144C6G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		1539 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10M08DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2		Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						250		23 mm
10M25DAF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2		Grid Array	BGA256,16X16,40		1.15 V	1 mm	125 °C (257 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			360		17 mm
5CEBA4F17C6N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	128	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
5CEFA2F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	304	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					304		23 mm
EP2C35F672I8	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			2076 CLBS		Tin Lead	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		459		27 mm
EP3C80F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	295	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		295		23 mm
EP4CE55F23I7	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			3491 CLBS		Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
10CL006YE144A7G	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	125 °C (257 °F)		392 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10M08DCU324A7G	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					250		15 mm
10M16DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2		Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						320		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.