Microchip Technology Field Programmable Gate Arrays (FPGA) 806

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A3P125-1FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P600L-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS		97	600000	1.2	Tray	1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz		97		13 mm
A3PE1500-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		280	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s	280	250 °C (482 °F)	23 mm
A3PN250-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square		Plastic/Epoxy	6144	Yes	1.575 V		CMOS		68	250000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	85 °C (185 °F)		250000 Gates	-20 °C (-4 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3			68		14 mm
A42MX09-PQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	QFP	Rectangular		Plastic/Epoxy	684	Yes	3.6 V	684	CMOS			14000	3.3	Tray		Flatpack			3 V	.65 mm	85 °C (185 °F)	2.5 ns	684 CLBS, 14000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Also Operates at 5 V supply	e3	117 MHz	30 s		245 °C (473 °F)	20 mm
AGL600V5-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy	13824	Yes	1.575 V		CMOS		97	600000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
AGLN060V2-VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.2	Tray		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
M2GL060-FCSG325	Microchip Technology	FPGA	Other	Ball	325	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325	3		11 mm					30 s		260 °C (500 °F)	11 mm
M2S025-VFG400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square		Plastic/Epoxy	27696	Yes	1.26 V				207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.51 mm	17 mm					40 s	207	250 °C (482 °F)	17 mm
M2S060T-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	56520	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
RTAX2000S-1CQ352PROTO	Microchip Technology	FPGA		Flat	352	GQFF	Square	300k Rad(Si)	Ceramic, Metal-Sealed Cofired		Yes	1.575 V		CMOS		198	2000000	1.5			Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.425 V	.5 mm			2000000 Gates			Quad	S-CQFP-F352		2.89 mm	48 mm				649 MHz		198		48 mm
A3P030-1QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square				Yes	1.575 V	768	CMOS			30000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	100 °C (212 °F)		768 CLBS, 30000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
A3P060-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	13 mm
A3P060-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P060-FGG144T	Microchip Technology	FPGA	Automotive	Ball	144	LBGA	Square		Plastic/Epoxy	1536	Yes	1.575 V	1536	CMOS	AEC-Q100	96	60000	1.5		1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	96	260 °C (500 °F)	13 mm
A3P1000-1FG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz		97		13 mm
A3P1000-1FG256T	Microchip Technology	FPGA	Automotive	Ball	256	BGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	AEC-Q100	177	1000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz		177		17 mm
A3P1000-1PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		154	1000000	1.5	Tray	1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	154	245 °C (473 °F)	28 mm
A3P1000-2FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square		Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	17 mm
A3P1000-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3P1000-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P1000L-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square		Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		177	1000000	1.2		1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz		177		17 mm
A3P125-1FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz				13 mm
A3P125-2FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz				13 mm
A3P125-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P250-1PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3P250-2FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square		Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
A3P250-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P600-1FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square		Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
A3P600-2PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3P600-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5			Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
A3PE1500-1FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		20 s		225 °C (437 °F)	27 mm
A3PE1500-2FG676	Microchip Technology	FPGA	Commercial	Ball	676	BGA	Square		Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0					27 mm
A3PE1500-2FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0		20 s		225 °C (437 °F)	27 mm
A3PE1500-2FGG676	Microchip Technology	FPGA	Commercial	Ball	676	BGA	Square		Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
A3PE1500-2FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy		Yes	1.575 V	38400	CMOS			1500000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
A3PE1500-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square		Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	70 °C (158 °F)		38400 CLBS, 1500000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
A3PE3000-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS			3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0					23 mm
A3PE3000-1FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square		Plastic/Epoxy		Yes	1.575 V	75264	CMOS			3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e0					31 mm
A3PE3000-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS			3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
A3PE3000-2FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS			3000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s		225 °C (437 °F)	23 mm
A3PE3000-2PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		147	3000000	1.5		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
A3PE3000-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s	341	250 °C (482 °F)	23 mm
A3PE3000L-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
A3PE3000L-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
A3PE3000L-FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	341	225 °C (437 °F)	23 mm
A3PE3000L-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
A3PE3000L-FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.