Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10CX085YU484E6G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	188	.9		Grid Array			.87 V		100 °C (212 °F)		31000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484									188
10M50DAF672I6G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500	1.2		Grid Array	BGA672,26X26,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672		2 mm	27 mm			e1			500		27 mm
5CGTFD5C5M13I7N	Intel	FPGA	Industrial	Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V	2908	CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	100 °C (212 °F)		2908 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
EP1AGX20CF780C6N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	21580		230	1.2	1.2,2.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		21580 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	640 MHz		230		29 mm
EP1S10F672C7N	Intel	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1			426		27 mm
10AX016E3F27E2SG	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	240	0.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672		3.35 mm	27 mm	No	Also Operates at 0.95 V nominal supply				240		27 mm
10AX027H3F34E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	384	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				384		35 mm
5AGZME1E2H29C3G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.88 V	8302		342	0.85		Grid Array	BGA780,28X28,40		.82 V	1 mm	85 °C (185 °F)		8302 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.5 mm	33 mm						342		33 mm
10AX066N1F40I1HG	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC	588			Grid Array	BGA1517,39X39,40			1 mm	100 °C (212 °F)		25168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm						588		40 mm
10M50DCF484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500	1.2		Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm			e1			500		23 mm
5CGTFD9E5F35C7N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS	560	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		11356 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No					560		35 mm
EP1C6Q240C7N	Intel	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		598 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	320 MHz		185		32 mm
EP2C5Q208C8	Intel	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	142	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		288 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		134		28 mm
10AX027H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	384	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					384		35 mm
10AX057H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		21708 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	3	3.35 mm	35 mm	No		e1		30 s	492	245 °C (473 °F)	35 mm
10AX090N2F45E1SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				768		45 mm
10CL016YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2		Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10CX220YF672E6G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	236	.9		Grid Array			.87 V		100 °C (212 °F)		80330 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									236
10M16DAF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			320		23 mm
5AGXMA5G4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.07 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						544		35 mm
5CEFA7F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No					336		27 mm
5CGXFC4C6F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
5CGXFC4C6M13I7N	Intel	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm						Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
EP4CE115F29C7N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	114480	Yes	1.25 V	7155		531	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		7155 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		531		29 mm
EP4CE6E22C6N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		91	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
EP4CGX110DF27I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	109424	Yes	1.25 V	109424		393	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			109424 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	472.5 MHz	30 s	393	260 °C (500 °F)	27 mm
EP4SGX70DF29C2XG	Intel	FPGA
10AX032E4F29I3LG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	TSMC	360	0.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10AX057H2F34I2SG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		21708 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				492		35 mm
10AX090S2F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	624	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				624		45 mm
10M04DCF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	125 °C (257 °F)		250 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			246		17 mm
1SG085HN1F43I1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	841000	Yes		105125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		105125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5AGXBA7D4F35C4N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168		544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		9168 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1	670 MHz		544		35 mm
5AGXFB3H4F40C5N	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		13688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1	622 MHz		704		40 mm
5AGXFB5K4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	420000	Yes	1.13 V	15849	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)		15849 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						704		40 mm
5CEFA5U19C7N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	238	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					238		19 mm
5CGTFD5C5F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	368	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			368		27 mm
5CGXFC7D6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm			e1					27 mm
5SGSMD8K3F40I3LG	Intel	FPGA
5SGXEA5N2F45I2N	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	840	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
EP1S40F1020I6	Intel	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	818	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1 mm			4697 CLBS		Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0			818		33 mm
EP2AGX65DF25C5N	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		260	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		2530 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572	3	2.2 mm	25 mm	No		e1	500 MHz		260		25 mm
EP2C35F672C6N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2076 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	500 MHz		459		27 mm
EP2S180F1020I4N	Intel	FPGA	Industrial	Ball	1020	BGA	Square	Plastic/Epoxy	179400	Yes	1.25 V	8970	CMOS	742	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	8970 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	4	3.5 mm	33 mm	No		e1	717 MHz		734		33 mm
EP2S60F484I4N	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	3022	CMOS	334	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	3022 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1	717 MHz		326		23 mm
EP3C16E144C7N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	84	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3	472.5 MHz		84		20 mm
EP3C16U484I7N	Intel	FPGA	Industrial	Ball	484	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2		Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		15408 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		346		19 mm
EP3C40F324C8	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		195		19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.