Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10M16DCF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			320		17 mm
5AGXMB1G4F31C4N	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		11321 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1			704		31 mm
5CEFA4U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	48000	Yes	1.13 V		CMOS	304	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm	No					304		19 mm
5CGTFD7C5U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm	No					240		19 mm
EP2C20F484C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	315	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1172 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	450 MHz		299		23 mm
EP3C16U484C8N	Intel	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2		Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		346		19 mm
EP3C55F484I7	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		55856 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
10AX016E4F29E3SG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	288	0.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10CL080ZF780I8G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423	1		Grid Array	BGA780,28X28,40		.97 V	1 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm		-40 to 125 °C range is available as extended industrial				423		29 mm
10M16SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				320		15 mm
10M50DAF672C8G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
EP3C16Q240C8	Intel	FPGA	Other	Gull Wing	240	FQFP	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	160	1.2		Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No		e0	472.5 MHz		160		32 mm
EP3C55F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4SGX530KH40I4G	Intel	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	21248			0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	100 °C (212 °F)		21248 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.4 mm	42.5 mm								42.5 mm
10AX066N2F40E2SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	588	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No	Also Operates at 0.95 V nominal supply				588		40 mm
10CL080YU484C8G	Intel	FPGA
10CX105YF780I6G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	284	.9		Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780									284
10M16DCF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			320		23 mm
10M50DAF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500	1.2		Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			500		17 mm
5AGXBB1D4F40I5N	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		11321 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1	622 MHz		704		40 mm
EP1C4F400C8N	Intel	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		301	1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No		e1	275 MHz		301		21 mm
EP1SGX40GF1020C6N	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	624	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		4697 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1			624		33 mm
EP3C25F324C6	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		215		19 mm
EP3C55F484C6N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4CE75F23I7	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	4713		295	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			4713 CLBS		Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0			295		23 mm
10AX048H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					492		35 mm
10CL016YE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.65 mm	20 mm			e3		30 s		260 °C (500 °F)	20 mm
10CX150YF672I5G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	236	.9		Grid Array			.87 V		100 °C (212 °F)		54770 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672									236
10M04SAU324I7G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				246		15 mm
10M08SAE144A7G	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				250		20 mm
5CEBA4U15C8N	Intel	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	176	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					176		15 mm
5CEFA9F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	230	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					230		23 mm
5CEFA9F31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	488	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1		30 s	488	260 °C (500 °F)	31 mm
5CGXFC4C6U19A7N	Intel	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					224		19 mm
EP2AGX190FF35C6G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		612	0.9		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		7612 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.55 mm	35 mm						612		35 mm
EP2AGZ225HF40I3N	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	224000	Yes	.93 V		CMOS	734	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		3.5 mm	40 mm	No		e1	500 MHz		734		40 mm
EP2C15AF256C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V	903	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		903 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		144		17 mm
EP2S30F672C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	13552	CMOS	500	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	13552 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	640 MHz		492		35 mm
EP3C25F324C7	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		215		19 mm
EP3SL50F780C4N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V	1900		488	0.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		1900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1			488		29 mm
EP4CE15F23C8LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		346	1	1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	362 MHz		346		23 mm
EP4CE55F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4CE6E22A7N	Intel	FPGA	Automotive	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		91	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	125 °C (257 °F)		392 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
EP4CE6E22C8L	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		91	1	1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	362 MHz		91		20 mm
EP4CGX150DF27I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	149760	Yes	1.25 V	149760		393	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			149760 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	472.5 MHz	30 s	393	260 °C (500 °F)	27 mm
EP4CGX22CF19C8N	Intel	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1330 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	472.5 MHz		150		19 mm
10AX016E3F29I2SG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	288	0.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No	Also Operates at 0.95 V nominal supply				288		29 mm
10AX066H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					492		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.