Microchip Technology Field Programmable Gate Arrays (FPGA) 806

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M2GL025TS-1FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square		Plastic/Epoxy	27696	Yes	1.26 V		CMOS		180		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm	No					180		11 mm
M2S025TS-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	27696	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S090-1FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	86184	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S090TS-1FGG484T2	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	86184	Yes	1.26 V			AEC-Q100	267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
MPF100TL-FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square		Plastic/Epoxy		Yes	1.03 V		CMOS		170		1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
RT3PE3000L-1CG896PROTO	Microchip Technology	FPGA		Pin/Peg	896	PGA	Square		Ceramic, Metal-Sealed Cofired		No	1.575 V	75264	CMOS			3000000	1.2			Grid Array			1.14 V	1 mm			75264 CLBS, 3000000 Gates			Perpendicular	S-CPGA-P896		6.75 mm	31 mm								31 mm
RT3PE3000L-1CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2		1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F256		3.3 mm	36 mm	No			250 MHz				36 mm
RT3PE3000L-1LG484E	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square			75264	Yes	1.575 V	75264	CMOS	38535V;38534K;883S	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-XBGA-N484		3.83 mm	23 mm	No			250 MHz		341		23 mm
RT3PE3000L-CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square		Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2		1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No		e0	250 MHz	20 s		225 °C (437 °F)	36 mm
RT3PE3000L-LG484B	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square			75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-XBGA-N484		3.83 mm	23 mm	No			250 MHz		341		23 mm
RT4G150-CQ352B	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-STD-883 Class B	166		1.2			Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
RT4G150-CQ352E	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V				166		1.2			Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
RT4G150-CQ352EV	Microchip Technology	FPGA	Military
RT4G150-CQ352PROTO	Microchip Technology	FPGA
RT4G150-CQ352V	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-PRF-38535 Class V	166		1.2			Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
A3P250-2PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3PE3000-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz	20 s	341	225 °C (437 °F)	23 mm
M2GL025T-1VF256I	Microchip Technology	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	27696	Yes	1.26 V				138		1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.56 mm	14 mm			e0			138		14 mm
M2GL050T-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
MPF300T-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
A3P060-VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	14 mm
M2GL010S-1TQG144I	Microchip Technology	FPGA		Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm						Quad	S-PQFP-G144	3	1.6 mm	20 mm								20 mm
M2GL090-FGG676	Microchip Technology	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	86316	Yes	1.26 V		CMOS		425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No				30 s	425	250 °C (482 °F)	27 mm
M2S050-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S150TS-1FCV484M	Microchip Technology	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy	146124	Yes	1.26 V				248		1.2			Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484		3.15 mm	19 mm			e0			248		19 mm
MPF300T-1FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
MPF300TS-FCS536M	Microchip Technology	FPGA	Military	Ball	536	LFBGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		300		1			Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20		.97 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm		It also Operates at 1.05 V nominal supply				300		16 mm
MPF500TS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS		584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
A2F500M3G-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	11520	Yes	1.575 V	11520	CMOS		128	500000	1.5	Tray	1.5,1.8,2.5,3.3 V	Grid Array	BGA484,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		11520 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	100 MHz	30 s	128	250 °C (482 °F)	23 mm
A3P060-1TQG144	Microchip Technology	FPGA	Commercial	Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Flatpack, Low Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	350 MHz				20 mm
A3P1000-2PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3P250-VQ100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz				14 mm
A3P600-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square		Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz	20 s		225 °C (437 °F)	17 mm
A3PE600-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square		Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS		270	600000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz		270		23 mm
APA1000-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square		Plastic/Epoxy	56320	Yes	2.7 V		CMOS		158	1000000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	70 °C (158 °F)		1000000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
APA1000-PQG208A	Microchip Technology	FPGA		Gull Wing	208	QFP	Square		Plastic/Epoxy	56320	Yes			CMOS		158			Tray	2.5,2.5/3.3 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm						Quad	S-PQFP-G208	3			No				30 s	158	245 °C (473 °F)
AT40K40AL-1BQU	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3	Tray		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	2.2 ns	2304 CLBS, 40000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm		Maximum usable gates 50000						20 mm
M2S050T-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Square		Plastic/Epoxy	56340	Yes	1.26 V				200		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.01 mm	11 mm					40 s	200	250 °C (482 °F)	11 mm
M2S060TS-1VF400	Microchip Technology	FPGA		Ball	400	LFBGA	Square		Plastic/Epoxy	56520	Yes	1.26 V				207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	207	240 °C (464 °F)	17 mm
M2S060TS-1VF400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square		Plastic/Epoxy	56520	Yes	1.26 V				207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	207	240 °C (464 °F)	17 mm
M7A3PE600-FG484	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	13824	Yes	1.575 V		CMOS		270		1.5		1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484				No					270
MPF300TS-FCG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	4	2.87 mm	23 mm		It also Operates at 1.05 V nominal supply			30 s	244	260 °C (500 °F)	23 mm
A3P060-1VQ100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz				14 mm
A3P060-2TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Flatpack, Low Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	350 MHz				20 mm
A3P125-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	13 mm
M1A3P400-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		9216 CLBS, 400000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
M2GL050-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL050T-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.