Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C10F256I7	Intel	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	10320 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		182		17 mm
EP3C120F484C8NES	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484		2.6 mm	23 mm	No		e1	472.5 MHz				23 mm
EP4CE15F23C8L	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		346	1	1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	362 MHz		346		23 mm
EP4SGX230FF35I3	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	564	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm		9120 CLBS		Tin Lead	Bottom	S-PBGA-B1152		3.6 mm	35 mm	No		e0	717 MHz		564		35 mm
10AX016C4U19E3LG	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	240	0.9	0.9 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)	6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm	No					240		19 mm
10AX115S1F45I1SG	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	624	0.9		Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)	42720 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm		Also Operates at 0.95 V nominal supply				624		45 mm
10CL010YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2		Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	125 °C (257 °F)	645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10CL016YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10CX220YU484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	188	.9		Grid Array			.87 V		100 °C (212 °F)	80330 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484									188
1SG040HH3F35E2LG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	378000	Yes	.88 V	47250		430	0.85		Grid Array	BGA1152,34X34,40		.82 V	1 mm	100 °C (212 °F)	47250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.706 mm	35 mm						430		35 mm
1SG280HN1F43I1VGAS	Intel	FPGA
1SG280LN2F43E2VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)	344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
1SG280LN2F43E2VGAS	Intel	FPGA
1SG280LN2F43E2VGS2	Intel	FPGA
1SG280LN3F43I1VP	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)	344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5CGXBC7D6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5CGXFC4C6F27I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	368	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm				Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1		30 s	368	260 °C (500 °F)	27 mm
EP1C3T144C8	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		104	1.5	1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	291 CLBS	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	275 MHz	30 s	104	220 °C (428 °F)	20 mm
EP2C5T144C6N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	89	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	288 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also requires 3.3 V supply	e3	500 MHz		81		20 mm
EP3C25U256C8N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		156		14 mm
EP4CE15F17I8LN	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		165	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm		963 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	362 MHz		165		17 mm
EP4CE55F23I8L	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.03 V	3491		327	1	1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		3491 CLBS		Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	362 MHz		327		23 mm
EP4CE6E22C7	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		91	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	472.5 MHz		91		20 mm
10AX016E4F29I3SG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	288	0.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	6151 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10CL006ZE144I8G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		176	1		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		.97 V	.5 mm	100 °C (212 °F)	392 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm		-40 to 125 °C range is available as extended industrial				176		20 mm
10CL010ZE144I8G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		176	1		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		.97 V	.5 mm	100 °C (212 °F)	645 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm		-40 to 125 °C range is available as extended industrial				176		20 mm
10M08DCV81C7G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No					250		4.496 mm
10M08SCE144C7G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				250		20 mm
10M40DCF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
10M50DAF256C6G	Intel	FPGA
1SG280HN1F43E1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)	344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5CEFA5F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CEFA5U19A7N	Intel	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					224		19 mm
5CGXFC5C6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	368	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			368		27 mm
5CGXFC7D7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5CSEBA6U23I7LN	Intel	FPGA
5SGXEABN1F45I2G	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	952000	Yes	.93 V	35920	TSMC	840	.9		Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)	35920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.85 mm	45 mm						840		45 mm
EP1AGX60DF780I6N	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	60100		350	1.2	1.2,2.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	60100 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	640 MHz		350		29 mm
EP1C12F324C7N	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1206 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e1	320 MHz		249		19 mm
EP1C12F324I7	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	1206 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e0	320 MHz	20 s	249	220 °C (428 °F)	19 mm
EP1SGX25CF672C6N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	455	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1			455		27 mm
EP1SGX25CF672C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	455	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1			455		27 mm
EP2AGX125EF29C4G	Intel	FPGA		Ball	780	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9		Grid Array, Heat Sink/Slug	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)	4964 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.6 mm	29 mm						372		29 mm
EP2C15AF484C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	14448	Yes	1.25 V	903	CMOS	315	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	903 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		307		23 mm
EP2C35U484C8N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	322	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	2076 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.2 mm	19 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		306		19 mm
EP3C120F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	283	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	119088 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		283		23 mm
EP3C120F780C7N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	531	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	119088 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	531	260 °C (500 °F)	29 mm
EP3C120F780C7NES	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780		3.5 mm	29 mm	No		e1	472.5 MHz				29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.