Microchip Technology Field Programmable Gate Arrays (FPGA) 806

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A3PE3000L-FGG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		620	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e1	250 MHz	30 s	620	245 °C (473 °F)	31 mm
A3PE600-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
A3PE600L-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS		270	600000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		13824 CLBS, 600000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		270		23 mm
A3PN060-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1536	Yes	1.575 V		CMOS		71	60000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	85 °C (185 °F)		60000 Gates	-20 °C (-4 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s	71	260 °C (500 °F)	14 mm
A3PN060-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1536	Yes	1.575 V		CMOS		71	60000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	100 °C (212 °F)		60000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s	71	260 °C (500 °F)	14 mm
A40MX02-PLG68I	Microchip Technology	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	295	CMOS			3000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.7 ns	295 CLBS, 3000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply		80 MHz				24.2316 mm
A40MX04-FPLG44	Microchip Technology	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	3.7 ns	547 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Also Operates at 5 V supply	e3	48 MHz				16.5862 mm
A40MX04-PLG84I	Microchip Technology	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.7 ns	547 CLBS, 6000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	80 MHz	30 s		245 °C (473 °F)	29.3116 mm
A42MX09-VQG100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	684	Yes	3.6 V	684	CMOS		104	14000	3.3	Tray	3.3,3.3/5,5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	70 °C (158 °F)	2.5 ns	684 CLBS, 14000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Also Operates at 5 V supply	e3	117 MHz		104		14 mm
A42MX16-PQG160	Microchip Technology	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	1232	CMOS			24000	3.3	Tray		Flatpack			3 V	.65 mm	70 °C (158 °F)	2.8 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Also Operates at 5 V supply	e3	94 MHz	30 s		245 °C (473 °F)	28 mm
A42MX16-VQG100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1232	Yes	3.6 V	1232	CMOS			24000	3.3	Tray		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	70 °C (158 °F)	2.8 ns	1232 CLBS, 24000 Gates	0 °C (32 °F)		Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Also Operates at 5 V supply		94 MHz				14 mm
A42MX24-PLG84	Microchip Technology	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	1866	Yes	3.6 V	1890	CMOS		176	36000	3.3	Tube	3.3,3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	70 °C (158 °F)	2.5 ns	1890 CLBS, 36000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3			176		29.3116 mm
A42MX24-PLG84I	Microchip Technology	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	1890	CMOS			36000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.5 ns	1890 CLBS, 36000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	91.8 MHz	30 s		245 °C (473 °F)	29.3116 mm
A42MX24-PQG160I	Microchip Technology	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	1890	CMOS			36000	3.3	Tray		Flatpack			3 V	.65 mm	85 °C (185 °F)	2.5 ns	1890 CLBS, 36000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Also Operates at 5 V supply	e3	91.8 MHz	30 s		245 °C (473 °F)	28 mm
A42MX24-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	1890	CMOS			36000	3.3	Tray		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	2.5 ns	1890 CLBS, 36000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also Operates at 5 V supply	e3	91.8 MHz	30 s		245 °C (473 °F)	28 mm
A42MX36-2PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	2438	CMOS			54000	3.3	Tray		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	2.1 ns	2438 CLBS, 54000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also Operates at 5 V supply	e3	91 MHz	30 s		245 °C (473 °F)	28 mm
A54SX08A-FTQG144	Microchip Technology	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	768	Yes	2.75 V	768	CMOS		113	12000	2.5	Tray	2.5,3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.7 ns	768 CLBS, 12000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	8000 typical gates available	e3	172 MHz		113		20 mm
A54SX72A-1PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6036	Yes	2.75 V	6036	CMOS		171	108000	2.5	Tray	2.5,3.3/5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	85 °C (185 °F)	1.3 ns	6036 CLBS, 108000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	72000 typical gates available	e3	250 MHz	30 s	171	245 °C (473 °F)	28 mm
AGL1000V5-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS		300	1000000	1.5			Grid Array	BGA484,22X22,40		1.425 V	1 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s	300	250 °C (482 °F)	23 mm
AGL125V2-CSG196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		133	125000	1.2			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.14 V	.5 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No		e1		30 s	133	260 °C (500 °F)	8 mm
AGL125V5-CSG196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		133	125000	1.5			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.425 V	.5 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No				30 s	133	260 °C (500 °F)	8 mm
AGL250V2-CSG196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		145	250000	1.2			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.14 V	.5 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No		e1		30 s	145	260 °C (500 °F)	8 mm
AGL250V2-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		97	250000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0		20 s	97	235 °C (455 °F)	13 mm
AGL400V5-CS196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	9216	Yes	1.575 V		CMOS		143	400000	1.5			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.425 V	.5 mm	100 °C (212 °F)		400000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B196		1.2 mm	8 mm	No					143		8 mm
AGL400V5-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	9216	Yes	1.575 V		CMOS		178	400000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	100 °C (212 °F)		400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e0		20 s	178	225 °C (437 °F)	17 mm
AGL600V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS		97	600000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
AGLN010V5-UCG36	Microchip Technology	FPGA	Other	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	260	CMOS			10000	1.5	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.425 V	.4 mm	70 °C (158 °F)		260 CLBS, 10000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B36		.8 mm	3 mm	No							3 mm
AGLN060V5-VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0		20 s		235 °C (455 °F)	14 mm
AGLN060V5-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5			Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	70 °C (158 °F)		1536 CLBS, 60000 Gates	-20 °C (-4 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
AGLN125V2-CSG81	Microchip Technology	FPGA	Other	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		3072 CLBS, 125000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No				30 s		260 °C (500 °F)	5 mm
AGLN125V2-VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.2	Tray		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
AGLN250V2-CSG81	Microchip Technology	FPGA	Other	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.2	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		6144 CLBS, 250000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No				30 s		260 °C (500 °F)	5 mm
AGLN250V2-VQ100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.2	Tray		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		6144 CLBS, 250000 Gates	-20 °C (-4 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
AGLP030V5-CSG201I	Microchip Technology	FPGA	Industrial	Ball	201	VFBGA	Square	Plastic/Epoxy	792	Yes	1.575 V	792	CMOS		120	30000	1.5		1.5 V	Grid Array, Very Thin Profile, Fine Pitch	BGA201,15X15,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		792 CLBS, 30000 Gates	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B201	3	.99 mm	8 mm	No		e3	250 MHz	30 s	120	260 °C (500 °F)	8 mm
AGLP060V2-VQG176I	Microchip Technology	FPGA	Industrial	Gull Wing	176	TFQFP	Square	Plastic/Epoxy	1584	Yes	1.575 V	1584	CMOS		137	60000	1.5		1.2/1.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP176,.87SQ,16	Field Programmable Gate Arrays	1.425 V	.4 mm	85 °C (185 °F)		1584 CLBS, 60000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G176	3	1.2 mm	20 mm	No			160 MHz		137		20 mm
APA075-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3072	Yes	2.7 V		CMOS		158	75000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		75000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
APA075-TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3072	Yes	2.7 V		CMOS		107	75000	2.5		2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		75000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	180 MHz	30 s	107	260 °C (500 °F)	20 mm
APA150-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS		100	150000	2.5	Tray	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		150000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	180 MHz	30 s	100	260 °C (500 °F)	13 mm
APA300-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8192	Yes	2.7 V		CMOS		158	300000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		300000 Gates	-55 °C (-67 °F)		Quad	S-PQFP-G208	3	4.1 mm	28 mm	No			180 MHz	30 s	158	245 °C (473 °F)	28 mm
APA450-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	12288	Yes	2.7 V		CMOS		344	450000	2.5		2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		450000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	25 mm	No		e0	180 MHz		344		25 mm
APA600-PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS		158	600000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
AX1000-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	18144	Yes	1.575 V	12096	CMOS		516	1000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.74 ns	12096 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	27 mm	No	1000000 system gates avaiable	e1	870 MHz	30 s	516	250 °C (482 °F)	27 mm
AX2000-1CQ352M	Microchip Technology	FPGA	Military	Flat	352	GQFF	Square	Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class B	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Flatpack, Guard Ring	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.84 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	2000000 system gates avaiable	e0	763 MHz		684		48 mm
AX2000-FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS		684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	21504 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e0	649 MHz		684		31 mm
AX2000-FGG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	21504	CMOS		684	2000000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.99 ns	21504 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No	2000000 system gates avaiable	e1	649 MHz	30 s	684	245 °C (473 °F)	31 mm
EX64-TQG64I	Microchip Technology	FPGA	Industrial	Gull Wing	64	LFQFP	Square	Plastic/Epoxy		Yes	2.7 V	128	CMOS		41	3000	2.5			Flatpack, Low Profile, Fine Pitch	QFP64,.47SQ,20		2.3 V	.5 mm	85 °C (185 °F)		128 CLBS, 3000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.6 mm	10 mm		2000 typical gates available	e3		30 s	41	260 °C (500 °F)	10 mm
M1A3PE3000-1FGG896	Microchip Technology	FPGA	Commercial	Ball	896	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		620	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No		e1	350 MHz	30 s	620	245 °C (473 °F)	31 mm
M1AFS600-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.