Intel Field Programmable Gate Arrays (FPGA) 1,196

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CEBA4U19C7N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				224		19 mm
5CEBA7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No				336		27 mm
5CEBA7F31C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	480	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No				480		31 mm
5CEFA5M13C8N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No				175		13 mm
5CEFA7F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No				240		23 mm
5CEFA7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No				336		27 mm
5CEFA7U19C6N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	230	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				230		19 mm
5CEFA7U19C8N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	230	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				230		19 mm
5CEFA9F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	488	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No				488		31 mm
5CEFA9F31C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	488	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No				488		31 mm
5CEFA9U19A7N	Intel	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				240		19 mm
5CGTFD5C5F23I7	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm					Bottom	S-PBGA-B484		2 mm	23 mm	No				240		23 mm
5CGTFD5C5U19C7N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				240		19 mm
5CGTFD9E5F31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	448	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No	e1	622 MHz		448		31 mm
5CGXBC4C6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No	e1			336		27 mm
5CGXBC9E7F35C8N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS	560	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	11356 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No				560		35 mm
5CGXFC3B6F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	31000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No				224		23 mm
5CGXFC4C7U19C8N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				224		19 mm
5CGXFC5C6F23A7N	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No	e1			240		23 mm
5CGXFC5C6M13C6N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No				175		13 mm
5CGXFC5C7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V	2908	CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	2908 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No	e1		30 s	240	260 °C (500 °F)	23 mm
5CGXFC5C7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No	e1			336		27 mm
5CGXFC7D6F31C6N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	480	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No	e1			480		31 mm
5CGXFC7D7F31C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	480	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No	e1			480		31 mm
5CGXFC9D7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No	e1			336		27 mm
5SGXEA5N2F45I2L	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No				840		45 mm
5SGXEA7N2F40I2LN	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				600		40 mm
5SGXEABK2H40C2LN	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	952000	Yes	.88 V	35920	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.9 mm	45 mm	No				696		45 mm
5SGXEABN2F45C2N	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	952000	Yes	.93 V	35920	CMOS	840	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No				840		45 mm
5SGXMA3E3H29C3G	Intel	FPGA
EP1AGX20CF484C6NGA	Intel	FPGA
EP1AGX50DF1152C6N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.25 V	50160		350	1.2	1.2,2.5/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	50160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No	e1	640 MHz		350		35 mm
EP1AGX60DF780C6N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	60100		350	1.2	1.2,2.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	60100 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e1	640 MHz		350		29 mm
EP1C3T100C8	Intel	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		65	1.5	1.5,1.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	291 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	e0	275 MHz		65		14 mm
EP1C3T144C6N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		104	1.5	1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	291 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	405 MHz		104		20 mm
EP1C4F324C6N	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No	e1	405 MHz		249		19 mm
EP1C6F256C7N	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	598 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	e1	320 MHz		185		17 mm
EP1C6F256I7	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	598 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	e0	320 MHz	20 s	185	220 °C (428 °F)	17 mm
EP1C6Q240I7	Intel	FPGA	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)	598 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	320 MHz		185		32 mm
EP1C6T144I7	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		98	1.5	1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)	598 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e0	320 MHz		98		20 mm
EP1S10F780C6	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	1200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e0			426		29 mm
EP1S20F780C6N	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2132 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e1			586		29 mm
EP1S25F672I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V		CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672	3			No	e1			706
EP1S30F780C6	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	3819 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e0			726		29 mm
EP1S60F1508C7N	Intel	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy	57120	Yes	1.575 V	6570	CMOS	1022	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	6570 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e1			1022		40 mm
EP1SGX25FF1020C7N	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	607	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e1			607		33 mm
EP1SGX40DF1020C5N	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	624	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	4697 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e1			624		33 mm
EP1SGX40DF1020C6	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	638	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	4697 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0			638		33 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.