Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10AX115R2F40I2SGES	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm								40 mm
10AX115R4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	342	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No					342		40 mm
10AX115U2F45I2SGES	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
10CL016YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CX105YU484I5G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	188	.9		Grid Array			.87 V		100 °C (212 °F)	38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484									188
10CX150YU484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	188	.9		Grid Array			.87 V		100 °C (212 °F)	54770 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484									188
10M04DAU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
10M04DCU324A7G	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)	250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
10M08DAU324I7G	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No		e1		30 s	250	260 °C (500 °F)	15 mm
10M08SAU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				250		15 mm
10M16DAU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					320		15 mm
10M16DCF256C7G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			320		17 mm
10M16DCU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					320		15 mm
10M16SAU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				320		15 mm
10M25DAF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2		Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)	1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			360		17 mm
10M40DAF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2		Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)	2500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			500		17 mm
10M50DAF672C6G	Intel	FPGA
10M50SCE144C7G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	50000	Yes	3.15 V	3125		500	3	3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)	3125 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				500		20 mm
1SD280PT1F55I1VG	Intel	FPGA	Industrial	Ball	2912	BGA	Square	Plastic/Epoxy	2800000	Yes				816			Grid Array	BGA2912,54X54,40			1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B2912		3.881 mm	55 mm						816		55 mm
1SG280HN3F43E3VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)	344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
1SG280HN3F43I3VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)	344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
1SG280HU2F50E2VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		736			Grid Array	BGA2397,49X49,40			1 mm	100 °C (212 °F)	344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2397		3.881 mm	50 mm						736		50 mm
1SM16BHU2F53E2VG	Intel	FPGA	Other	Ball	2597	BGA	Square	Plastic/Epoxy	1650000	Yes		206250		656			Grid Array	BGA2597,51X51,40			1 mm	100 °C (212 °F)	206250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2597		3.881 mm	52.5 mm						656		52.5 mm
1SM21BHU2F53E1VG	Intel	FPGA	Other	Ball	2597	BGA	Square	Plastic/Epoxy	2100000	Yes		262500		656			Grid Array	BGA2597,51X51,40			1 mm	100 °C (212 °F)	262500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2597		3.881 mm	52.5 mm						656		52.5 mm
1SM21BHU2F53E2VG	Intel	FPGA	Other	Ball	2597	BGA	Square	Plastic/Epoxy	2100000	Yes		262500		656			Grid Array	BGA2597,51X51,40			1 mm	100 °C (212 °F)	262500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2597		3.881 mm	52.5 mm						656		52.5 mm
1ST110EN2F43I2VGAS	Intel	FPGA
5AGXBA1D4F27C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	2830 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1	622 MHz		416		27 mm
5AGXBA1D6F31C6N	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	2830 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1			416		31 mm
5AGXBA7D4F31C5N	Intel	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168		384	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	9168 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1			384		31 mm
5AGXFB1H4F40C5G	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	11321 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						704		40 mm
5AGXFB3H4F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.18 V	13688	TSMC	704	1.15		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						704		35 mm
5AGXFB3H4F35I5N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1			704		35 mm
5AGXFB3H4F40C4N	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	13688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1			704		40 mm
5AGXFB7K4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	504000	Yes	1.13 V	19024	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	19024 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						704		40 mm
5AGXMA1D4F27C5N	Intel	FPGA	Other	Ball	672	HBGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	2830 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1			416		27 mm
5AGXMA3D4F27I3	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	670 MHz				27 mm
5AGXMA3D4F27I3N	Intel	FPGA	Industrial	Ball	672	HBGA	Square	Plastic/Epoxy	156000	Yes	1.18 V	5890		416	1.15		Grid Array, Heat Sink/Slug	BGA672,26X26,40		1.12 V	1 mm	100 °C (212 °F)	5890 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm			e1			416		27 mm
5AGXMA3D4F27I5G	Intel	FPGA	Industrial	Ball	672	HBGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890	TSMC	416	1.1		Grid Array, Heat Sink/Slug	BGA672,26X26,40		1.07 V	1 mm	100 °C (212 °F)	5890 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2.7 mm	27 mm						416		27 mm
5AGXMA3D4F27I5N	Intel	FPGA	Industrial	Ball	672	HBGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)	5890 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1			416		27 mm
5AGXMA5G4F31C4G	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	7170 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5AGXMA5G4F31I3G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.18 V	7170	TSMC	544	1.15		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.12 V	1 mm	100 °C (212 °F)	7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5AGXMA5G4F31I5G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	100 °C (212 °F)	7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						544		31 mm
5AGXMA7G4F31C4N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168		544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	9168 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1	670 MHz		544		31 mm
5AGXMB3G4F31I5	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	622 MHz				31 mm
5AGXMB3G6F40C6G	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	13688 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						704		40 mm
5AGZME1H2F35I3LG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	220000	Yes	.88 V	8302		414	0.85		Grid Array	BGA1152,34X34,40		.82 V	1 mm	100 °C (212 °F)	8302 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						414		35 mm
5CEBA2U15I7	Intel	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B324		1.5 mm	15 mm								15 mm
5CEBA4F17C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	128	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.