Microchip Technology Field Programmable Gate Arrays (FPGA) 806

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M1AGL1000V2-CS281I	Microchip Technology	FPGA	Industrial	Ball	281	TFBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	CMOS	215	1000000	1.2			Grid Array, Thin Profile, Fine Pitch	BGA281,19X19,20		1.14 V	.5 mm	100 °C (212 °F)	1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B281		1.05 mm	10 mm	No		e0		215		10 mm
M2GL005-1TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V				1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.6 mm	20 mm				30 s		260 °C (500 °F)	20 mm
M2GL010-1VFG256I	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V				1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm				30 s		260 °C (500 °F)	14 mm
M2GL010-VF256I	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V				1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.56 mm	14 mm				20 s		240 °C (464 °F)	14 mm
M2GL010-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V		195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No				195		17 mm
M2GL010-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V	CMOS	195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No				195		17 mm
M2GL010TS-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V	CMOS	233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No			30 s	233	250 °C (482 °F)	23 mm
M2GL025T-VF256I	Microchip Technology	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		138		1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.56 mm	14 mm			e0		138		14 mm
M2GL025T-VF400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B400		1.51 mm	17 mm	No			20 s	207	240 °C (464 °F)	17 mm
M2GL050TS-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V	CMOS	200		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B325			11 mm	No			20 s	200	240 °C (464 °F)	11 mm
M2GL060TS-FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy		Yes	1.26 V				1.2	Tray		Grid Array			1.14 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm				30 s		260 °C (500 °F)	11 mm
M2GL090-FG484	Microchip Technology	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				267		23 mm
M2GL090-FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V	CMOS	425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	20 s	425	225 °C (437 °F)	27 mm
M2GL090T-1FCSG325I	Microchip Technology	FPGA	Industrial		325			Plastic	86316	Yes		CMOS	180		1.2	Tray	1.2 V		BGA325,21X21,20	Field Programmable Gate Arrays			100 °C (212 °F)		-40 °C (-40 °F)				3			No				180
M2GL090T-FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V	CMOS	425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No			30 s	425	250 °C (482 °F)	27 mm
M2GL090TS-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				267		23 mm
M2S005-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V		209		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm				40 s	209	250 °C (482 °F)	23 mm
M2S025-VFG256I	Microchip Technology	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		138		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.14 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.56 mm	14 mm				40 s	138	250 °C (482 °F)	14 mm
M2S025T-1VF400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm				30 s	207	240 °C (464 °F)	17 mm
M2S025T-FCS325	Microchip Technology	FPGA		Ball	325	TFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		180		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B325		1.01 mm	11 mm				30 s	180	240 °C (464 °F)	11 mm
M2S025TS-1FGG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm				40 s	267	250 °C (482 °F)	23 mm
M2S050T-1FG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm				30 s	267	240 °C (464 °F)	23 mm
M2S050T-1FGG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm				40 s	267	250 °C (482 °F)	23 mm
M2S060-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V		267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm				40 s	267	250 °C (482 °F)	23 mm
M2S060T-FCS325I	Microchip Technology	FPGA		Ball	325	TFBGA	Square	Plastic/Epoxy	56520	Yes	1.26 V		200		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B325		1.01 mm	11 mm				30 s	200	240 °C (464 °F)	11 mm
M2S060TS-FCS325	Microchip Technology	FPGA		Ball	325	TFBGA	Square	Plastic/Epoxy	56520	Yes	1.26 V		200		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B325		1.01 mm	11 mm				30 s	200	240 °C (464 °F)	11 mm
M2S060TS-FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V		267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm				40 s	267	250 °C (482 °F)	23 mm
M2S090-1FG676I	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V		425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm				30 s	425	240 °C (464 °F)	27 mm
M2S090-FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V		267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm				30 s	267	240 °C (464 °F)	23 mm
M2S090-FGG676	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V		425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm				40 s	425	250 °C (482 °F)	27 mm
M2S090-FGG676I	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V		425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm				40 s	425	250 °C (482 °F)	27 mm
M2S090T-1FG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V		267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm				30 s	267	240 °C (464 °F)	23 mm
M2S150-1FCS536I	Microchip Technology	FPGA		Ball	536	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V	CMOS	293		1.2	Tray	1.2 V	Grid Array	BGA536,30X30,20	Field Programmable Gate Arrays	1.14 V		100 °C (212 °F)		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B536				No		e0	30 s	293	240 °C (464 °F)
M2S150-FCV484I	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	146124	Yes	1.26 V	CMOS	273		1.2	Tray	1.2 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484		3.15 mm	19 mm	No	LG-MIN, WD-MIN	e0	30 s	273	240 °C (464 °F)	19 mm
M2S150T-1FC1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V	CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1152		2.9 mm	35 mm	No		e0	30 s	574	240 °C (464 °F)	35 mm
M2S150T-1FCG1152	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V	CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	2.9 mm	35 mm	No		e1	40 s	574	250 °C (482 °F)	35 mm
M2S150TS-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V	CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	2.9 mm	35 mm	No		e1	40 s	574	250 °C (482 °F)	35 mm
M2S150TS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V	CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	2.9 mm	35 mm	No		e1	40 s	574	250 °C (482 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.