Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2C5T144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	89	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	288 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also requires 3.3 V supply	e3			81		20 mm
EP4CE6E22C8N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		91	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
EP1C3T144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		104	1.5	1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	291 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	275 MHz		104		20 mm
EP1C6Q240C6N	Intel	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	598 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	405 MHz		185		32 mm
EP1C6Q240C8N	Intel	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	598 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	275 MHz		185		32 mm
10M08SAE144C8G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply	e3		30 s	250	260 °C (500 °F)	20 mm
EP2C5Q208C8N	Intel	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	142	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	288 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e3	402.5 MHz		134		28 mm
EP2C8T144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	85	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	516 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also requires 3.3 V supply	e3	402.5 MHz		77		20 mm
EP4CE6E22I7N	Intel	FPGA		Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		91	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm		392 CLBS		Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
EP4CE6F17C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	179	260 °C (500 °F)	17 mm
EP3C40F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	39600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		331		23 mm
10M02SCU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				246		11 mm
10M08SCU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				250		11 mm
EP2C20F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1172 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	136	260 °C (500 °F)	17 mm
10M02SCE144I7G	Intel	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3	3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)	125 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
EP4CE22E22C8N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		79	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	1395 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		79		20 mm
EP1C12Q240C8N	Intel	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		173	1.5	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	1206 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	275 MHz		173		32 mm
10M02SCE144C8G	Intel	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3	3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)	125 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
EP4CE30F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	28848	Yes	1.25 V	1803		331	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1803 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		331		23 mm
EP4CE10E22C8N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		91	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
10M08SAU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				250		11 mm
10M04DCU324I7G	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
5CEFA7F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm					Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
EP3C5E144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	94	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	5136 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3			94		20 mm
EP4CE22F17C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		153	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1395 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		153		17 mm
EP4CE10F17C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	10320		179	1	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	It can also operate at 1.2 V supply	e1	472.5 MHz		179		17 mm
EP4CE15F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		346	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz	30 s	346	260 °C (500 °F)	23 mm
10M02SCU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	100 °C (212 °F)	125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				246		11 mm
10M08SCE144C8G	Intel	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3		30 s	250	260 °C (500 °F)	20 mm
EP1C3T100C8N	Intel	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		65	1.5	1.5,1.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	291 CLBS	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	275 MHz	30 s	65	260 °C (500 °F)	14 mm
EP2C8F256C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	516 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		174		17 mm
10M08SAE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				250		20 mm
EP3C16F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz	30 s	346	260 °C (500 °F)	23 mm
EP3C25F324I7N	Intel	FPGA	Industrial	Ball	324	BGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	24624 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		215		19 mm
EP4CE6F17I7N	Intel	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6272	Yes		392		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm		392 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e1	472.5 MHz	40 s	179	260 °C (500 °F)	17 mm
10M04SCU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	100 °C (212 °F)	250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				246		11 mm
EP4CE30F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	28848	Yes	1.25 V	1803		331	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm		1803 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		331		23 mm
5CEFA9F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	230	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B484		2 mm	23 mm	No		e1			230		23 mm
10M08SAU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				250		11 mm
10M08SCM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	3/3.3 V	Grid Array	BGA153,15X15,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm	No	Also Operates at 3.3 V nominal supply				250		8 mm
EP2C5T144C7N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	89	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	288 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also requires 3.3 V supply	e3	450 MHz		81		20 mm
EP3C25F324C8N	Intel	FPGA	Other	Ball	324	BGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		215		19 mm
10CL025YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2		Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	100 °C (212 °F)	1539 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.5 mm	14 mm			e1		30 s		260 °C (500 °F)	14 mm
EP4CE75F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	4713		295	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm		4713 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		295		23 mm
EP3C16Q240C8N	Intel	FPGA	Other	Gull Wing	240	FQFP	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	160	1.2		Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G240	3	4.1 mm	32 mm	No		e3	472.5 MHz		160		32 mm
10M08SCE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				250		20 mm
10M50DAF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
EP3C5E144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	94	1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	100 °C (212 °F)	5136 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3			94		20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.