Intel Field Programmable Gate Arrays (FPGA) 1,196

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5SGXMA7H3F35C3	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
EP2C50F672C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3158	CMOS	450	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	3158 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		434		27 mm
EP3C16F484C6N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz	30 s	346	260 °C (500 °F)	23 mm
10M40DCF672C8G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
5AGXMA7G4F35I5N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168		544	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)	9168 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1			544		35 mm
10CL006ZU256I8G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		176	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.97 V	.8 mm	100 °C (212 °F)	392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm		-40 to 125 °C range is available as extended industrial				176		14 mm
10CL080ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423	1		Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm		-40 to 125 °C range is available as extended industrial				423		19 mm
10CL120YF780C8G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	7443			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	7443 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10M04SCM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3	3/3.3 V	Grid Array	BGA153,15X15,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)	250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm	No	Also Operates at 3.3 V nominal supply				246		8 mm
EP3C5M164C8N	Intel	FPGA	Other	Ball	164	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS	106	2.5	1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	5136 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164				No					106
10CL006YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392			1.2		Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	125 °C (257 °F)	392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10CL010YM164I7G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)	645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10M25DCF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
10M40DAF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
EP2C70F896C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	622	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4276 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B896	3	2.6 mm	31 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	606	260 °C (500 °F)	31 mm
EP3C55F780C8N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	377	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	55856 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	377	260 °C (500 °F)	29 mm
EP4CE10F17C6N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		179		17 mm
10CL080YF780C8G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	5079 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10M02DCU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	2000	Yes	1.25 V	125		246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
EP3C16U256C8N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2		Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		168		14 mm
EP3C25F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		156		17 mm
EP3C40F484I7	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331	1.2		Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	39600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		331		23 mm
EP4CGX30BF14C8N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
10CX105YU484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	188	.9		Grid Array			.87 V		100 °C (212 °F)	38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484									188
5CEBA4F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					224		23 mm
EP1C3T144C7N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		104	1.5	1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)	291 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	320 MHz		104		20 mm
EP4CGX150DF31I7N	Intel	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	149760	Yes	1.24 V	9360		475	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.16 V	1 mm		9360 CLBS		Tin Silver Copper	Bottom	S-PBGA-B896	3	2.4 mm	31 mm	No		e1	472.5 MHz		475		31 mm
10CL080YF780I7G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079			1.2		Grid Array			1.15 V	1 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10M08DCU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					250		15 mm
10M08SCM153C8G	Intel	FPGA	Other	Ball	153	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA153,15X15,20		2.85 V	.5 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				250		8 mm
5CGXFC3B6U15I7N	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	31000	Yes	1.13 V	1346	CMOS	112	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	100 °C (212 °F)	1346 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					112		15 mm
5CGXFC9C6F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm			e1		30 s		260 °C (500 °F)	23 mm
EP3C120F780C8N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	531	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz		531		29 mm
EP4CE55F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4CE6E22C8LN	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		91	1	1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	362 MHz		91		20 mm
EP4CE6F17A7N	Intel	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	125 °C (257 °F)	392 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		179		17 mm
EP4SGX180FF35C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	175750	Yes	.93 V	7030		564	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	7030 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.4 mm	35 mm	No		e1	717 MHz		564		35 mm
10CL016ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		340	1		Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm		-40 to 125 °C range is available as extended industrial				340		23 mm
10CL080YF780C6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	5079 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10CX105YF672E5G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236	.9		Grid Array			.87 V		100 °C (212 °F)	38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									236
10CX220YF780I6G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9		Grid Array			.87 V		100 °C (212 °F)	80330 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780									284
10M08DAF484C8GES	Intel	FPGA
10M08SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				250		15 mm
10M16SCU169A7P	Intel	FPGA	Automotive	Ball	169	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)	1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M25DAF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
10M40DCF256C7G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
10M40DCF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	2500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
5AGZME3E2H29C3G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584		342	0.85		Grid Array	BGA780,28X28,40		.82 V	1 mm	85 °C (185 °F)	13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.5 mm	33 mm						342		33 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.