Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
10AX057K2F40E2SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	TSMC	696	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	21708 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No	Also Operates at 0.95 V nominal supply			696	40 mm
10AX090H1F34I1SG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	504	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)	33962 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm		Also Operates at 0.95 V nominal supply			504	35 mm
10AX090N4F45E3SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No				768	45 mm
10AX090S4F45E3SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	624	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No				624	45 mm
10AX115N4F45E3SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No				768	45 mm
10AX115U3F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	480	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply			480	45 mm
10CL080YU484A7G	Intel	FPGA
10M02DCU324I7G	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	2000	Yes	1.25 V	125		246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No				246	15 mm
10M04SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply			246	15 mm
10M08DAF484C7G	Intel	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2 mm	23 mm	No		e1		250	23 mm
10M08DAU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No				250	15 mm
10M08DCF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	125 °C (257 °F)	500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		250	17 mm
10M08DFV81C8G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No				250	4.496 mm
10M16DCF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		320	17 mm
1SG280LU2F50E2VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		736			Grid Array	BGA2397,49X49,40			1 mm	100 °C (212 °F)	344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2397		3.881 mm	50 mm					736	50 mm
5AGTFD3H3F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.18 V	13688		704	1.15		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					704	35 mm
5AGXBA1D4F27C4G	Intel	FPGA	Other	Ball	672	HBGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830	TSMC	416	1.1		Grid Array, Heat Sink/Slug	BGA672,26X26,40		1.07 V	1 mm	85 °C (185 °F)	2830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672		2.7 mm	27 mm					416	27 mm
5AGXBA3D4F27C4N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	5890 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1	670 MHz	416	27 mm
5AGXBB1D4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	11321 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704	40 mm
5AGXFA5H4F35I5N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170		544	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)	7170 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1		544	35 mm
5AGXMA3D4F31C5G	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890	TSMC	416	1.1		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	5890 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					416	31 mm
5AGXMA5G4F35C4N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170		544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	7170 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1	670 MHz	544	35 mm
5CEFA2U19A7N	Intel	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				224	19 mm
5CEFA2U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	304	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm	No				304	19 mm
5CEFA5M13I7N	Intel	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm					Bottom	S-PBGA-B383		1.1 mm	13 mm	No				175	13 mm
5CGTFD5C5F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1		240	23 mm
5CGTFD5C5U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm	No				240	19 mm
5CGTFD9E5F35I7N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS	560	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)	11356 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No				560	35 mm
5CGXBC3B6F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	31500	Yes	1.13 V		CMOS	208	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No				208	23 mm
5CGXFC4C7M13C8N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No				175	13 mm
5CGXFC5F6M11C6N	Intel	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	129	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA301,21X21,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm	No				129	11 mm
5CGXFC7C7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1		240	23 mm
5SGXEA7N2F45C2	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	622000	Yes	.93 V	23472	CMOS	840	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No				840	45 mm
5SGXEA7N2F45I3N	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No				840	45 mm
5SGXMA3H2F35C3G	Intel	FPGA
5SGXMABK2H40I2G	Intel	FPGA
EP1AGX90EF1152I6	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.25 V	90220		538	1.2	1.2,2.5/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm		90220 CLBS			Bottom	S-PBGA-B1152		3.5 mm	35 mm	No			640 MHz	538	35 mm
EP1C12F324C8N	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1206 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e1	275 MHz	249	19 mm
EP1C3T100I7	Intel	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		65	1.5	1.5,1.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)	291 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	320 MHz	65	14 mm
EP1C3T144C6	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		104	1.5	1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	291 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	405 MHz	104	20 mm
EP1S10F672C7	Intel	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0		426	27 mm
EP1S30F1020C6N	Intel	FPGA	Commercial Extended	Ball	1020	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	3819 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1		726	33 mm
EP2AGX125EF29I5	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes			CMOS	372		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No				372
EP2AGX125EF29I5G	Intel	FPGA		Ball	780	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9		Grid Array, Heat Sink/Slug	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)	4964 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.6 mm	29 mm					372	29 mm
EP2AGX45DF25I5G	Intel	FPGA		Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260	0.9		Grid Array, Heat Sink/Slug	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B572		2.15 mm	25 mm					260	25 mm
EP2AGX65DF29C6G	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		372	0.9		Grid Array, Heat Sink/Slug	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.6 mm	29 mm					372	29 mm
EP2C20F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1172 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	500 MHz	136	17 mm
EP2C50F484C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3158	CMOS	294	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	3158 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e0	402.5 MHz	278	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.