Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2AGX125DF25C4N	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		260	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		4964 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572	3	2.2 mm	25 mm	No		e1	500 MHz		260		25 mm
EP2AGX125EF35C5	Intel	FPGA		Ball	1152	BGA	Square	Plastic	118143	Yes			CMOS	452		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1152				No					452
EP2AGX45CU17I5G	Intel	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B358		1.7 mm	17 mm						156		17 mm
EP2AGX45DF25C4G	Intel	FPGA		Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260	0.9		Grid Array, Heat Sink/Slug	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572		2.15 mm	25 mm						260		25 mm
EP2AGX45DF25C6G	Intel	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		260	0.9		Grid Array, Heat Sink/Slug	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572		2.15 mm	25 mm						260		25 mm
EP2AGX45DF29C6N	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP2AGX65DF29C6N	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		2530 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP2AGX95DF25C4	Intel	FPGA		Ball	572	BGA	Square	Plastic	89178	Yes			CMOS	260		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA572,24X24,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B572				No					260
EP2AGX95DF25I3N	Intel	FPGA	Industrial	Ball	572	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		260	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B572		2.2 mm	25 mm	No		e1	500 MHz		260		25 mm
EP2AGX95EF35C4G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		612	0.9		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		3747 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.55 mm	35 mm						612		35 mm
EP2C15AF484I8N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	14448	Yes	1.25 V	903	CMOS	315	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			903 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		307		23 mm
EP2C20Q240C8	Intel	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	142	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		1172 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		126		32 mm
EP2C35F672C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2076 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	450 MHz		459		27 mm
EP2C35F672I6N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2100	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			2100 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672		2.6 mm	27 mm	No	Also requires 3.3 V supply	e1			459		27 mm
EP2C35F672I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2100	CMOS	475	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			2100 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672		2.6 mm	27 mm	No	Also requires 3.3 V supply	e1			459		27 mm
EP2C5F256C6	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	158	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		288 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	500 MHz		150		17 mm
EP2C5F256C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	158	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		288 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	450 MHz		150		17 mm
EP2C70F672I8	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	422	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			4276 CLBS		Tin Lead	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		406		27 mm
EP2C70F672I8N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	422	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			4276 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		406		27 mm
EP2C8F256C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		516 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	450 MHz		174		17 mm
EP2C8F256I8	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			516 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		174		17 mm
EP2C8Q208C7N	Intel	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	138	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		516 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e3	450 MHz		130		28 mm
EP2C8T144C6N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	85	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		516 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also requires 3.3 V supply	e3	500 MHz		77		20 mm
EP2C8T144C7N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	85	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		516 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also requires 3.3 V supply	e3	450 MHz		77		20 mm
EP2S130F780I4N	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	6627	CMOS	534	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	6627 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	717 MHz		526		29 mm
EP2S15F672C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	15600	Yes	1.25 V	6240	CMOS	366	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	6240 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	640 MHz		358		35 mm
EP2S60F1020C3N	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	718	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	24176 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1	717 MHz		710		33 mm
EP2S60F672C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	492	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	24176 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	640 MHz	30 s	484	245 °C (473 °F)	35 mm
EP2S60F672I4	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	492	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	100 °C (212 °F)	5.117 ns	24176 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No			717 MHz		484		35 mm
EP2SGX130GF1508I4N	Intel	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	132540	CMOS	734	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	132540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e1	717 MHz		734		40 mm
EP2SGX60DF780C4	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	717 MHz		364		29 mm
EP2SGX60DF780C4N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	717 MHz	30 s	364	245 °C (473 °F)	29 mm
EP2SGX60EF1152C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	534	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	717 MHz		534		35 mm
EP3C10E144A7N	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS	94	2.5	1.2/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	125 °C (257 °F)		10320 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3			No		e3			94
EP3C10M164I7N	Intel	FPGA	Industrial	Ball	164	BGA	Square	Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS	106	2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		10320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B164	3			No		e1			106
EP3C120F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	283	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		283		23 mm
EP3C16F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	15408	Yes	2.625 V	15408	CMOS	168	2.5	1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		15408 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		3.5 mm	17 mm	No					168		17 mm
EP3C16F256C7	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		168		17 mm
EP3C16F484C6	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e0	472.5 MHz		346		23 mm
EP3C25E144A7	Intel	FPGA		Gull Wing	144	QFP	Square	Plastic	24624	Yes			CMOS	82		1.2/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	1			No		e0			82
EP3C25U256C6	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No		e0	472.5 MHz		156		14 mm
EP3C25U256C6N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		156		14 mm
EP3C40F324A7	Intel	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195	1.2	1.2/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm			39600 CLBS			Bottom	S-PBGA-B324		1.9 mm	19 mm	No					195		19 mm
EP3C40F324C7N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		195		19 mm
EP3C40F484A7N	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	2.625 V	39600	CMOS	331	2.5	1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1			331		23 mm
EP3C40F484C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		331		23 mm
EP3C40F780I7	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz		535		29 mm
EP3C55F484C6	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.