Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
60440 |
Yes |
1.25 V |
60440 |
CMOS |
534 |
1.2 |
1.2,1.2/3.3,3.3 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 °C (185 °F) |
4.45 ns |
60440 CLBS |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1152 |
3 |
3.5 mm |
35 mm |
No |
e0 |
717 MHz |
534 |
35 mm |
|||||||||
|
Intel |
FPGA |
Other |
Ball |
256 |
FBGA |
Rectangular |
Plastic/Epoxy |
10320 |
Yes |
1.25 V |
10320 |
CMOS |
182 |
1.2 |
Grid Array, Fine Pitch |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
85 °C (185 °F) |
10320 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
3 |
2.2 mm |
14 mm |
No |
e1 |
472.5 MHz |
182 |
14 mm |
||||||||||
|
Intel |
FPGA |
Automotive |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
15408 |
Yes |
2.625 V |
15408 |
CMOS |
168 |
2.5 |
1.2/3.3 V |
Grid Array |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
2.375 V |
1 mm |
125 °C (257 °F) |
15408 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B256 |
3.5 mm |
17 mm |
No |
168 |
17 mm |
|||||||||||||
|
Intel |
FPGA |
Automotive |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
24624 |
Yes |
2.625 V |
24624 |
CMOS |
82 |
2.5 |
1.2/3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
125 °C (257 °F) |
24624 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
No |
82 |
||||||||||||||||
Intel |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Rectangular |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
24624 |
CMOS |
82 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
24624 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
472.5 MHz |
82 |
20 mm |
|||||||||||
|
Intel |
FPGA |
Other |
Ball |
324 |
BGA |
Rectangular |
Plastic/Epoxy |
39600 |
Yes |
1.25 V |
39600 |
CMOS |
195 |
1.2 |
Grid Array |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 °C (185 °F) |
39600 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B324 |
3 |
2.2 mm |
19 mm |
No |
e1 |
472.5 MHz |
195 |
19 mm |
||||||||||
Intel |
FPGA |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
39600 |
Yes |
1.25 V |
39600 |
CMOS |
331 |
1.2 |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 °C (185 °F) |
39600 CLBS |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.4 mm |
23 mm |
No |
e0 |
472.5 MHz |
331 |
23 mm |
|||||||||||
Intel |
FPGA |
Industrial |
Ball |
484 |
FBGA |
Square |
Plastic/Epoxy |
55856 |
Yes |
1.25 V |
55856 |
CMOS |
327 |
1.2 |
Grid Array, Fine Pitch |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
100 °C (212 °F) |
55856 CLBS |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
2.05 mm |
19 mm |
No |
e0 |
472.5 MHz |
327 |
19 mm |
||||||||||||
Intel |
FPGA |
Other |
Ball |
256 |
LFBGA |
Square |
Plastic/Epoxy |
5136 |
Yes |
1.25 V |
5136 |
CMOS |
182 |
1.2 |
Grid Array, Low Profile, Fine Pitch |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
85 °C (185 °F) |
5136 CLBS |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.5 mm |
14 mm |
No |
e0 |
472.5 MHz |
182 |
14 mm |
|||||||||||
|
Intel |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
107500 |
Yes |
.94 V |
4300 |
744 |
0.9 |
Grid Array |
BGA1152,34X34,40 |
.86 V |
1 mm |
85 °C (185 °F) |
4300 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
3.5 mm |
35 mm |
It can also operate from 1.05 to 1.15 V supply |
744 |
35 mm |
||||||||||||||||
Intel |
FPGA |
Other |
Ball |
780 |
BGA |
Square |
Plastic/Epoxy |
47500 |
Yes |
.94 V |
1900 |
488 |
0.9 |
1.2/3.3 V |
Grid Array |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
.86 V |
1 mm |
85 °C (185 °F) |
1900 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B780 |
3.2 mm |
29 mm |
No |
It can also operate from 1.05 to 1.15 V supply |
488 |
29 mm |
||||||||||||||
|
Intel |
FPGA |
Ball |
780 |
BGA |
Square |
Plastic/Epoxy |
47500 |
Yes |
.94 V |
1900 |
488 |
0.9 |
Grid Array |
BGA780,28X28,40 |
.86 V |
1 mm |
85 °C (185 °F) |
1900 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B780 |
3 mm |
29 mm |
It can also operate from 1.05 to 1.15 V supply |
488 |
29 mm |
|||||||||||||||||
|
Intel |
FPGA |
Automotive |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
10320 |
Yes |
1.25 V |
645 |
179 |
1.2 |
1.2,1.2/3.3,2.5 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
125 °C (257 °F) |
645 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e1 |
472.5 MHz |
179 |
17 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
963 |
81 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
963 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
472.5 MHz |
81 |
20 mm |
||||||||||
Intel |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
22320 |
Yes |
1.25 V |
1395 |
153 |
1.2 |
1.2,1.2/3.3,2.5 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
1395 CLBS |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e0 |
472.5 MHz |
153 |
17 mm |
||||||||||||||
|
Intel |
FPGA |
Other |
Ball |
780 |
BGA |
Square |
Plastic/Epoxy |
39600 |
Yes |
1.25 V |
2475 |
535 |
1.2 |
1.2,1.2/3.3,2.5 V |
Grid Array |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 °C (185 °F) |
2475 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B780 |
3 |
2.4 mm |
29 mm |
No |
e1 |
472.5 MHz |
535 |
29 mm |
||||||||||
|
Intel |
FPGA |
Other |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
6272 |
Yes |
1.03 V |
392 |
179 |
1 |
1,1.2/3.3,2.5 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
85 °C (185 °F) |
392 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e1 |
265 MHz |
179 |
17 mm |
||||||||||
|
Intel |
FPGA |
Ball |
169 |
LBGA |
Square |
Plastic/Epoxy |
29440 |
Yes |
1.24 V |
1840 |
72 |
1.2 |
1.2,1.2/3.3,2.5 V |
Grid Array, Low Profile |
BGA169,13X13,40 |
Field Programmable Gate Arrays |
1.16 V |
1 mm |
1840 CLBS |
Tin/Silver/Copper |
Bottom |
S-PBGA-B169 |
3 |
1.55 mm |
14 mm |
No |
e1 |
472.5 MHz |
30 s |
72 |
260 °C (500 °F) |
14 mm |
|||||||||||
|
Intel |
FPGA |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
73920 |
Yes |
1.24 V |
4620 |
310 |
1.2 |
1.2,1.2/3.3,2.5 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.16 V |
1 mm |
85 °C (185 °F) |
4620 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
2.4 mm |
27 mm |
No |
e1 |
472.5 MHz |
310 |
27 mm |
||||||||||
|
Intel |
FPGA |
||||||||||||||||||||||||||||||||||||||||||
|
Intel |
FPGA |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
175750 |
Yes |
.93 V |
7030 |
564 |
0.9 |
Grid Array |
BGA1152,34X34,40 |
.87 V |
1 mm |
85 °C (185 °F) |
7030 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
3.4 mm |
35 mm |
564 |
35 mm |
||||||||||||||||||
|
Intel |
FPGA |
||||||||||||||||||||||||||||||||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
Yes |
.93 V |
9120 |
744 |
.9 |
Grid Array |
BGA1517,39X39,40 |
.87 V |
1 mm |
85 °C (185 °F) |
9120 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1517 |
3.5 mm |
40 mm |
40 mm |
|||||||||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
Yes |
.93 V |
21248 |
.9 |
Grid Array |
.87 V |
1 mm |
85 °C (185 °F) |
21248 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B |
3.8 mm |
42.5 mm |
No |
e1 |
717 MHz |
42.5 mm |
|||||||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1932 |
BGA |
Square |
Plastic/Epoxy |
900000 |
Yes |
.93 V |
33962 |
624 |
.9 |
Grid Array |
BGA1932,44X44,40 |
.87 V |
1 mm |
100 °C (212 °F) |
33962 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1932 |
3.5 mm |
45 mm |
Also Operates at 0.95 VCC nominal |
624 |
45 mm |
||||||||||||||||
|
Intel |
FPGA |
Industrial |
Ball |
780 |
BGA |
Square |
Plastic/Epoxy |
270000 |
Yes |
.93 V |
10162 |
TSMC |
360 |
0.9 |
0.9 V |
Grid Array |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
10162 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B780 |
3.35 mm |
29 mm |
No |
360 |
29 mm |
|||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
270000 |
Yes |
.93 V |
10162 |
TSMC |
384 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
10162 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
Also Operates at 0.95 V nominal supply |
384 |
35 mm |
||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
270000 |
Yes |
.93 V |
10162 |
TSMC |
384 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
10162 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
384 |
35 mm |
|||||||||||||
|
Intel |
FPGA |
Other |
Ball |
780 |
BGA |
Square |
Plastic/Epoxy |
320000 |
Yes |
.93 V |
11990 |
384 |
0.9 |
0.9 V |
Grid Array |
BGA784,28X28,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
11990 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B780 |
3.35 mm |
29 mm |
No |
Also Operates at 0.95 V nominal supply |
384 |
29 mm |
|||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
320000 |
Yes |
.93 V |
11990 |
TSMC |
384 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
11990 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
Also Operates at 0.95 V nominal supply |
384 |
35 mm |
||||||||||||
|
Intel |
FPGA |
Industrial |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
320000 |
Yes |
.93 V |
11990 |
TSMC |
384 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
11990 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
384 |
35 mm |
|||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
480000 |
Yes |
.93 V |
18359 |
TSMC |
492 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
18359 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
Also Operates at 0.95 V nominal supply |
492 |
35 mm |
||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
480000 |
Yes |
.93 V |
18359 |
TSMC |
492 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
18359 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
Also Operates at 0.95 V nominal supply |
492 |
35 mm |
||||||||||||
|
Intel |
FPGA |
Industrial |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
480000 |
Yes |
.93 V |
18359 |
TSMC |
492 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
18359 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
Also Operates at 0.95 V nominal supply |
492 |
35 mm |
||||||||||||
|
Intel |
FPGA |
Industrial |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
480000 |
Yes |
.93 V |
18359 |
TSMC |
492 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
18359 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
Also Operates at 0.95 V nominal supply |
492 |
35 mm |
||||||||||||
|
Intel |
FPGA |
Industrial |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
480000 |
Yes |
.93 V |
18359 |
TSMC |
492 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
18359 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
492 |
35 mm |
|||||||||||||
|
Intel |
FPGA |
Industrial |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
480000 |
Yes |
.93 V |
18359 |
TSMC |
492 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
18359 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
492 |
35 mm |
|||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
480000 |
Yes |
.93 V |
18359 |
TSMC |
396 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
18359 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
Also Operates at 0.95 V nominal supply |
396 |
35 mm |
||||||||||||
|
Intel |
FPGA |
Industrial |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
570000 |
Yes |
.93 V |
21708 |
TSMC |
492 |
0.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
21708 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1152 |
3.35 mm |
35 mm |
No |
Also Operates at 0.95 V nominal supply |
492 |
35 mm |
||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
570000 |
Yes |
.93 V |
21708 |
TSMC |
696 |
0.9 |
0.9 V |
Grid Array |
BGA1517,39X39,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
21708 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1517 |
3.5 mm |
40 mm |
No |
696 |
40 mm |
|||||||||||||
|
Intel |
FPGA |
Industrial |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
Yes |
.93 V |
.9 |
Grid Array |
.87 V |
1 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1152 |
3.65 mm |
35 mm |
35 mm |
|||||||||||||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
660000 |
Yes |
25168 |
TSMC |
588 |
Grid Array |
BGA1517,39X39,40 |
1 mm |
100 °C (212 °F) |
25168 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1517 |
3.35 mm |
40 mm |
588 |
40 mm |
|||||||||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
900000 |
Yes |
.93 V |
33962 |
TSMC |
342 |
0.9 |
0.9 V |
Grid Array |
BGA1517,39X39,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
33962 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1517 |
3.35 mm |
40 mm |
No |
342 |
40 mm |
|||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1932 |
BGA |
Square |
Plastic/Epoxy |
900000 |
Yes |
.93 V |
33962 |
TSMC |
624 |
0.9 |
0.9 V |
Grid Array |
BGA1932,44X44,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
33962 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1932 |
3.5 mm |
45 mm |
No |
Also Operates at 0.95 V nominal supply |
624 |
45 mm |
||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1932 |
BGA |
Square |
Plastic/Epoxy |
900000 |
Yes |
.93 V |
33962 |
TSMC |
480 |
0.9 |
0.9 V |
Grid Array |
BGA1932,44X44,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
33962 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1932 |
3.5 mm |
45 mm |
No |
Also Operates at 0.95 V nominal supply |
480 |
45 mm |
||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
1150000 |
Yes |
.93 V |
42720 |
TSMC |
600 |
0.9 |
0.9 V |
Grid Array |
BGA1517,39X39,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
42720 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1517 |
3.35 mm |
40 mm |
No |
Also Operates at 0.95 V nominal supply |
600 |
40 mm |
||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1932 |
BGA |
Square |
Plastic/Epoxy |
1150000 |
Yes |
.93 V |
42720 |
TSMC |
768 |
0.9 |
0.9 V |
Grid Array |
BGA1932,44X44,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
42720 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1932 |
3.5 mm |
45 mm |
No |
Also Operates at 0.95 V nominal supply |
768 |
45 mm |
||||||||||||
|
Intel |
FPGA |
Other |
Ball |
1932 |
BGA |
Square |
Plastic/Epoxy |
1150000 |
Yes |
.93 V |
42720 |
TSMC |
768 |
0.9 |
0.9 V |
Grid Array |
BGA1932,44X44,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
42720 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1932 |
3.5 mm |
45 mm |
No |
Also Operates at 0.95 V nominal supply |
768 |
45 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.