Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2S30F484C5N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	13552	CMOS	342	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	13552 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1	640 MHz		334		23 mm
EP3C5F256I7	Intel	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		5136 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0			182		17 mm
EP3SL150F1152C4N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		744	0.9	1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		5700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No	It can also operate from 1.05 to 1.15 V supply				744		35 mm
EP4CE115F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	114480	Yes	1.25 V	7155		283	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		7155 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		283		23 mm
EP4CE22F17C6N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		153	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		153		17 mm
EP4CE30F29C8N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	28848	Yes	1.03 V	28848		535	1	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		28848 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.6 mm	29 mm	No	It can also operate at 1.2 V supply	e1	472.5 MHz		535		29 mm
EP4CE40F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475		331	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		331		23 mm
10CL010YM164C6G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CL040YU484C8G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2		Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm								19 mm
10CL055YU484C8G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2		Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm								19 mm
10CL080ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423	1		Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm		-40 to 125 °C range is available as extended industrial				423		23 mm
10M04SAM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Grid Array	BGA153,15X15,20		2.85 V	.5 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				246		8 mm
10M25DCF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			360		17 mm
10M25SCE144I7G	Intel	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	25000	Yes	3.15 V	1563		360	3	3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				360		20 mm
10M40DAF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
10M40SCE144C8G	Intel	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	40000	Yes	3.15 V	2500		500	3	3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				500		20 mm
1SG250HU2F50E1VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2422000	Yes		302750		736			Grid Array	BGA2397,49X49,40			1 mm	100 °C (212 °F)		302750 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2397		3.881 mm	50 mm						736		50 mm
1SG250HU2F50I1VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2422000	Yes		302750		736			Grid Array	BGA2397,49X49,40			1 mm	100 °C (212 °F)		302750 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2397		3.881 mm	50 mm						736		50 mm
5CEBA2F17A7N	Intel	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	128	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
5CEFA5F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CGXFC5C6U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
EP1C6Q240I7N	Intel	FPGA	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		598 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	320 MHz		185		32 mm
EP2SGX60EF1152C5N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	534	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	640 MHz		534		35 mm
EP4CE10F17I8LN	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		179	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm			645 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	362 MHz		179		17 mm
EP4CE10U14I7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic	10320	Yes	1.25 V	645		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)		645 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1	472.5 MHz		179
EP4CE22F17I8L	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395		153	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm			1395 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	362 MHz		153		17 mm
EP4SGX230FF35I3N	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120		564	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		9120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		3.6 mm	35 mm	No		e1	717 MHz		564		35 mm
10M25DCF484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2		Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			360		23 mm
5CEBA7U19C7N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	1.9 mm	19 mm	No		e1		30 s	240	260 °C (500 °F)	19 mm
5SGXMA3H2F35C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5SGXMA3H2F35I3N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		12830 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	3.6 mm	35 mm	No		e1		30 s	432	245 °C (473 °F)	35 mm
EP2SGX60EF1152C4N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	534	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	717 MHz		534		35 mm
EP3C25F256I7	Intel	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		24624 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		156		17 mm
EP4CE22E22C8L	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395		79	1	1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	362 MHz		79		20 mm
EP4CE40U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	39600	Yes		2475		328	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm			2475 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.05 mm	19 mm	No		e1		30 s	328	260 °C (500 °F)	19 mm
EP4SGX230FF35I3G	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120		564	.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		9120 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						564		35 mm
10CL010ZM164I8G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		176	1		Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20		.97 V	.5 mm	100 °C (212 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm		-40 to 125 °C range is available as extended industrial				176		8 mm
10M08DCV81C8G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No					250		4.496 mm
1SG280HN1F43I1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5CGXFC4C7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V	1886	CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		1886 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
EP1C12F256C7	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		185	1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1206 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	320 MHz	20 s	185	220 °C (428 °F)	17 mm
EP2AGX45DF29I3N	Intel	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP3C5F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS	182	2.5	1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		5136 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		3.5 mm	17 mm	No					182		17 mm
EP3C80F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	295	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		295		23 mm
10AX016E4F27E3SG	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	240	0.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672		3.35 mm	27 mm	No					240		27 mm
10M08DCF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			250		23 mm
10M40DCF256I6G	Intel	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2		Grid Array, Low Profile	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		2500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			500		17 mm
EP3C10F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS	182	2.5	1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		10320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1			182		17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.